Semiconductor device having interconnection structure
A semiconductor device includes a semiconductor pattern on a semiconductor substrate, a three-dimensional memory array on the semiconductor pattern, and a peripheral interconnection structure between the semiconductor pattern and the semiconductor substrate. The peripheral interconnection structure includes an upper interconnection structure on a lower interconnection structure. The upper interconnection structure includes an upper interconnection and an upper barrier layer. The lower interconnection structure includes a lower interconnection and a lower barrier layer. The upper barrier layer is under a bottom surface of the upper interconnection and does not cover side surfaces of the upper interconnection. The lower barrier layer is under a bottom surface of the lower interconnection and covers side surfaces of the lower interconnection.
1. A semiconductor device comprising:
a semiconductor substrate;
a semiconductor pattern on the semiconductor substrate;
a three-dimensional memory array on the semiconductor pattern;
a lower interconnection structure between the semiconductor pattern and the semiconductor substrate, the lower interconnection structure including a lower interconnection;
an intermediate interconnection structure between the semiconductor pattern and the lower interconnection structure, the intermediate interconnection structure including an intermediate interconnection; and
a metal interconnection over the three-dimensional memory array,
wherein side surfaces of the lower interconnection have negative slopes, and side surfaces of the intermediate interconnection have negative slopes,
wherein side surfaces of the metal interconnection have positive slopes.
2. The semiconductor device of claim 1 , wherein an angle between an upper surface of the lower interconnection and each of the side surfaces of the lower interconnection is an acute angle, and
wherein an angle between an upper surface of the intermediate interconnection and each of the side surfaces of the intermediate interconnection is an acute angle.
3. The semiconductor device of claim 2 , wherein an angle between an upper surface of the metal interconnection and each of the side surfaces of the metal interconnection is an obtuse angle.
4. The semiconductor device of claim 1 , wherein a thickness of the intermediate interconnection is greater than a thickness of the lower interconnection.
5. The semiconductor device of claim 1 , wherein the lower interconnection includes a refractory metal having a tensile stress characteristic.
6. The semiconductor device of claim 1 , wherein the intermediate interconnection includes a refractory metal having a tensile stress characteristic.
7. The semiconductor device of claim 1 , wherein
the lower interconnection structure further includes a lower contact plug under the lower interconnection, and
the lower contact plug is integrally formed with the lower interconnection.
8. The semiconductor device of claim 7 , wherein
the intermediate interconnection structure further includes an intermediate contact plug under the intermediate interconnection, and
the intermediate contact plug is integrally formed with the intermediate interconnection, and
wherein a vertical height of the lower contact plug is different from a vertical height of the intermediate contact plug.
9. A semiconductor device comprising:
a semiconductor substrate;
a semiconductor pattern on the semiconductor substrate;
a three-dimensional memory array on the semiconductor pattern;
a lower interconnection structure between the semiconductor pattern and the semiconductor substrate, the lower interconnection structure including a lower interconnection; and
an intermediate interconnection structure between the semiconductor pattern and the lower interconnection structure, the intermediate interconnection structure including an intermediate interconnection,
wherein side surfaces of the lower interconnection have negative slopes, and side surfaces of the intermediate interconnection have negative slopes, and
wherein a thickness of the intermediate interconnection is different from a thickness of the lower interconnection.
10. The semiconductor device of claim 9 , wherein the thickness of the intermediate interconnection is greater than the thickness of the lower interconnection.
11. The semiconductor device of claim 9 , wherein an angle between an upper surface of the lower interconnection and each of the side surfaces of the lower interconnection is an acute angle, and
wherein an angle between an upper surface of the intermediate interconnection and each of the side surfaces of the intermediate interconnection is an acute angle.
12. The semiconductor device of claim 9 , wherein the lower interconnection includes a refractory metal having a tensile stress characteristic.
13. The semiconductor device of claim 9 , wherein the intermediate interconnection includes a refractory metal having a tensile stress characteristic.
14. The semiconductor device of claim 9 , wherein
the lower interconnection structure further includes a lower contact plug under the lower interconnection, and
the lower contact plug is integrally formed with the lower interconnection.
15. The semiconductor device of claim 14 , wherein the lower interconnection structure further includes a lower barrier layer, and
wherein the lower barrier layer is under a bottom surface of the lower interconnection, covers the side surfaces of the lower interconnection, and extends on side surfaces and a bottom surface of the lower contact plug.
16. The semiconductor device of claim 14 , wherein
the intermediate interconnection structure further includes an intermediate contact plug under the intermediate interconnection, and
the intermediate contact plug is integrally formed with the intermediate interconnection, and
wherein a vertical height of the lower contact plug is different from a vertical height of the intermediate contact plug.
17. The semiconductor device of claim 16 , wherein the intermediate interconnection structure further includes an intermediate barrier layer, and
wherein the intermediate barrier layer is under a bottom surface of the intermediate interconnection, covers the side surfaces of the intermediate interconnection, and extends on side surfaces and a bottom surface of the intermediate contact plug.
18. A semiconductor device comprising:
a semiconductor substrate;
a semiconductor pattern on the semiconductor substrate;
a three-dimensional memory array on the semiconductor pattern;
a lower interconnection structure between the semiconductor pattern and the semiconductor substrate, the lower interconnection structure including a lower interconnection; and
a metal interconnection over the three-dimensional memory array,
wherein side surfaces of the lower interconnection have negative slopes, and side surfaces of the metal interconnection have positive slopes.
19. The semiconductor device of claim 18 , wherein an angle between an upper surface of the lower interconnection and each of the side surfaces of the lower interconnection is an acute angle, and
wherein an angle between an upper surface of the metal interconnection and each of the side surfaces of the metal interconnection is an obtuse angle.
20. The semiconductor device of claim 1 , wherein the lower interconnection includes a refractory metal having a tensile stress characteristic.