Temperature controlled substrate carrier and polishing components
Temperature controlled polishing pads are disclosed. In one aspect, a CMP system includes the use of any type of atomizing system to cool or remove energy and/or heat from the polishing pad of a CMP system. The atomizing system can use of any liquid medium in combination of any compressed gas through an orifice to cool or remove the energy and/or heat from the pad, thereby allowing for higher removal rates during CMP.
1. A substrate carrier head, comprising:
a carrier body;
a substrate retainer attached to the carrier body, the substrate retainer comprising an aperture configured to receive a substrate;
a resilient membrane having a first surface configured to contact a surface of the substrate and a second surface opposing the first surface;
a membrane cavity formed along the second surface of the resilient membrane;
an inlet configured to allow liquid to flow into the membrane cavity;
an outlet configured to allow liquid to flow from the membrane cavity;
a regulator upstream of the inlet and configured to regulate a flow-rate of the liquid through the membrane cavity; and
a liquid flow controller including a control processor configured to control the regulator to regulate the flow of the liquid through the membrane cavity during planarization of the substrate such that the flow-rate of the liquid is sufficient through the membrane cavity to adjust a temperature of the substrate during processing of the substrate.
2. The substrate carrier head of claim 1 , wherein the outlet is located at a farther radial position from a center of the carrier body than the inlet.
3. The substrate carrier head of claim 2 , wherein the inlet is located at approximately the center of the carrier body.
4. The substrate carrier head of claim 1 , further comprising:
a secondary resilient membrane having a width that is less than a width of the resilient membrane.
5. The substrate carrier head of claim 1 , further comprising a liquid tight seal between the resilient membrane and the carrier body.
6. The substrate carrier head of claim 1 , wherein the control processor is further configured to control the flow of the liquid to have a sufficient flow-rate through the membrane cavity to remove excess heat generated during the processing of the substrate.
7. The substrate carrier head of claim 1 , further comprising:
a heat exchanger configured to cool the liquid before the liquid is provided to the inlet in order to cool the substrate.
8. The substrate carrier head of claim 1 , further comprising:
a heat exchanger configured to heat the liquid before the liquid is provided to the inlet in order to heat the substrate.
9. A substrate carrier system, comprising:
a substrate carrier head, comprising:
a carrier body;
a substrate retainer attached to the carrier body, the substrate retainer configured to retain a substrate on the carrier body;
a resilient membrane having a first surface configured to contact a surface of the substrate and a second surface opposing the first surface; and
a membrane cavity formed along the second surface of the resilient membrane, the membrane cavity configured to allow a liquid to flow along the second surface;
one or more regulators upstream of the membrane cavity; and
a control system including a control processor configured to control a temperature of the substrate to within a threshold of a target temperature by controlling the one or more regulators to regulate a flow-rate of the liquid through the membrane cavity during processing of the substrate.
10. The substrate carrier system of claim 9 , wherein the substrate carrier head further comprises:
an inlet configured to allow liquid to flow into the membrane cavity; and
an outlet configured to allow liquid to flow from the membrane cavity.
11. The substrate carrier system of claim 10 , wherein the outlet is further configured to recirculate the liquid back into the inlet.
12. The substrate carrier system of claim 10 , wherein the outlet is located at a farther radial position from a center of the carrier body than the inlet.
13. The substrate carrier system of claim 12 , wherein the inlet is located at approximately the center of the carrier body.
14. The substrate carrier system of claim 9 , further comprising:
a heat exchanger configured to cool the liquid below an ambient temperature.
15. The substrate carrier system of claim 9 , further comprising:
a liquid source fluidly connected to the membrane cavity via a first one of the one or more regulators.
16. The substrate carrier system of claim 9 , wherein the substrate carrier head further comprises:
a secondary resilient membrane having a width that is less than a width of the resilient membrane.
17. The substrate carrier system of claim 16 , wherein the resilient membrane is substantially entirely imperforated.
18. The substrate carrier system of claim 9 , further comprising:
a fluid back pressure regulator downstream of the membrane cavity and configured to control a liquid pressure of the liquid within the membrane cavity to control a pressure applied to the substrate during processing of the substrate.
19. The substrate carrier system of claim 9 , further comprising:
a pressure ring configured to form the membrane cavity, the pressure ring including one or more channels through which the liquid flows from a first side of the pressure ring to a second side of the pressure ring.
20. The substrate carrier system of claim 9 , wherein the control system is further configured to: i) measure the flow-rate of the liquid, a pressure of the liquid, and/or a temperature of the liquid, and ii) control the one or more regulators to regulate the flow-rate of the liquid based on the measured flow-rate of the liquid, the measure pressure of the liquid, and/or the measured temperature of the liquid.
21. A method for cooling a substrate during chemical mechanical polishing (CMP) of the substrate, the method comprising:
retaining a substrate within an aperture of a substrate retainer, the substrate retainer attached to a carrier body of a carrier head including a resilient membrane;
supplying a liquid to a membrane cavity within the carrier head, the membrane cavity formed along a surface of the resilient membrane; and
using a regulator located upstream of the membrane cavity to control a flow-rate of the liquid through the membrane cavity during the CMP of the substrate such that the flow-rate of the liquid through the membrane cavity is sufficient to adjust a temperature of the substrate during processing of the substrate.
22. The method of claim 21 , further comprising:
flowing the liquid through an inlet into the membrane cavity; and
flowing the liquid through an outlet from the membrane cavity.
23. The method of claim 22 , further comprising:
recirculating the liquid from the outlet back into the inlet.
24. The method of claim 21 , further comprising:
cooling the liquid below an ambient temperature.