Granted Patent B2

US 11,049,538 · App. 16/824,814 · Granted Jun 29, 2021

Abstract

Claims (126)

1. A magnetoresistive memory device comprising:

a first electrode;

a second electrode; and

a first layer stack located between the first electrode and the second electrode, the first layer stack comprising:

a free layer;

a reference layer;

an insulating layer located between the free layer and the reference layer;

a ferromagnetic layer; and

an electrically conductive, non-magnetic interlayer exchange coupling layer located between the free layer and the ferromagnetic layer,

wherein:

the free layer comprises a ferromagnetic free layer;

the reference layer comprises a ferromagnetic reference layer;

the insulating layer comprises a tunnel barrier layer;

the ferromagnetic layer comprises a perpendicular magnetic anisotropy (PMA) ferromagnetic layer having a higher PMA than that of the reference layer;

the tunnel barrier layer has a thickness of 1.2 nm or less; and

the non-magnetic interlayer exchange coupling layer has a thickness of 0.1 to 7 nm;

the reference layer has a magnetization direction that is parallel to a magnetization direction of the PMA ferromagnetic layer; and

voltage dependent exchange coupling of a second layer stack comprising the tunnel barrier layer, the free layer, the interlayer exchange coupling layer and the PMA ferromagnetic layer has a positive exchange coupling coefficient.

2. A method of manufacturing the magnetoresistive memory device of claim 1 , in which the reference layer has the magnetization direction that is antiparallel to the magnetization direction of the PMA ferromagnetic layer, the method comprising:

applying external magnetic field in a first direction perpendicular to an interface between the reference layer and the tunnel barrier layer to switch magnetization directions of both the reference layer and the PMA ferromagnetic layer parallel to the first direction.

3. A magnetoresistive memory device comprising:

a first electrode;

a second electrode; and

a first layer stack located between the first electrode and the second electrode, the first layer stack comprising:

a free layer;

a reference layer;

an insulating layer located between the free layer and the reference layer;

a ferromagnetic layer; and

an electrically conductive, non-magnetic interlayer exchange coupling layer located between the free layer and the ferromagnetic layer,

wherein:

the free layer comprises a ferromagnetic free layer;

the reference layer comprises a ferromagnetic reference layer;

the insulating layer comprises a tunnel barrier layer; and

the ferromagnetic layer comprises a perpendicular magnetic anisotropy (PMA) ferromagnetic layer having a higher PMA than that of the reference layer;

the tunnel barrier layer has a thickness of 1.2 nm or less; and

the non-magnetic interlayer exchange coupling layer has a thickness of 0.1 to 7 nm; and

the reference layer has a magnetization direction that is antiparallel to a magnetization direction of the PMA ferromagnetic layer; and

voltage dependent exchange coupling of a second layer stack comprising the tunnel barrier layer, the free layer, the interlayer exchange coupling layer and the PMA ferromagnetic layer has a negative exchange coupling coefficient.

4. A method of manufacturing the magnetoresistive memory device of claim 3 , in which the reference layer has the magnetization direction that is parallel to the magnetization direction of the PMA ferromagnetic layer, the method comprising:

applying a first external magnetic field having a first magnitude in a first direction perpendicular to an interface between the reference layer and the tunnel barrier layer to switch magnetization directions of both the reference layer and the PMA ferromagnetic layer parallel to the first direction; and

then applying a second external magnetic field having a second magnitude lower than the first magnitude in a second direction opposite to the first direction to switch only the magnetization direction of the reference layer parallel to the second direction while the magnetization direction of the PMA ferromagnetic layer remains parallel to the first direction.

5. A magnetoresistive memory device comprising:

a first electrode;

a second electrode; and

a first layer stack located between the first electrode and the second electrode, the first layer stack comprising:

a free layer;

a reference layer;

an insulating layer located between the free layer and the reference layer;

a ferromagnetic layer; and

an electrically conductive, non-magnetic interlayer exchange coupling layer located between the free layer and the ferromagnetic layer,

wherein:

the free layer comprises a ferromagnetic free layer;

the reference layer comprises a ferromagnetic reference layer;

the insulating layer comprises a tunnel barrier layer; and

the ferromagnetic layer comprises a perpendicular magnetic anisotropy (PMA) ferromagnetic layer having a higher PMA than that of the reference layer;

the tunnel barrier layer has a thickness of 1.2 nm or less; and

the non-magnetic interlayer exchange coupling layer has a thickness of 0.1 to 7 nm; and

the electrically conductive, non-magnetic interlayer exchange coupling layer consists essentially of at least one metallic element selected from Au, Cu, Cr, Ru and Al;

the tunnel barrier layer is the only electrically insulating layer located between the first and the second electrodes; and

the tunnel barrier layer consists essentially of magnesium oxide.

6. The magnetoresistive memory device of claim 5 , wherein the PMA ferromagnetic layer comprises a material selected from a FePt alloy, a FePd alloy, a CoPt alloy, a Pt/Co multilayer stack, a Co/Ag multilayer stack, a Co/Cu multilayer stack, a Co/Ni multilayer stack, a (Pt/Co/Pt)/Pd multilayer stack, a (Pt/Co/Pt)/Ag multilayer stack, a (Pt/Co/Pt)/Cu multilayer stack, a (Pt/Co/Pt)/Ni multilayer stack, and a Co/(Pt/Pd) multilayer stack.

7. A magnetoresistive memory device comprising:

a first electrode;

a second electrode;

a first layer stack located between the first electrode and the second electrode, the first layer stack comprising:

a free layer;

a reference layer;

an insulating layer located between the free layer and the reference layer;

a ferromagnetic layer; and

an electrically conductive, non-magnetic interlayer exchange coupling layer located between the free layer and the ferromagnetic layer; and

a synthetic antiferromagnetic structure comprising the reference layer, a fixed ferromagnetic layer having a magnetization that is antiparallel to a reference magnetization of the reference layer, and an antiferromagnetic coupling layer located between the reference layer and the fixed ferromagnetic layer.

8. A magnetoresistive random access memory, comprising:

a two-dimensional array of magnetoresistive memory devices comprising:

a first electrode;

a second electrode; and

a first layer stack located between the first electrode and the second electrode, the first layer stack comprising:

a free layer;

a reference layer;

an insulating layer located between the free layer and the reference layer;

a ferromagnetic layer; and

an electrically conductive, non-magnetic interlayer exchange coupling layer located between the free layer and the ferromagnetic layer;

wherein:

the free layer comprises a ferromagnetic free layer;

the reference layer comprises a ferromagnetic reference layer;

the insulating layer comprises a tunnel barrier layer; and

the ferromagnetic layer comprises a perpendicular magnetic anisotropy (PMA) ferromagnetic layer having a higher PMA than that of the reference layer;

and

word lines electrically connecting a respective subset of the first electrodes of the two-dimensional array;

bit lines electrically connecting a respective subset of the second electrodes of the two-dimensional array; and

a programming and sensing circuitry connected to the bit lines and configured to program the magnetoresistive memory device by a combination of spin transfer torque effect and a voltage-controlled exchange coupling effect, and to read the magnetoresistive memory device by a tunnel magnetoresistance (TMR) effect.

9. A method of operating a magnetoresistive memory device, comprising:

a first electrode;

a second electrode; and

a first layer stack located between the first electrode and the second electrode, the first layer stack comprising:

a free layer;

a reference layer;

an insulating layer located between the free layer and the reference layer;

a ferromagnetic layer; and

an electrically conductive, non-magnetic interlayer exchange coupling layer located between the free layer and the ferromagnetic layer; and

wherein:

the free layer comprises a ferromagnetic free layer;

the reference layer comprises a ferromagnetic reference layer;

the insulating layer comprises a tunnel barrier layer; and

the ferromagnetic layer comprises a perpendicular magnetic anisotropy (PMA) ferromagnetic layer having a higher PMA than that of the reference layer, the method comprising:

programing the magnetoresistive memory device by a combination of spin transfer torque effect and a voltage-controlled exchange coupling effect; and

reading the magnetoresistive memory device by a tunnel magnetoresistance (TMR) effect.

10. The method claim 9 , wherein the programing the magnetoresistive memory device comprises:

applying a first polarity programming voltage to the first electrode relative to the second electrode in a first programming step to switch a magnetization of the free layer from a parallel state to an antiparallel state with respect to a reference magnetization of the reference layer; and

applying a second polarity programming voltage opposite to the first polarity voltage to the first electrode relative to the second electrode in a second programming step to switch the magnetization of the free layer from the antiparallel state to the parallel state with respect to a reference magnetization of the reference layer.

11. The method claim 10 , wherein the reading the magnetoresistive memory device comprises determining a magnitude of a tunneling current through the layer stack without changing a magnetization direction of the free layer.

12. The method claim 10 , wherein:

the reference layer has a magnetization direction that is parallel to a magnetization direction of the PMA ferromagnetic layer;

voltage dependent exchange coupling of a second layer stack comprising the tunnel barrier layer, the free layer, the interlayer exchange coupling layer and the PMA ferromagnetic layer has a positive exchange coupling coefficient;

the first polarity programming voltage comprises a negative voltage; and

the second polarity programming voltage comprises a positive voltage.

13. The method claim 10 , wherein:

the reference layer has a magnetization direction that is antiparallel to a magnetization direction of the PMA ferromagnetic layer;

voltage dependent exchange coupling of a second layer stack comprising the tunnel barrier layer, the free layer, the interlayer exchange coupling layer and the PMA ferromagnetic layer has a negative exchange coupling coefficient;

the first polarity programming voltage comprises a negative voltage; and

the second polarity programming voltage comprises a positive voltage.

14. The method claim 10 , wherein no external magnetic field is applied during the programing the magnetoresistive memory device.

15. The method claim 14 , wherein the programing the magnetoresistive memory device is deterministic.

16. The method claim 9 , wherein:

the electrically conductive, non-magnetic interlayer exchange coupling layer consists essentially of at least one metallic element selected from Au, Cu, Cr, Ru and Al having a thickness of 0.1 to 7 nm; and

the tunnel barrier layer consists essentially of magnesium oxide having thickness of 1.2 nm or less.

17. The method claim 16 , wherein the PMA ferromagnetic layer comprises a material selected from a FePt alloy, a FePd alloy, a CoPt alloy, a Pt/Co multilayer stack, a Co/Ag multilayer stack, a Co/Cu multilayer stack, a Co/Ni multilayer stack, a (Pt/Co/Pt)/Pd multilayer stack, a (Pt/Co/Pt)/Ag multilayer stack, a (Pt/Co/Pt)/Cu multilayer stack, a (Pt/Co/Pt)/Ni multilayer stack, and a Co/(Pt/Pd) multilayer stack.

Assignments (10)