3D semiconductor processor and memory device and structure
A 3D semiconductor device, the device including: a first level including first single crystal transistors; and a second level including second single crystal transistors, where the first level is overlaid by the second level, where a vertical distance from the first single crystal transistors to the second single crystal transistors is less than four microns, where the first level includes a plurality of processors, and where the second level includes a plurality of memory cells.
1. A 3D semiconductor device, the device comprising:
a first level comprising first single crystal transistors; and
a second level comprising second single crystal transistors,
wherein said first level is overlaid by said second level,
wherein a vertical distance from said first single crystal transistors to said second single crystal transistors is less than four microns,
wherein said first level comprises a plurality of processors, and
wherein said second level comprises a plurality of memory cells.
2. The 3D semiconductor device according to claim 1 ,
wherein at least one of said memory cells is a charge trap type memory cell.
3. The 3D semiconductor device according to claim 1 ,
wherein said second level is a layer transferred and bonded level.
4. The 3D semiconductor device according to claim 1 ,
wherein said second level is customized for a specific application from a generic level.
5. The 3D semiconductor device according to claim 1 , further comprising:
first vertical connections and second vertical connections for connecting said first transistors to said second transistors,
wherein said plurality of processors comprise a first processor and a second processor,
wherein said first processor is connected to said first vertical connections, and
wherein said second processor is connected to said second vertical connections.
6. The 3D semiconductor device according to claim 1 , further comprising:
memory control lines,
wherein each of said plurality of memory cells are controlled directly by at least two of said memory control lines.
7. The 3D semiconductor device according to claim 1 ,
wherein said plurality of processors comprise at least four processors.
8. A 3D semiconductor device, the device comprising:
a first level comprising first single crystal transistors; and
a second level comprising second single crystal transistors,
wherein said first level is overlaid by said second level,
wherein a vertical distance from said first single crystal transistors to said second single crystal transistors is less than four microns,
wherein said first level comprises at least one processor,
wherein said second level comprises a plurality of memory cells, and
wherein at least one of said memory cells is flash type memory cell.
9. The 3D semiconductor device according to claim 8 ,
wherein said first level comprises at least four processors.
10. The 3D semiconductor device according to claim 8 ,
wherein said second level is a layer transferred and bonded level.
11. The 3D semiconductor device according to claim 8 ,
wherein said second level is customized for a specific application from a generic level.
12. The 3D semiconductor device according to claim 8 , further comprising:
first vertical connections and second vertical connections for connecting said first transistors to said second transistors,
wherein said first level comprises at least two processors,
wherein said at least two processors comprise a first processor and a second processor,
wherein said first processor is connected to said first vertical connections, and
wherein said second processor is connected to said second vertical connections.
13. The 3D semiconductor device according to claim 8 , further comprising:
memory control lines,
wherein each of said plurality of memory cells are controlled directly by at least two of said memory control lines.
14. The 3D semiconductor device according to claim 8 ,
wherein said at least one of said memory cells is a charge trap type memory.
15. A 3D semiconductor device, the device comprising:
a first level comprising first single crystal transistors; and
a second level comprising second single crystal transistors,
wherein said first level is overlaid by said second level,
wherein a vertical distance from said first single crystal transistors to said second single crystal transistors is less than four microns,
wherein said first level comprises at least one processor,
wherein said second level comprises a plurality of memory cells, and
wherein said second level is a layer transferred and bonded level.
16. The 3D semiconductor device according to claim 15 ,
wherein at least one of said memory cells is a charge trap type memory cell.
17. The 3D semiconductor device according to claim 15 ,
wherein said first level comprises at least four processors.
18. The 3D semiconductor device according to claim 15 ,
wherein said second level is customized for a specific application from a generic level.
19. The 3D semiconductor device according to claim 15 , further comprising:
first vertical connections and second vertical connections for connecting said first transistors to said second transistors,
wherein said first level comprises at least two processors,
wherein said at least two processors comprise a first processor and a second processor,
wherein said first processor is connected to said first vertical connections, and
wherein said second processor is connected to said second vertical connections.
20. The 3D semiconductor device according to claim 15 , further comprising:
memory control lines,
wherein each of said plurality of memory cells are controlled directly by at least two of said memory control lines.