Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame

1. A method for manufacturing a semiconductor device, comprising:

preparing a lead frame comprising an element-mounting region, a first element-supporting portion, a second element-supporting portion, a rectangular region, an outer lead portion having a plurality of outer leads, an inner lead portion having a plurality of inner leads, at least part of the inner leads being routed in the element-mounting region, a first hanging lead, and a second hanging lead;

mounting at least one semiconductor element on an insulation resin sheet on the element-mounting region of the lead frame, the semiconductor element having a first surface mounted on the insulation resin sheet and a second surface including electrode pads;

electrically connecting the inner leads and the electrode pads with metal wires; and

sealing the semiconductor element together with the metal wires by a sealing resin, the sealing resin sealing the rectangular region,

wherein the first element-supporting portion and the second element-supporting portion support the semiconductor element,

wherein the rectangular region has a first long edge side, a second long edge side, a first short edge side and a second short edge side when the semiconductor element is projected from the element-mounting region,

wherein the first hanging lead is provided at the first long edge side of the rectangular region of the lead frame sealed with the sealing resin, and the second hanging lead is provided at the second long edge side of the sealed rectangular region,

wherein a first end of the first hanging lead is connected to the first element-supporting portion, and a second end of the first hanging lead is exposed to a first lateral face of the resin at the first long edge side,

wherein a first end of the second hanging lead is connected to the second element-supporting portion, and a second end of the second hanging lead is exposed to a second lateral face of the resin at the second long edge side,

wherein the plurality of outer leads include first outer leads arranged at the first short edge side of the sealed rectangular region and second outer leads arranged at the second short edge side of the sealed rectangular region,

wherein one ends of the inner leads are arranged at the first long edge side of the sealed rectangular region,

wherein the inner leads include first inner leads electrically connected to the first outer leads, and each of the first inner leads has a first portion extended to the one ends of the inner leads, a second portion extended to the first outer lead, and a third portion between the first portion and the second portion,

extended in a direction which intersects the first and second portions, wherein the inner leads include second inner leads electrically connected to the second outer leads, and each of the second inner leads has a fourth portion extended to the one end of the inner leads, a fifth portion extended to the second outer lead, and a sixth portion between the fourth portion and the fifth portion extended in a direction which intersects the fourth and fifth portions.

2. The manufacturing method according to claim 1 ,

wherein at least one of the first element-supporting portion and the second element-supporting portion has a through hole, and the insulation resin sheet is filled into at least part of gaps between the inner leads located on at least part of the element-mounting region and the through hole.

3. The manufacturing method according to claim 1 ,

wherein at least part of the first element-supporting portion and the second element-supporting portion is provided in a region between the third portion and the sixth portion, and

wherein the insulation resin sheet is filled into a gap between the third portion and a part of the first element-supporting portion and the second element-supporting portion, and a gap between the sixth portion and a part of the first element-supporting portion and the second element-supporting portion.