Process variation as die level traceability
Devices, systems and methods for uniquely identifying integrated circuits are provided. For at least one embodiment, an identifiable integrated circuit in a lot of integrated circuits includes a plurality of identifier devices. Each of the identifier devices, when tested, returns a series of first test results that form an analog identifier for the integrated circuit. For one embodiment, the identifier devices is a Zener diode. The test results may be based on reverse breakdown voltage measurements determined prior to packaging of the integrated circuit. Later testing of the integrated circuit returns a second series of reverse breakdown voltage measurements that monotonically vary over time and temperature, as compared to the first series of test results. Such monotonical variation facilitates correlation of the first series of test results with the second series of test results and, thereby, identification of the integrated circuit.
1. An integrated circuit, comprising:
a plurality of identifier devices fabricated onto the integrated circuit;
wherein each of the plurality of identifier devices is a Zener diode, each Zener diode having a characteristic which, when tested, returns an analog test result, and
the analog test result, when in a first series of analog test results, collectively forming a unique first analog identifier for the integrated circuit.
2. The integrated circuit of claim 1 ,
wherein the first series of analog test results form a fingerprint for the integrated circuit.
3. The integrated circuit of claim 2 ,
wherein the fingerprint is stable over time.
4. The integrated circuit of claim 1 ,
wherein the characteristic is a determinable property for each of the plurality of identifier devices.
5. The integrated circuit of claim 4 ,
wherein the determinable property monotonically varies over at least one of time and temperature.
6. The integrated circuit of claim 1 ,
wherein each of the plurality of identifier devices, at a first time, generate the first series of analog test results which monotonically vary from a second series of analog test results obtained from the plurality of identifier devices at a second time.
7. The integrated circuit of claim 6 ,
wherein the first time occurs prior to a commercial release of the integrated circuit; and
wherein the second time occurs after a commercial use of the integrated circuit.
8. The integrated circuit of claim 6 ,
wherein the first time occurs during at least one of a fabrication of the integrated circuit and a post-wafer cutting of a wafer onto which the integrated circuit has been fabricated.
9. The integrated circuit of claim 6 ,
wherein each of the first series of analog test results and the second series of analog test results are respectively obtained based on reverse breakdown voltage measurements for each of the plurality of identifier devices.
10. The integrated circuit of claim 6 ,
wherein the plurality of identifier devices are fabricated so as to facilitate obtaining of:
the first series of analog test results based on a first series of reverse breakdown voltage measurements for the plurality of identifier devices;
a second series of analog test results based on a second series of reverse breakdown voltage measurements for each of the plurality of identifier devices;
wherein the second series of analog test results monotonically vary over time and temperature versus the first series of analog test results; and
wherein a correlation between the first series of analog test results and the second series of analog test results facilitate identification of the integrated circuit.
11. An integrated circuit comprising:
a collection of two or more “n” identifier devices fabricated onto the integrated circuit;
wherein each of the collection of two or more “n” identifier devices is a Zener diode; and
wherein each of the Zener diodes have a characteristic which, when tested, returns an analog test result that, in a series of analog test results for the collection of two or more “n” identifier devices, collectively and uniquely identify the integrated circuit.
12. The integrated circuit of claim 11 ,
wherein “n” is a number of identifier devices needed to provide die level traceability for the integrated circuit.
13. The integrated circuit of claim 11 ,
wherein the collection of two or more “n” identifier devices utilize less than one percent (1%) of a substrate used in forming the integrated circuit.
14. The integrated circuit of claim 11 ,
wherein each of the collection of two or more “n” identifier devices has at least one property that monotonically varies over at least one of time and temperature.
15. An integrated circuit comprising:
a collection of devices fabricated onto the integrated circuit;
wherein each of the collection of devices are Zener diodes that return a test result and,
the collection of devices provide a collection of first test results which form an analog fingerprint for the integrated circuit; and
wherein die level traceability for the integrated circuit is facilitated by a correlation of the collection of first test results with a collection of second test results obtained after use of the integrated circuit.
16. The integrated circuit of claim 15 ,
wherein the collection of second test results monotonically vary over time and temperature versus the collection of first test results.
17. The integrated circuit of claim 15 ,
wherein the collection of devices occupy an insubstantial area of the integrated circuit.
18. The integrated circuit of claim 15 ,
wherein the collection of first test results are based upon a determinable property for each of the collection of devices.
19. The integrated circuit of claim 15 ,
wherein the collection of devices arise in the integrated circuit.