Temperature-adaptive short circuit protection for semiconductor switches

1. A method for protecting a semiconductor switch comprising:

receiving a measurement corresponding to an electrical characteristic of the semiconductor switch;

determining a semiconductor switch resistance value using the received measurement;

estimating a junction temperature of the semiconductor switch using the semiconductor switch resistance value;

determining a short circuit voltage threshold using the estimated junction temperature;

comparing the short circuit voltage threshold to a test voltage corresponding to a drain-source voltage of the semiconductor switch;

determining a short circuit condition is occurring in response to comparing the short circuit voltage threshold and the test voltage; and

opening the semiconductor switch in response to determining the short circuit condition is occurring.

2. The method of claim 1 , wherein the semiconductor switch includes a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET) or a gallium nitride (GaN) switch.

3. The method of claim 1 , further comprising:

receiving a current measurement corresponding a current flowing from a drain to a source of the semiconductor switch,

wherein the received measurement is a drain-source voltage measurement,

wherein determining a semiconductor switch resistance value includes using the received current measurement, and

wherein the semiconductor switch resistance value is a forward channel resistance of the semiconductor switch.

4. The method of claim 1 wherein the received measurement is a voltage measurement corresponding to a voltage from a source to a drain of the semiconductor switch during reverse conduction mode, and wherein the semiconductor switch resistance value is a reverse channel resistance.

5. The method of claim 1 wherein estimating the junction temperature includes referencing a lookup table.

6. The method of claim 1 wherein opening the semiconductor switch occurs within 0.25 us of receiving the measurement.

7. The method of claim 1 wherein opening the semiconductor switch occurs within 1 us of receiving the measurement for all operating junction temperatures for the semiconductor switch.

8. The method of claim 1 wherein opening the semiconductor switch occurs within 1 us of receiving the measurement, and wherein the estimated junction temperature corresponds to a low temperature condition.

9. The method of claim 1 comprising operating a control system including a controller and a comparator.

10. The method of claim 1 wherein the semiconductor switch is incorporated into a power converter, wherein the method comprises shutting down the power converter in response to determining the short circuit condition is occurring.

11. A semiconductor control system for a semiconductor switch comprising:

a controller structured to receive a measurement of an electrical characteristic of the semiconductor switch, determine a semiconductor switch resistance value using the received measurement, estimate a junction temperature of the semiconductor switch using the semiconductor switch resistance value, and determine a short circuit voltage threshold using the estimated junction temperature; and

a comparator structured to compare the short circuit voltage threshold to a test voltage corresponding to a drain-source voltage of the semiconductor switch, determine a short circuit condition is occurring in response to comparing the short circuit voltage threshold and the test voltage, and transmit an output signal in response to determining the short circuit condition is occurring before the semiconductor switch is damaged by the short circuit current.

12. The semiconductor control system of claim 11 , wherein the semiconductor switch includes a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET) or a gallium nitride (GaN) switch.

13. The semiconductor control system of claim 11 , wherein the received measurement is a drain-source voltage measurement, and wherein the semiconductor switch resistance value is a forward channel resistance of the semiconductor switch.

14. The semiconductor control system of claim 11 wherein the received measurement is a voltage measurement corresponding to a voltage from a source to a drain of the semiconductor switch during reverse conduction mode, and wherein the semiconductor switch resistance value is a reverse channel resistance.

15. The semiconductor control system of claim 11 wherein estimating the junction temperature includes referencing a lookup table.

16. The semiconductor control system of claim 11 wherein transmitting the output signal is effective to cause a gate driver to open the semiconductor switch.

17. The semiconductor control system of claim 16 wherein opening the semiconductor switch occurs within 0.25 us of receiving the measurement.

18. The semiconductor control system of claim 16 wherein opening the semiconductor switch occurs within 1 us of receiving the measurement for all operating junction temperatures for the semiconductor switch.

19. The semiconductor control system of claim 16 wherein opening the semiconductor switch occurs within 1 us of receiving the measurement, and wherein the estimated junction temperature corresponds to a low temperature condition.

20. The semiconductor control system of claim 11 wherein the semiconductor switch is incorporated into a power converter, and wherein the output signal is effective to shut down the power converter.