IP Library Granted Patent US 11,360,923
Granted Patent B2
US 11,360,923 · App. 16/904,808 · Granted Jun 14, 2022

Multi-function SD card

Inventors: Loka Ayyanagouda (Bangalore, IN); Nagarajan Ragupathy (Bangalore, IN)
Assignee: Western Digital Technologies, Inc.
G06F13/4068H05K1/18H05K7/1427H05K2201/10159
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Quick Facts
Patent No.
US 11,360,923
App. No.
16/904,808
Granted
Jun 14, 2022
Kind
B2
Abstract

A multi-memory SD card includes an enclosure having the outer dimensions of a standard SD card. Two separate SiP SD packages are provided along with two separate sets of electrical contacts each according to the SD standard to provide, in a single SD card bundle, the functions and performance of two SD cards. The SiP packages may both be full size SD format, or one may be a micro- or nano- SD card. The first and second SiP SD packages has the same or different capacity and/or speed, and the micro- or nano- SiP package is permanent or removable. An onboard battery and/or PCB may also be housed in the enclosure for configuring WiFi/redundant array of independent disks (RAID) or backup.

Claims (34)

1. An electronic circuit card, comprising:

a flat 32 mm×24 mm×2.1 mm or 15 mm×11 mm×1 mm card-shaped enclosure;

a first set of electronic Secure Digital (SD) memory circuits housed within the enclosure, and including a first set of electrical contacts disposed externally of the enclosure at a first location thereof having a contact pattern;

a second set of electronic SD memory circuits that are separate from the first set of electronic SD memory circuits, and including a second set of electrical contacts distinct from the first set of electrical contacts and disposed externally of the enclosure at a second location thereof; and

wherein the first set of electrical contacts are located at a first end of the enclosure and the second set of electrical contacts are located at an opposite end of the enclosure.

2. The card of claim 1 , wherein the first and second set of electronic SD memory circuits have the same capacity and/or speed.

3. The card of claim 2 , wherein the first and second set of electronic SD memory circuits have different capacities and/or speeds.

4. The card of claim 1 , wherein the enclosure has dimensions of 32 mm×24 mm×2.1 mm.

5. An electronic circuit card, comprising:

a 32 mm×24 mm×2.1 mm or 15 mm×11 mm×1.9 mm card-shaped enclosure;

a first set of electronic Secure Digital (SD) memory circuits housed within the enclosure, and including a first set of electrical contacts disposed externally of the enclosure at a first location thereof having a contact pattern;

a second set of electronic SD memory circuits that are separate from the first set of electronic SD memory circuits, and including a second set of electrical contacts distinct from the first set of electrical contacts and disposed externally of the enclosure at a second location thereof; and

a switch that is operative in a first position to couple the first set of electrical contacts to the first set of electronic SD memory circuits and operative in a second position to couple the first set of electrical contacts to the second set of SD memory circuits.

6. The card of claim 5 including a battery housed within the enclosure.

7. The card of claim 6 including a printed circuit board (PCB) housed within the enclosure.

8. An Secure Digital (SD) card, comprising:

an enclosure having dimensions of 32 mm×24 mm×2.1 mm or 15 mm×11 mm×1.0 mm;

a first SiP package disposed within the enclosure;

a second SiP package carried by the enclosure at a location separate from the first SiP package;

electrical contacts on an outer surface of the enclosure operative to transfer data between the SiP packages and outside of the card through the electrical contacts; and

wherein the electrical contacts include a first set of electrical contacts at a first end of the enclosure communicating with the first SiP package and a second set of electrical contacts at an opposite end of the enclosure communicating with the second SiP package.

9. The SD card of claim 8 , wherein the first SiP package has a first memory capacity and speed and the second SiP package has a second memory capacity that is the same or different than that of the first memory capacity and a second speed that is the same or different than that of the first speed.

10. The SD card of claim 9 , wherein the first SiP package has a predetermined storage capacity and speed and the second SiP package has a lower storage capacity and a higher speed that that of the first SiP package.

11. The SD card of claim 8 , wherein the first set of electrical contacts have rotational symmetry with the second set of electrical contacts.

12. The SD card of claim 8 , wherein at least one of the SiP packages has SLC caching protocol.

13. The SD card of claim 8 , wherein the first SiP package has dimensions of 32 mm×24 mm×2.1 mm.

14. The SD card of 13 , wherein the electrical contacts include a first set of electrical contacts having a first pattern and the second set of electrical contacts have a second pattern that is narrower than the first pattern.

15. The SD card according to 14 , wherein the second SiP package is electrically coupled to the second set of electrical contacts, and including a switch operative in a first position for selectively coupling the first set of electrical contacts to either the first SiP package for transferring data between the first SiP package and outside of the card through the first set of electrical contacts and a second position for selectively coupling the first set of electrical contacts with the second set of electrical contacts for transferring data between the second SiP package and outside of the card through the first set of electrical contacts, and including at least one of a battery and printed circuit board (PCB) within the enclosure.

16. The SD card according to claim 14 , wherein the second SiP package is selectively removable from the enclosure.

17. A multi-memory Secure Digital (SD) card, comprising:

a 32 mm×24 mm×2.1 mm SD card enclosure;

a first SD SiP memory according occupying a first portion of the enclosure and communicating with a first set of external electrical contacts;

a second SD SiP memory occupying a second portion of the enclosure and communicating with a second set of electrical contacts; and

wherein the first set of external electrical contacts are located at a first end of the SD card enclosure and the second set of electrical contacts are located at an opposite end of the SD card enclosure.

Assignments (10)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 053926 FRAME 0446 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058966/0321 →
SECURITY INTEREST Recorded Sep 29, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 053926/0446 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2020
From: AYYANAGOUDA, LOKA; RAGUPATHY, NAGARAJAN
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 053805/0734 →