Semiconductor device package having cover portion with curved surface profile
A packaged semiconductor device includes a substrate, a heat-generating component positioned on a surface of the substrate, an enclosure at least partially surrounding the substrate and the heat-generating component, and a thermal interface material disposed between the heat-generating component and the enclosure. The enclosure includes a cover portion having a convexly curved surface configured to apply a pressure to the thermal interface material. The pressure may be substantially uniform over the area of the thermal interface material, or may be higher at a center of the thermal interface material than at a periphery of the thermal interface material.
1. A solid-state drive, comprising:
a substrate;
a plurality of heat-generating components positioned on a surface of the substrate, each of the heat-generating components including contacts configured to make electrical contact with the substrate;
an enclosure at least partially surrounding the substrate and the plurality of heat-generating components, the enclosure including a cover portion having a plurality of pedestals, each pedestal extending toward a different one of the heat-generating components; and
a plurality of thermal interface materials, each of the plurality of thermal interface materials being disposed between one of the heat-generating components and one of the pedestals,
wherein each of the pedestals includes a convexly curved surface configured to contact and apply a pressure to a different one of the thermal interface materials.
2. The solid-state drive of claim 1 , wherein the convexly curved surface includes, at least partially, a spherically curved surface.
3. The solid-state drive of claim 1 , wherein each of the thermal interface materials is in direct contact with one of the heat-generating components and one of the pedestals.
4. The solid-state drive of claim 1 , wherein the pressure applied to each of the thermal interface materials is higher at a center of each of the thermal interface materials than at an edge of each of the thermal interface materials.
5. The solid-state drive of claim 1 , wherein the plurality of heat-generating components comprises at least one nonvolatile memory component and at least one controller die.
6. The solid-state drive of claim 1 , wherein the plurality of thermal interface materials comprises sheet thermal interface materials.