Package assembly for thin wafer shipping and method of use

1. A method comprising:

extending a plurality of straps attached to a bottom surface of a wafer container upward from the bottom surface and around a stack of wafers positioned above the bottom surface;

positioning a lower force distribution plate between a bottom of the stack of wafers and the bottom surface of the wafer container; and

positioning an upper force distribution plate on an uppermost sheet of the stack of wafers,

wherein the straps are extended from the bottom surface of the wafer container over the upper force distribution plate to secure the lower force distribution plate, the stack of wafers and the upper force distribution plate to the bottom surface of the wafer container.

2. The method of claim 1 , wherein the wafer container comprises an electrostatic discharge (ESD) compliant material.

3. The method of claim 1 , wherein the straps are hinged or flexible.

4. The method of claim 3 , wherein each of the plurality of straps is spaced equidistance from one another about the bottom surface.

5. The method of claim 1 , wherein the plurality of straps include tabbed portions.

6. The method of claim 1 , wherein the plurality of straps includes slits.

7. The method of claim 1 , wherein the lower force distribution plate and the upper force distribution plate are structured to:

distribute forces over the stack of wafers within the wafer container; and

contain the stack of wafers as a unit allowing them to move as a unit.

8. The method of claim 1 , further comprising:

placing the wafer container into a shipping container which holds the wafer container;

wherein a lower foam cushion is positioned below the wafer container within the shipping container; and

an upper foam cushion is positioned above the wafer container within the shipping container.

9. The method of claim 8 , wherein straps of the plurality of straps includes three straps spaced equidistance from one another about the bottom surface.

10. The method of claim 8 , wherein the wafer container is sized to fit inside the shipping container.

11. The method of claim 8 , further comprising placing of foam cushioning around a perimeter of the stack of wafers in the shipping container.

12. The method of claim 1 , further comprising placing a cover on the wafer container.

13. A method comprising:

providing a wafer container having a bottom surface and a plurality of straps attached to the bottom surface, wherein the plurality of straps extend upward from the bottom surface and around a stack of wafers positioned above the bottom surface; and

providing at least one force distribution plate positioned in relation to the stack of wafers and within the wafer container,

wherein the at least one force distribution plate comprises:

a lower force distribution plate between a bottom of the stack of wafers and the bottom surface of the wafer container; and

an upper force distribution plate on an uppermost sheet of the stack of wafers, and

wherein the straps extend from the bottom surface of the wafer container over the upper force distribution plate to secure the lower force distribution plate, the stack of wafers and the upper force distribution plate to the bottom surface of the wafer container.

14. The method of claim 13 , wherein the wafer container comprises an electrostatic discharge (ESD) compliant material.

15. The method of claim 13 , wherein the straps are hinged or flexible.

16. The method of claim 15 , wherein each of the plurality of straps is spaced equidistance from one another about the bottom surface.

17. The method of claim 13 , wherein the plurality of straps include tabbed portions.

18. The method of claim 13 , wherein the plurality of straps include slits.