Interconnections for a substrate associated with a backside reveal
An apparatus relating generally to a substrate is disclosed. In this apparatus, a post extends from the substrate. The post includes a conductor member. An upper portion of the post extends above an upper surface of the substrate. An exterior surface of the post associated with the upper portion is in contact with a dielectric layer. The dielectric layer is disposed on the upper surface of the substrate and adjacent to the post to provide a dielectric collar for the post. An exterior surface of the dielectric collar is in contact with a conductor layer. The conductor layer is disposed adjacent to the dielectric collar to provide a metal collar for the post, where a top surface of each of the conductor member, the dielectric collar and the metal collar have formed thereon a bond structure for interconnection of the metal collar and the conductor member.
1. An apparatus, comprising:
a post having a conductor member extending from a substrate;
an upper portion of the post extending above an upper surface of the substrate;
a dielectric material structure in contact with an exterior surface portion of the post;
a conductor layer in contact with a portion of the dielectric material structure;
the conductor layer located above the substrate; and
a surface portion of each of the dielectric material structure and the conductor layer aligned to provide a sidewall perpendicular to a plane defined by the upper surface of the substrate to define a recess for receipt of a conductive structure, the conductive structure to provide electrical continuity between the conductor layer and the conductor member within the recess.
2. The apparatus according to claim 1 , wherein the conductive structure is a solder mass.
3. The apparatus according to claim 1 , wherein the dielectric material structure includes a collar.
4. The apparatus according to claim 1 , wherein the surface portion of the conductor member and the conductor layer are vertically offset from one another.
5. The apparatus according to claim 4 , wherein the substrate is a first substrate, and wherein the conductive structure is connected to a second substrate.
6. The apparatus according to claim 5 , wherein the dielectric material structure includes more than one dielectric layer.
7. The apparatus according to claim 5 , wherein the conductive structure is a solder mass.
8. The apparatus according to claim 1 , wherein a portion of the conductor layer is below a top surface of the conductor member.
9. The apparatus according to claim 1 , wherein the conductor layer is a metallic redistribution layer.
10. The apparatus according to claim 1 , wherein the post is of a through substrate layer via.
11. The apparatus according to claim 1 , wherein:
the conductive structure is a solder mass;
the substrate is a first substrate; and
the solder mass is connected between the first substrate and a second substrate for electrical continuity.