Imaging device and electronic device
An imaging device having a three-dimensional integration structure is provided. A first structure including a transistor including silicon in an active layer or an active region and a second structure including an oxide semiconductor in an active layer are fabricated. After that, the first and second structures are bonded to each other so that metal layers included in the first and second structures are bonded to each other; thus, an imaging device having a three-dimensional integration structure is formed.
1. An imaging device comprising:
a first metal part and a second metal part in contact with each other, the second metal part provided below the first metal part;
a first conductive layer provided over the first metal part;
a first transistor provided over the first conductive layer;
a photoelectric conversion element provided over the first transistor;
a second conductive layer provided below the second metal part; and
a second transistor provided below the second conductive layer,
wherein the first metal part is in contact with the first conductive layer,
wherein the first conductive layer extends beyond an end of the first metal part,
wherein the photoelectric conversion element is formed in a semiconductor substrate,
wherein a p-type region of the photoelectric conversion element is electrically connected to a third conductive layer below the semiconductor substrate, and
wherein a light-blocking layer provided over the semiconductor substrate overlaps a region where the p-type region is in electrical contact with the third conductive layer.
2. The imaging device according to claim 1 , wherein the first metal part is a same metal element as the second metal part.
3. The imaging device according to claim 1 , further comprising a color filter, and a microlens array over the photoelectric conversion element.
4. The imaging device according to claim 3 , wherein the light-blocking layer is a stack of a metal layer and an anti-reflection film.
5. An imaging device comprising:
a first metal part and a second metal part in contact with each other, the second metal part provided below the first metal part;
a first conductive layer provided over the first metal part;
a first transistor provided over the first conductive layer;
a photoelectric conversion element provided over the first transistor;
a second conductive layer provided below the second metal part; and
a second transistor provided below the second conductive layer,
wherein the first metal part is in contact with the first conductive layer,
wherein the first conductive layer extends beyond an end of the first metal part,
wherein the second metal part is in contact with the second conductive layer,
wherein the second conductive layer extends beyond an end of the second metal part,
wherein the photoelectric conversion element is formed in a semiconductor substrate,
wherein a p-type region of the photoelectric conversion element is electrically connected to a third conductive layer below the semiconductor substrate, and
wherein a light-blocking layer provided over the semiconductor substrate overlaps a region where the p-type region is in electrical contact with the third conductive layer.
6. The imaging device according to claim 5 , wherein the first metal part is a same metal element as the second metal part.
7. The imaging device according to claim 5 , further comprising a color filter, and a microlens array over the photoelectric conversion element.
8. The imaging device according to claim 7 , wherein the light-blocking layer is a stack of a metal layer and an anti-reflection film.
9. An imaging device comprising:
a first metal part and a second metal part in contact with each other, the second metal part provided below the first metal part;
a first transistor provided over the first metal part;
a photoelectric conversion element provided over the first transistor; and
a second transistor provided below the second metal part,
wherein current characteristics of the second transistor is different from current characteristics of the first transistor,
wherein the photoelectric conversion element is formed in a semiconductor substrate,
wherein a p-type region of the photoelectric conversion element is electrically connected to a third conductive layer below the semiconductor substrate, and
wherein a light-blocking layer provided over the semiconductor substrate overlaps a region where the p-type region is in electrical contact with the third conductive layer.
10. The imaging device according to claim 9 , wherein the first metal part is a same metal element as the second metal part.
11. The imaging device according to claim 9 , wherein an off-state current per channel width of the first transistor is lower than an off-state current per channel width of the second transistor.
12. An imaging device comprising:
a first metal part and a second metal part in contact with each other, the second metal part provided below the first metal part;
a first transistor provided over the first metal part;
a photoelectric conversion element provided over the first transistor; and
a second transistor provided below the second metal part,
wherein an on-state current of the second transistor is higher than an on-state current of the first transistor,
wherein the photoelectric conversion element is formed in a semiconductor substrate,
wherein a p-type region of the photoelectric conversion element is electrically connected to a third conductive layer below the semiconductor substrate, and
wherein a light-blocking layer provided over the semiconductor substrate overlaps a region where the p-type region is in electrical contact with the third conductive layer.
13. The imaging device according to claim 12 , wherein the first metal part is a same metal element as the second metal part.
14. The imaging device according to claim 12 , wherein an off-state current per channel width of the first transistor is lower than an off-state current per channel width of the second transistor.