Wafer aligner
A semiconductor wafer transport apparatus includes a frame, a transport arm movably mounted to the frame and having at least one end effector movably mounted to the arm so the at least one end effector traverses, with the arm as a unit, in a first direction relative to the frame, and traverses linearly, relative to the transport arm, in a second direction, and an edge detection sensor mounted to the transport arm so the edge detection sensor moves with the transport arm as a unit relative to the frame, the edge detection sensor being a common sensor effecting edge detection of each wafer simultaneously supported by the end effector, wherein the edge detection sensor is configured so the edge detection of each wafer is effected by and coincident with the traverse in the second direction of each end effector on the transport arm.
1 . A method of processing a semiconductor wafer, the method comprising:
providing a transport arm movably mounted to a frame;
providing at least one end effector movably mounted to the arm so that the at least one end effector traverses, with the arm as a unit, in a first direction relative to the frame, and traverses linearly, relative to a portion of the transport arm adjacent the end effector, in a second direction different from the first direction; and
sequentially cycling linear traversal of each end effector of the at least one end effector in the second direction so that each wafer of more than one wafers, simultaneously supported by the at least one end effector, are each sequentially shuffled and scanned by a common edge detection sensor, mounted to the transport arm, during the sequential cycling of the linear traversal of each end effector.
2 . The method of claim 1 , wherein scanning by the common edge detection sensor during the sequential shuffle effects on the fly edge detection of each wafer of the more than one wafers simultaneously supported by the at least one end effector where the common edge detection sensor is mounted to the transport arm so that the common edge detection sensor moves with the transport arm as a unit relative to the frame.
3 . The method of claim 1 , further comprising engaging a first wafer with a wafer aligner mounted to the transport arm after completion of the sequential shuffling of the more than one wafers.
4 . The method of claim 1 , wherein the on the fly edge detection of each wafer is effected by and coincident with the traverse in the second direction of each end effector of the at least one end effectors on the transport arm.
5 . The method of claim 1 , further comprising effecting edge detection during the sequential shuffle, by traversing each end effector in the second direction linearly to transport a corresponding wafer, seated on the end effector, of the more than one wafers simultaneously supported by the at least one end effector, relative to the edge detection sensor and scanning the corresponding wafer with the edge detection sensor during linear transport of the corresponding wafer.
6 . The method of claim 5 , further comprising detecting, with the edge detection sensor, an edge of the wafer and identifying therefrom a wafer location and misalignment with respect to a predetermined reference frame.
7 . The method of claim 5 , further comprising effecting wafer alignment of the corresponding wafer seated on the end effector with a wafer aligner mounted to the transport arm where the wafer aligner and the transport arm move as a unit relative to the frame, the aligner being disposed to cooperate with each end effector.
8 . The method of claim 1 , further comprising independently driving each end effector with an independent drive so that each end effector has independent linear traverse in the second direction.
9 . The method of claim 1 , wherein the at least one end effector includes a first end effector and a second end effector, the method further comprising independently driving each of the first end effector and second end effector relative to the transport arm.
10 . A method of processing a semiconductor wafer, the method comprising:
providing a transport arm movably mounted to a frame of a semiconductor wafer transport apparatus, the transport arm having a first end effector and a second end effector movably mounted to the arm so that
the first end effector and second end effector traverse, with the arm as a unit, in a first direction relative to the frame, and
the first end effector and second end effector are independently driven for independent linear traverse, relative to a portion of the transport arm adjacent the end effector, in a second direction different from the first direction; and
effecting edge detection, with an edge detection sensor mounted to the transport arm so that the edge detection sensor moves with the transport arm as a unit relative to the frame, of each wafer of more than one wafers simultaneously supported by the first end effector and second end effector, by and coincident with the traverse in the second direction of each end effector of the first end effector and second end effector on the transport arm.
11 . The method of claim 10 , wherein the traverse of each end effector in the second direction linearly transports a corresponding wafer, seated on a respective end effector, of the more than one wafers simultaneously supported by the first end effector and the second end effector, relative to the edge detection sensor effecting edge detection.
12 . The method of claim 11 , further comprising detecting an edge of the wafer and identifying therefrom a wafer location and misalignment with respect to a predetermined reference frame with the edge detection sensor.
13 . The method of claim 11 , further comprising providing a wafer aligner mounted to the transport arm so that the aligner and the transport arm move as a unit relative to the frame, the aligner being disposed to cooperate with each end effector and effect wafer alignment of the corresponding wafer seated on a respective one of the first end effector and the second end effector.
14 . The method of claim 11 , further comprising cycling, with a controller, a linear traverse of each end effector past the edge detection sensor and effect edge detection of each corresponding wafer.
15 . The method of claim 14 , further comprising sequentially cycling, with the controller, the linear traverse of all end effectors before engaging a first wafer with a wafer aligner mounted to the transport arm.
16 . The method of claim 10 , wherein each end effector has an independent drive configured to effect the independent linear traverse of each end effector in the second direction.
17 . The method of claim 10 , wherein the edge detection is an on the fly edge detection.