Packaged semiconductor die with micro-cavity
A packaged electronic die having a micro-cavity and a method for forming a packaged electronic die. The packaged electronic die includes a photoresist frame secured to the electronic die and extending completely around the device. The photoresist frame is further secured to a first major surface of a substrate so as to form an enclosure around the device. Encapsulant material extends over the electronic die and around the sides of the electronic die. The encapsulant material is in contact with the first major surface of the substrate around the entire periphery of the electronic die so as to form a seal around the electronic die.
1. A packaged electronic die comprising:
a substrate;
an electronic die having a device formed thereon;
conductive balls for coupling the device to bonding pads on the substrate;
a first metal region formed on the electronic die, the first metal region extending completely around the device;
a photoresist frame attached to the first metal region and extending completely around the device, the photoresist frame secured to a first major surface of the substrate so as to form an enclosure around the device; and
encapsulant material that extends over the electronic die and around the sides of the electronic die such that the encapsulant material is in contact with the first major surface of the substrate around the entire periphery of the electronic die so as to form a seal around the electronic die.
2. The packaged electronic die of claim 1 further comprising:
a plurality of bonding pads formed on the electronic die,
wherein each of the conductive balls is in contact with one of the bonding pads formed on the electronic die and one of the bonding pads on the substrate.
3. A packaged electronic die comprising:
a substrate;
an electronic die having a device formed thereon;
conductive balls for coupling the device to bonding pads on the substrate;
a first metal region formed on the electronic die, the first metal region extending completely around the device;
a photoresist frame attached to the first metal region and extending completely around the device;
a second metal region disposed over the substrate, the second metal region having a shape corresponding to the shape of the photoresist frame so as to form a landing pad for the photoresist frame, the photoresist frame in direct contact with the second metal region so as to form an enclosure around the device; and
encapsulant material that extends over the electronic die and around the sides of the electronic die such that the encapsulant material is in contact with the first major surface of the substrate around the entire periphery of the electronic die so as to form a seal around the electronic die.
4. A packaged electronic die comprising:
a substrate;
an electronic die having a device formed thereon;
conductive balls for coupling the device to bonding pads on the substrate;
a photoresist frame secured to the electronic die and extending completely around the device;
a metal region disposed over the substrate, the metal region having a shape corresponding to the shape of the photoresist frame so as to form a landing pad for the photoresist frame, the photoresist frame in direct contact with the metal region so as to form an enclosure around the device; and
encapsulant material that extends over the electronic die and around the sides of the electronic die such that the encapsulant material is in contact with the first major surface of the substrate around the entire periphery of the electronic die so as to form a seal around the electronic die.
5. The packaged electronic die of claim 4 wherein the photoresist frame has a height of 16-25 microns.
6. The packaged electronic die of claim 5 wherein the photoresist frame has a width of 15-20 microns.
7. The packaged electronic die of claim 6 wherein the photoresist frame comprises an epoxy-based photoresist.