IP Library › Granted Patent US 11,664,249
Granted Patent B2
US 11,664,249 · App. 16/692,152 · Granted May 30, 2023

Substrate processing apparatus, substrate processing method, and recording medium

Inventors: Seiichi Kure (Kumamoto, JP); Ryouichirou Naitou (Kumamoto, JP); Hideo Shite (Kumamoto, JP)
Assignee: TOKYO ELECTRON LIMITED
H01L21/67225G03F7/16G03F7/30H01L21/0274H01L21/31H01L21/6715H01L21/67017H01L21/67069H01L21/67161H01L21/67253
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Quick Facts
Patent No.
US 11,664,249
App. No.
16/692,152
Granted
May 30, 2023
Kind
B2
Abstract

A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.

Claims (31)

1. A method of processing a substrate by a substrate processing apparatus that includes:

a nozzle configured to discharge a processing solution; and

a processing solution supplier configured to supply the processing solution to the nozzle and including:

a tank in which the processing solution is received;

a first conduit configured to guide the processing solution from the tank to the nozzle;

a pump installed in the first conduit;

a filter installed in the first conduit between the tank and the pump, and having a first space defined at a side of the tank, a second space defined at a side of the pump and a filtering member configured to separate between the first space and the second space; and

a plurality of pressure sensors configured to sense an internal pressure of the first space and an internal pressure of the second space,

wherein the method comprises:

performing a first control process to supply the processing solution from the first space to the second space through the filtering member by the pump; and

following the first control process, performing a second control process to direct the processing solution from the second space to the first space through the filtering member by the pump.

2. The method of claim 1 , wherein the second control process is initiated by an increase in a difference between the internal pressure of the first space and the internal pressure of the second space.

3. The method of claim 1 , wherein the second control process includes discharging the process solution, which has been introduced from the second space into the first space through the filtering member, from the first space toward a solution drain pipe when the internal pressure of the first space reaches a predetermined threshold.

4. The method of claim 1 , wherein the substrate processing apparatus further comprises:

a first flow path switching valve installed between the tank and the filter in the first conduit; and

a second flow path switching valve installed in a second conduit.

5. The method of claim 4 , wherein the first control process is performed by controlling:

the first flow path switching valve to be opened; and

the second flow path switching valve to be closed.

6. The method of claim 4 , wherein the second control process is performed by controlling:

the first flow path switching valve to be closed; and

the second flow path switching valve to be closed.

7. The method of claim 1 , wherein the second control process allows particles accumulated at a side of the filtering member in the first space to be separated from the filtering member.

8. The method of claim 1 , wherein the processing solution supplier further includes:

a pressurizer configured to pressurize the processing solution received in the tank toward the pump; and

a second conduit connected between the first space and the second space while bypassing the filtering member, and

wherein the method further comprises, following the second control process, performing a third control process to guide the processing solution pressurized by the pressurizer to the second space through the second conduit so that the processing solution flows from the second space to the first space through the filtering member.

9. The method of claim 8 , wherein the third control process allows the processing solution from the second space to be directed to the first space through the filtering member to open a flow path of the processing solution through the second conduit when the internal pressure of the second space is lower than an internal pressure of the tank.

10. The method of claim 1 , further comprising: before the first control process, performing a fourth control process to supply the processing solution from the second space to the first space through the filtering member by the pump.

11. The method of claim 10 , further comprising: completing the fourth control process by a decrease in a difference between the internal pressure of the first space and the internal pressure of the second space.

12. The method of claim 10 , further comprising: after the fourth control process and before the first control process, performing a fifth control process to supply the processing solution from the first space to the second space through the filtering member by the pump.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE SECOND INVENTOR'S NAME PREVIOUSLY RECORDED ON REEL 051102 FRAME 0718. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF THE ASSIGNOR'S INTEREST. Recorded Mar 5, 2020
From: KURE, SEIICHI; NAITOU, RYOUICHIROU; SHITE, HIDEO
To: TOKYO ELECTRON LIMITED
Reel/Frame 052096/0476 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2019
From: KURE, SEIICHI; NAITOU, RYOUCHIROU; SHITE, HIDEO
To: TOKYO ELECTRON LIMITED
Reel/Frame 051102/0718 →
Priority Claims (1)
JP 2016-162916 · Aug 23, 2016 · national
Continuity (2)
Continuation 15681494 · Aug 21, 2017
Related Publication 20200090967A1 · Mar 19, 2020
Cited By (1)
US 12,365,003