Using a metal-containing layer as an etching stop layer and to pattern source/drain regions of a FinFET
A fin structure of a FinFET device is formed over a substrate. A first layer is formed over the fin structure. A gate layer is formed over the fin structure and over the first layer. The gate layer is patterned into a gate stack that wraps around the fin structure. A second layer is formed over the first layer and over the gate stack. A first etching process is performed to remove portions of the second layer formed over the fin structure, the first layer serves as an etching-stop layer during the first etching process. A second etching process is performed to remove portions of the first layer to expose a portion of the fin structure. A removal of the portions of the first layer does not substantially affect the second layer. A source/drain region is epitaxially grown on the exposed portion of the fin structure.
1. A semiconductor device, comprising:
a fin structure that protrudes out of a substrate;
a source/drain region disposed on a sidewall of an upper portion of the fin structure; and
a metal-containing material disposed on a sidewall of a lower portion of the fin structure.
2. The semiconductor device of claim 1 , wherein the metal-containing material comprises aluminum oxide.
3. The semiconductor device of claim 1 , further comprising: a nitride material disposed on the metal-containing material.
4. The semiconductor device of claim 1 , wherein the source/drain region is a source/drain region of a P-type FinFET.
5. The semiconductor device of claim 4 , wherein the fin structure and the source/drain region each include silicon germanium.
6. The semiconductor device of claim 1 , wherein the metal-containing material is disposed below the source/drain region.
7. The semiconductor device of claim 1 , wherein:
the fin structure is a first fin structure;
the semiconductor device further comprises a second fin structure that is spaced apart from the first fin structure; and
a portion of the metal-containing material is disposed between the first fin structure and the second fin structure.
8. A semiconductor device, comprising:
a fin structure that protrudes out of a substrate, wherein an upper portion of the fin structure includes a recess;
a source/drain region disposed over the fin structure, wherein the source/drain region fills the recess; and
a metal-containing material disposed on a sidewall of a lower portion of the source/drain region, and wherein the metal-containing material is disposed below an upper portion of the source/drain region.
9. The semiconductor device of claim 8 , wherein the metal-containing material comprises aluminum oxide.
10. The semiconductor device of claim 8 , further comprising: a nitride material disposed on the metal-containing material.
11. The semiconductor device of claim 8 , wherein the source/drain region is a source/drain region of an N-type FinFET.
12. The semiconductor device of claim 11 , wherein the fin structure and the source/drain region each include silicon.
13. The semiconductor device of claim 8 , wherein the metal-containing material is disposed below the source/drain region.
14. The semiconductor device of claim 8 , wherein:
the fin structure is a first fin structure;
the semiconductor device further comprises a second fin structure that is spaced apart from the first fin structure; and
a portion of the metal-containing material is disposed between the first fin structure and the second fin structure.
15. A semiconductor device, comprising:
a first fin structure and a second fin structure that each protrude out of a substrate, wherein an upper segment of the second fin structure includes a recess;
a first source/drain region formed on a sidewall of an upper segment the first fin structure;
a first metal-containing material formed on a sidewall of a lower segment of the first fin structure;
a second source/drain region formed on the second fin structure, wherein the second source/drain region fills the recess of the second fin structure; and
a second metal-containing material formed on a sidewall of a lower segment of the second source/drain region, and wherein the second metal-containing material is formed below an upper segment of the second source/drain region.
16. The semiconductor device of claim 15 , wherein the first metal-containing material and the second metal-containing material each comprises aluminum oxide.
17. The semiconductor device of claim 15 , further comprising: a nitride material disposed on the first metal-containing material.
18. The semiconductor device of claim 15 , wherein:
the first source/drain region is a source/drain region of a P-type FinFET; and
the second source/drain region is a source/drain region of an N-type FinFET.
19. The semiconductor device of claim 15 , wherein:
the first metal-containing material is disposed below the first source/drain region; or
the second metal-containing material is disposed below the second source/drain region.
20. The semiconductor device of claim 15 , wherein a shape of the first source/drain region is different from a shape of the second source/drain region.