Granted Patent B2

US 11,579,344 · App. 16/897,531 · Granted Feb 14, 2023

Inventors: Daniel Josell (North Potomac, MD); Thomas Polk Moffat (Gaithersburg, MD)

Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE

G02B5/1852G02B5/1809G02B5/1857

Abstract

Claims (12)

1. A metallic grating comprising:

a substrate;

a plurality of high aspect ratio trenches disposed in the substrate such that the high aspect ratio trenches are spaced apart from one another by a field surface of the substrate;

a metallic superconformal filling formed and disposed in the high aspect ratio trenches; and

a grating comprising a spatial arrangement of the high aspect ratio trenches that are filled with the metallic superconformal filling such that the metallic superconformal filling is void-free, and the high aspect ratio trenches are bottom-up filled with the metallic superconformal filling,

wherein an aspect ratio of the high aspect ratio trenches is from 0.5 to 200, and a height of the high aspect ratio trenches is from 50 nm to 5 mm, and a height of the metallic superconformal filling is less than or equal to the height of the high aspect ratio trenches.

2. The metallic grating of claim 1 , wherein the substrate is electrically conductive.

3. The metallic grating of claim 1 , wherein the substrate comprises silicon and a dopant that provides electrical conductivity to the substrate.

4. The metallic grating of claim 1 , wherein a width of the metallic superconformal filling is from 10 nm to 100 μm.

5. The metallic grating of claim 1 , wherein a length of the metallic superconformal filling is from 0.5 μm to 1 m.

6. The metallic grating of claim 1 , wherein the height of the metallic superconformal filling is from 50 nm to 5 mm.

7. The metallic grating of claim 1 , wherein the metallic superconformal filling consists essentially of gold and bismuth.

Assignments (1)

Continuity (9)

Cited By (1)

US 12,538,714