High-aspect ratio electroplated structures and anisotropic electroplating processes
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
1. A device comprising:
a conductive substrate etched or plated to include at least a first set of traces;
a dielectric layer disposed on the conductive substrate, the dielectric layer having a first surface and a second surface;
at least a second set of traces disposed on the first surface of the dielectric layer;
a first metal crown portion formed over at least a portion of each trace of the second set of traces to form a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer; and
a second metal crown portion formed over at least a portion of each trace of the first set of traces to form a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
2. The device of claim 1 comprising a second dielectric layer disposed on the first set of high-aspect ratio electroplated structures.
3. The device of claim 1 comprising a third dielectric layer disposed on the second set of high-aspect ratio electroplated structures.
4. The device of claim 1 , wherein the dielectric layer includes a via to electrically couple at least one high-aspect ratio electrical plated structure of the first set of high-aspect ratio electroplated structures with at least one high-aspect ratio electrical plated structure of the second set of high-aspect ratio electroplated structures.
5. The device of claim 1 , wherein the first set of high-aspect ratio electroplated structures and the second set of high-aspect ratio electroplated structures are configured to form an inductive coupling coil.
6. The device of claim 1 configured to form a coil having two outer coil sections and an inner coil section between the two outer coils.
7. The device of claim 1 comprising a first terminal pad coupled with at least one high-aspect ratio electrical plated structure of the first set of high-aspect ratio electroplated structures.
8. The device of claim 7 , wherein the first terminal pad is a nickel terminal plated with a gold layer.
9. The device of claim 1 , wherein at least a portion of the first set of high-aspect ratio electroplated structures are formed using a crown plating process.
10. The device of claim 1 , wherein the second set of high-aspect ratio electroplated structures are formed by etching the conductive substrate.
11. The device of claim 1 , wherein the first metal crown portion is formed using a crown plating process.
12. A coil comprising:
a conductive substrate etched or plated to include a first plurality of traces;
a dielectric layer disposed on the conductive substrate, the dielectric layer having a first surface and a second surface;
a second plurality of traces disposed on the first surface of the dielectric layer;
a first metal crown portion formed over at least a portion of each trace of the second plurality of traces to form a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer; and
a second metal crown portion formed over at least a portion of each trace of the first plurality of traces to form a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
13. The coil of claim 12 , wherein the dielectric layer includes a via to electrically couple at least one high-aspect ratio electrical plated structure of the first set of high-aspect ratio electroplated structures with at least one high-aspect ratio electrical plated structure of the second set of high-aspect ratio electroplated structures.
14. The coil of claim 12 , wherein the first set of high-aspect ratio electroplated structures and the second set of high-aspect ratio electroplated structures form a first coil section of the coil.
15. The coil of claim 14 comprising a third set of high-aspect ratio electroplated structures and a fourth set of high-aspect ratio electroplated structures form a second coil section of the coil.
16. The coil of claim 15 comprising a fifth set of high-aspect ratio electroplated structures and a sixth set of high-aspect ratio electroplated structures form a third coil section of the coil.
17. The coil of claim 16 , wherein the first coil section is electrically coupled with the second coil section and the third coil section.
18. The coil of claim 16 , wherein the second coil section is electrically coupled with the third coil section.
19. The coil of claim 12 , wherein the second set of high-aspect ratio electroplated structures are formed by etching the conductive substrate.
20. The coil of claim 19 , wherein at least a portion of the second set of high-aspect ratio electroplated structures are formed using a crown plating process.