IP Library › Granted Patent US 11,099,476
Granted Patent B2
US 11,099,476 · App. 16/879,889 · Granted Aug 24, 2021

Photomask having a plurality of shielding layers

Inventors: Chih-Chiang Tu (Tauyen, TW); Chun-Lang Chen (Madou Township, TW)
Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
G03F1/26G03F1/54
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Quick Facts
Patent No.
US 11,099,476
App. No.
16/879,889
Granted
Aug 24, 2021
Kind
B2
Abstract

Some embodiments pertain to a photomask for mask patterning. The photomask includes a phase shift layer overlying a transparent layer, a first shielding layer overlying the phase shift layer, and a second shielding layer overlying the first shielding layer. The first shielding layer has a first optical density, and the second shielding layer has a second optical density. The second optical density is less than the first optical density.

Claims (32)

1. A photomask for mask patterning, comprising:

a transparent layer comprising quartz;

a phase shift layer comprising molybdenum silicide (MoSi) overlying the transparent layer; and

an upper shielding layer overlying the phase shift layer, wherein the upper shielding layer comprises chromium and has a thickness of 3 nm to 7 nm.

2. The photomask of claim 1 , further comprising:

a lower shielding layer separating the phase shift layer from the upper shielding layer, wherein the lower shielding layer has a material composition that differs from that of the upper shielding layer.

3. The photomask of claim 2 , wherein the lower shielding layer has a first optical density and the upper shielding layer has a second optical density, wherein the second optical density is less than the first optical density.

4. The photomask of claim 3 , wherein the first optical density is greater than 1 and the second optical density is less than 1.

5. The photomask of claim 2 , wherein the lower shielding layer has a first thickness and the upper shielding layer has a second thickness, the second thickness is less than the first thickness.

6. The photomask of claim 2 , wherein the lower shielding layer and the upper shielding layer have a combined optical density that is at least 1.8.

7. The photomask of claim 1 , wherein the phase shift layer covers some portions of the transparent layer while leaving other portions of the transparent layer uncovered.

8. The photomask of claim 1 , wherein the upper shielding layer covers some portions of the phase shift layer but leaves other portions of the phase shift layer uncovered.

9. The photomask of claim 1 , wherein the upper shielding layer comprises chromium nitride.

10. A photomask for mask patterning, comprising:

a transparent layer comprising quartz;

a phase shift layer overlying the transparent layer;

a first shielding layer overlying the phase shift layer, wherein the first shielding layer has a first thickness; and

a second shielding layer overlying the first shielding layer and having a non-zero second thickness, wherein the second shielding layer comprises chromium and the non-zero second thickness is 7 nm or less.

11. The photomask of claim 10 , wherein the first shielding layer comprises tantalum or boron.

12. The photomask of claim 10 , wherein the phase shift layer covers some portions of the transparent layer while leaving other portions of the transparent layer uncovered.

13. The photomask of claim 10 , wherein the first shielding layer covers some portions of the phase shift layer but leaves other portions of the phase shift layer uncovered.

14. The photomask of claim 10 , wherein the first shielding layer and the second shielding layer collectively have a combined optical density greater than one.

15. The photomask of claim 14 , wherein the combined optical density is approximately 1.8.

16. The photomask of claim 11 , wherein the first shielding layer has a first optical density and the second shielding layer has a second optical density, and wherein the second optical density is less than the first optical density.

17. The photomask of claim 16 , wherein the first optical density is approximately 1.6 and the second optical density is approximately 0.23.

18. The photomask of claim 16 , wherein the first optical density is greater than 1 and the second optical density is less than 1.

19. A photomask for mask patterning, comprising:

a transparent layer comprising quartz;

a phase shift layer comprising molybdenum silicide (MoSi) overlying the transparent layer;

a first shielding layer overlying the phase shift layer, wherein the first shielding layer has a first thickness; and

a second shielding layer overlying the first shielding layer, wherein the second shielding layer comprises chromium and has a second thickness ranging between about one-tenth to about one-third of the first thickness.

20. The photomask of claim 19 , wherein the first shielding layer has a first optical density and the second shielding layer has a second optical density, and wherein the second optical density is less than the first optical density.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2020
From: TU, CHIH-CHIANG; CHEN, CHUN-LANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052721/0397 →
Continuity (4)
Continuation 16153935 · Oct 8, 2018
Continuation 15362089 · Nov 28, 2016
Provisional Application 62321448 · Apr 12, 2016
Related Publication 20200285143A1 · Sep 10, 2020