IP Library Granted Patent US 11,171,732
Granted Patent B2
US 11,171,732 · App. 16/684,419 · Granted Nov 9, 2021

Ethernet interface and related systems methods and devices

Inventors: Venkat Iyer (Austin, TX); Dixon Chen (Guangdong, CN); John Junling Zang (Guangdong, CN); Shivanand I Akkihal (Austin, TX)
Assignee: Microchip Technology Incorporated
H04J3/062
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Quick Facts
Patent No.
US 11,171,732
App. No.
16/684,419
Granted
Nov 9, 2021
Kind
B2
Abstract

Described is a digital interface and related systems, method and devices. In some embodiments an interface may be an interface between a link layer and a physical transmission medium. The interface may be configured for a bit rate and/or reference clock that limits electromagnetic emissions (EME), for example as compared to a bit rate and/or clock rate specified by interfaces widely used in industry.

Claims (23)

1. A method, comprising:

generating a clock;

generating a divided clock responsive to the clock;

clocking, using the clock, a datapath of an Ethernet physical layer at a first clock rate;

clocking, using the divided clock, a first interface for operatively coupling the Ethernet physical layer with an Ethernet link layer, wherein clocking the first interface comprises clocking the first interface at a second clock rate that is substantially equal to a bit rate of the first interface; and

synchronizing the bit rate and the clock rate of the first interface with a bit rate and a clock rate of a second interface at the Ethernet link layer.

2. The method of claim 1 , wherein generating the clock at a first frequency comprises generating the clock at the first frequency at a crystal oscillator.

3. The method of claim 1 , wherein the second clock rate is substantially 5 megahertz and the first clock rate is substantially 25 megahertz.

4. The method of claim 1 , wherein the second clock rate is substantially 2.5 megahertz and the first clock rate is substantially 25 megahertz.

5. The method of claim 1 , further comprising crossing over from a first clock domain to a second clock domain at the datapath, wherein the first clock domain is associated with the first clock rate and the second clock domain is associated with the second clock rate.

6. The method of claim 1 , further comprising choosing the second clock rate of the first interface responsive to an electromagnetic emissions (EME) limit.

7. A system, comprising:

a datapath of an Ethernet physical layer, the datapath configured for a first clock rate;

a first interface for operatively coupling the Ethernet physical layer to an Ethernet link layer, the first interface configured for a second clock rate that is substantially equal to a bit rate of the first interface;

a clock generator configured to generate a clock for clocking the datapath and for clocking the first interface; and

a harmonizing layer of the Ethernet link layer, the harmonizing layer configured to synchronize the bit rate and the clock rate of the first interface with a bit rate and a clock rate of a second interface.

8. The system of claim 7 , wherein the datapath comprises a clock and data recovery circuitry.

9. The system of claim 7 , further comprising a clocking interface configured to provide a divided clock responsive to the clock.

10. The system of claim 9 , wherein the datapath is configured to cross over from a first clock domain to a second clock domain responsive to one or more control signals received from the clocking interface.

11. The system of claim 10 , wherein the first clock domain is associated with the first clock rate and the second clock domain is associated with the second clock rate.

12. The system of claim 7 , wherein the second clock rate is substantially 5 megahertz and the first clock rate is substantially 25 megahertz.

13. The system of claim 7 , wherein the second clock rate is substantially 2.5 megahertz and the first clock rate is substantially 25 megahertz.

14. The system of claim 7 , wherein the first interface comprises one or more outputs, and an output of the one or more outputs is assigned to a signal for non-exclusive collision avoidance signaling.

Assignments (14)
CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF FIRST INVENTORS NAME PREVIOUSLY RECORDED AT REEL: 0512227 FRAME: 0297. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Feb 22, 2023
From: IYER, VENKATRAMAN; CHEN, DIXON; ZANG, JOHN JUNLING; AKKIHAL, SHIVANAND I.
To: MICROCHIP TECHNOLOGY INCORORATED
Reel/Frame 062835/0497 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059263/0001 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052856/0909 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2019
From: IYER, VENKAT; CHEN, DIXON; ZANG, JOHN JUNLING; AKKIHAL, SHIVANAND I.
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 051227/0297 →