Semiconductor devices having nonlinear bitline structures
Semiconductor devices are provided including a plurality of nonlinear bit lines formed on a substrate including a plurality of active areas; a plurality of word lines that pass through the plurality of active areas; an integral spacer that covers two sidewalls of the plurality of nonlinear bit lines and defines a plurality of spaces that expose two adjacent ones of the plurality of active areas; two conductive patterns that respectively abut on the two adjacent active areas in one of the plurality of spaces that is selected; and a contact separating insulation layer that is formed between the two conductive patterns in the one selected space.
1. A semiconductor device comprising:
a substrate including a first active area, a second active area, and a field area between the first active area and the second active area;
a word line crossing at least one of the first active area and the second active area, the word line comprising a gate electrode that is fully buried in the substrate;
a first bit line structure crossing the first active area and having a first wave shape, the first bit line structure including a first bit line, a first insulation capping line disposed on the first bit line, and a first bit line spacer on a sidewall of each of the first bit line and the first insulation capping line;
a second bit line structure crossing the second active area and having a second wave shape, the second bit line structure including a second bit line, a second insulation capping line disposed on the second bit line, and a second bit line spacer on a sidewall of each of the second bit line and the second insulation capping line, the first bit line spacer and the second bit line spacer facing each other;
a first conductive pattern on the first active area or adjacent to an end portion of the first active area, and a second conductive pattern on the second active area or adjacent to an end portion of the second active area;
a contact separating insulation layer disposed between the first conductive pattern and the second conductive pattern and disposed between the first bit line spacer and the second bit line spacer; and
a capacitor bottom electrode disposed on each of the first conductive pattern and the second conductive pattern,
wherein a top surface of the contact separating insulation layer is substantially coplanar with a top surface of at least one of the first conductive pattern and the second conductive pattern, and substantially coplanar with a top surface of at least one of the first insulation capping line and the second insulation capping line.
2. The semiconductor device of claim 1 , wherein a bottom surface of the contact separating insulation layer is substantially coplanar with a top surface of the field area.
3. The semiconductor device of claim 1 , wherein the contact separating insulation layer, the first bit line spacer, and the second bit line spacer comprise the same material.
4. The semiconductor device of claim 1 , wherein the first conductive pattern and the second conductive pattern are disposed between the first bit line spacer and the second bit line spacer.
5. The semiconductor device of claim 1 , further comprising:
a first direct contact disposed between the first active area and the first bit line; and
a second direct contact disposed between the second active area and the second bit line.
6. A semiconductor device comprising:
a substrate including a first active area, a second active area and a field area between the first active area and the second active area;
a word line crossing at least one of the first active area and the second active area, the word line comprising a gate electrode that is fully buried in the substrate;
a first bit line structure crossing the first active area and having a first wave shape, the first bit line structure including a first bit line, a first insulation capping line disposed on the first bit line, and a first bit line spacer on a sidewall of each of the first bit line and the first insulation capping line;
a second bit line structure crossing the second active area and having a second wave shape, the second bit line structure including a second bit line, a second insulation capping line disposed on the second bit line, and a second bit line spacer on a sidewall of each of the second bit line and the second insulation capping line, the first bit line spacer and the second bit line spacer facing each other;
a first conductive pattern on the first active area or adjacent to an end portion of the first active area, and a second conductive pattern on the second active area or adjacent to an end portion of the second active area, the first conductive pattern and the second conductive pattern being disposed between the first bit line spacer and the second bit line spacer;
a contact separating insulation layer disposed between the first conductive pattern and the second conductive pattern and disposed between the first bit line spacer and the second bit line spacer; and
a capacitor bottom electrode disposed on each of the first conductive pattern and the second conductive pattern,
wherein a top surface of the contact separating insulation layer is substantially coplanar with a top surface of at least one of the first conductive pattern and the second conductive pattern, and is substantially coplanar with a top surface of at least one of the first insulation capping line and the second insulation capping line, and
wherein a bottom surface of the contact separating insulation layer is substantially coplanar with a top surface of the field area.
7. The semiconductor device of claim 6 , wherein the contact separating insulation layer, the first bit line spacer and the second bit line spacer comprise the same material.
8. The semiconductor device of claim 6 , further comprising:
a first direct contact disposed between the first active area and the first bit line; and
a second direct contact disposed between the second active area and the second bit line.