Semiconductor device and manufacturing method thereof
A semiconductor device with favorable electric characteristics is provided. The semiconductor device includes a first insulating layer, a second insulating layer, an oxide semiconductor layer, and first to third conductive layers. The oxide semiconductor layer includes a region in contact with the first insulating layer, the first conductive layer is connected to the oxide semiconductor layer, and the second conductive layer is connected to the oxide semiconductor layer. The second insulating layer includes a region in contact with the oxide semiconductor layer, and the third conductive layer includes a region in contact with the second insulating layer. The oxide semiconductor layer includes first to third regions. The first region and the second region are separated from each other, and the third region is located between the first region and the second region. The third region and the third conductive layer overlap with each other with the second insulating layer located therebetween. The first region and the second region include a region having a higher carbon concentration than the third region.
1. A semiconductor device comprising:
a first insulating layer;
an oxide semiconductor layer over the first insulating layer;
a source electrode and a drain electrode over the oxide semiconductor layer;
a gate insulating layer over the oxide semiconductor layer;
a gate electrode over the gate insulating layer; and
a second insulating layer over the gate electrode,
wherein upper surfaces of the gate electrode, the source electrode, and the drain electrode are in direct contact with the second insulating layer,
wherein the first insulating layer comprises:
a first region in direct contact with the oxide semiconductor layer; and
a second region in direct contact with the second insulating layer, and
wherein a thickness of the first region of the first insulating layer is larger than a thickness of the second region of the first insulating layer.
2. The semiconductor device according to claim 1 , wherein the second region is adjacent to the first region.
3. The semiconductor device according to claim 1 , wherein in a cross-sectional view in a channel length direction of the oxide semiconductor layer, the oxide semiconductor layer comprises:
a third region in direct contact with the gate insulating layer; and
a fourth region in direct contact with the second insulating layer and adjacent to the third region.
4. The semiconductor device according to claim 3 , wherein a thickness of the third region of the oxide semiconductor layer is larger than a thickness of the fourth region of the oxide semiconductor layer.
5. The semiconductor device according to claim 3 ,
wherein the oxide semiconductor layer further comprises a fifth region in direct contact with one of the source electrode and the drain electrode, and
wherein a thickness of the third region of the oxide semiconductor layer is larger than a thickness of the fifth region of the oxide semiconductor layer.
6. The semiconductor device according to claim 1 , wherein the gate electrode has a stacked-layer structure containing a metal material selected from the group consisting of Al, Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ru, Ag, Mn, Nd, Sc, Ta, and W, and an alloy of any of the group.
7. The semiconductor device according to claim 1 , wherein each of the source electrode and the drain electrode has a stacked-layer structure containing a metal material selected from the group consisting of Al, Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ru, Ag, Mn, Nd, Sc, Ta, and W, and an alloy of any of the group.
8. A semiconductor device comprising:
a first insulating layer;
an oxide semiconductor layer over the first insulating layer;
a source electrode and a drain electrode over the oxide semiconductor layer;
a gate insulating layer over the oxide semiconductor layer;
a gate electrode over the gate insulating layer; and
a second insulating layer over the gate electrode,
wherein upper surfaces of the gate electrode, the source electrode, and the drain electrode are in direct contact with the second insulating layer,
wherein the first insulating layer comprises:
a first region in direct contact with the oxide semiconductor layer; and
a second region in direct contact with the second insulating layer,
wherein a thickness of the first region of the first insulating layer is larger than a thickness of the second region of the first insulating layer, and
wherein in a cross-sectional view in a channel width direction of the oxide semiconductor layer, the gate electrode faces upper and side surfaces of the oxide semiconductor layer with the gate insulating layer provided therebetween.
9. The semiconductor device according to claim 8 , wherein the second region is adjacent to the first region.
10. The semiconductor device according to claim 8 , wherein in a cross-sectional view in a channel length direction of the oxide semiconductor layer, the oxide semiconductor layer comprises:
a third region in direct contact with the gate insulating layer; and
a fourth region in direct contact with the second insulating layer and adjacent to the third region.
11. The semiconductor device according to claim 10 , wherein a thickness of the third region of the oxide semiconductor layer is larger than a thickness of the fourth region of the oxide semiconductor layer.
12. The semiconductor device according to claim 10 ,
wherein the oxide semiconductor layer further comprises a fifth region in direct contact with one of the source electrode and the drain electrode, and
wherein a thickness of the third region of the oxide semiconductor layer is larger than a thickness of the fifth region of the oxide semiconductor layer.
13. The semiconductor device according to claim 8 , wherein the gate electrode has a stacked-layer structure containing a metal material selected from the group consisting of Al, Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ru, Ag, Mn, Nd, Sc, Ta, and W, and an alloy of any of the group.
14. The semiconductor device according to claim 8 , wherein each of the source electrode and the drain electrode has a stacked-layer structure containing a metal material selected from the group consisting of Al, Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ru, Ag, Mn, Nd, Sc, Ta, and W, and an alloy of any of the group.