Hybrid-channel nano-sheet FETS
Semiconductor devices and methods of forming a first layer cap at ends of layers of first channel material in a stack of alternating layers of first channel material and second channel material. A second layer cap is formed at ends of the layers of second channel material. The first layer caps are etched away in a first device region. The second layer caps are etched away in a second device region.
1. A method of forming semiconductor devices:
forming dielectric plugs at exposed ends of first channel material layers in stacks of alternating first channel material layers and second channel material layers, wherein the second channel material layers comprise a different material than the first channel material layers;
forming caps at exposed ends of the second channel material layers, wherein the caps comprise a different material from the dielectric plugs;
etching away the caps in a first device region; and
etching away the dielectric plugs in a second device region.
2. The method of claim 1 , wherein the step of forming caps at exposed ends of the second channel material layers comprises oxidizing the exposed ends of the second channel material layers.
3. The method of claim 1 , wherein the step of forming dielectric plugs at exposed ends of the first channel material layers comprises:
laterally etching the first channel material layers to create cavities;
filling the cavities with a conformal dielectric layer; and
etching to remove the conformal dielectric layer from regions other than the cavities.
4. The method of claim 1 , wherein:
the first channel material layers consist of silicon germanium.
5. The method of claim 4 , wherein:
the second channel material layers consist of silicon.
6. The method of claim 1 , wherein:
the second channel material layers consist of silicon.
7. The method of claim 1 , further comprising:
forming n-type doped first source/drain regions in a first device region; and
forming p-type doped second source/drain regions in a second device region.
8. The method of claim 7 , wherein the n-type doped first source/drain regions extend laterally underneath gate spacers of an n-type field effect transistor and the p-type doped second source/drain regions extend laterally underneath gate spacers of a p-type field effect transistor.
9. The method of claim 1 , further comprising etching away the first channel material layers in the first device region and etching away the second channel material layers in the second device region.
10. The method of claim 9 , further comprising depositing a first work function metal layer around the second channel material layers in the first device region and depositing a second work function metal layer around the first channel material layers in the second device region.
11. A method of forming semiconductor devices, the method comprising:
forming dummy gate structures on stacks of alternating first channel material layers and second channel material layers in a first device region and a second device region, wherein the first channel material layers comprise a first material, and wherein the second channel material layers comprise a second material different than the first material;
in both the first device region and the second device region, etching away material of the stacks of alternating first channel material layers and second channel material layers in areas that are not covered by the dummy gate structures;
in both the first device region and the second device region, laterally etching first channel material layers to create cavities at ends of the first channel material layers;
in both the first device region and the second device region, forming dielectric plugs in the cavities at the ends of the first channel material layers; and
in both the first device region and the second device region, forming caps at exposed ends of the second channel material layers, wherein the caps comprise a different material than the dielectric plugs;
forming n-type doped first source/drain regions in the first device region; and
forming p-type doped second source/drain regions in the second device region.
12. The method of claim 11 , wherein the step of forming caps at exposed ends of the second channel material layers comprises oxidizing the exposed ends of the second channel material layers.
13. The method of claim 11 , wherein the step of forming dielectric plugs in the cavities at the ends of the first channel material layers comprises:
filling the cavities with a conformal dielectric layer; and
etching to remove the conformal dielectric layer from regions other than the cavities.
14. The method of claim 11 , wherein:
the first channel material layers consist of silicon germanium.
15. The method of claim 14 , wherein:
the second channel material layers consist of silicon.
16. The method of claim 11 , wherein:
the second channel material layers consist of silicon.
17. The method of claim 11 , further comprising etching away the first channel material layers in the first device region and etching away the second channel material layers in the second device region.
18. The method of claim 11 , further comprising depositing a first work function metal layer around the second channel material layers in the first device region and depositing a second work function metal layer around the first channel material layers in the second device region.
19. The method of claim 11 , wherein the p-type doped second source/drain regions extend laterally underneath gate spacers of a p-type field effect transistor.
20. The method of claim 19 , wherein the n-type doped first source/drain regions extend laterally underneath gate spacers of an n-type field effect transistor.