Light-emitting device having first to third supports
A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.
1. An electronic device comprising:
a display portion incorporated in a housing,
wherein the display portion comprises:
a light emitting device,
wherein the light-emitting device comprises:
a pixel portion;
a first driving circuit and a second driving circuit electrically connected to the pixel portion; and
a flexible printed circuit,
wherein the pixel portion comprises:
a plurality of pixels;
an organic resin layer over a first support having flexibility;
a transistor over the organic resin layer;
a planarization layer over the transistor and the organic resin layer;
an organic electroluminescence element, electrically connected to the transistor, over the planarization layer; and
a second support having flexibility over the organic electroluminescence element and the planarization layer,
wherein the first driving circuit and the second driving circuit are provided over the organic resin layer,
wherein the first driving circuit is provided in a periphery of the pixel portion,
wherein the pixel portion is provided between the second driving circuit and the first driving circuit,
wherein the organic resin layer has a portion overlapping a third support having flexibility in a region where the organic resin layer extends beyond one end portion of the first support,
wherein the flexible printed circuit has a region overlapping the third support with the organic resin layer provided therebetween, and
wherein the third support comprises a region overlapping with the first support.
2. The electronic device according to claim 1 ,
wherein a neutral plane is positioned in the planarization layer, in the transistor, in the organic electroluminescence element, or near both the transistor and the organic electroluminescence element.
3. The electronic device according to claim 1 ,
wherein a thickness from the first support to a top surface of the planarization layer is 0.8 times or more and 1.2 times or less as large as a thickness from the second support to the top surface.
4. The electronic device according to claim 1 ,
wherein the flexible printed circuit does not comprise a region which is sandwiched between the first support and the second support.
5. An electronic device comprising:
a display portion incorporated in a housing,
wherein the display portion comprises:
a light-emitting device,
wherein the light-emitting device comprises:
a pixel portion;
a first driving circuit and a second driving circuit electrically connected to the pixel portion;
a flexible printed circuit; and
a terminal electrode electrically connected to the pixel portion,
wherein the pixel portion comprises:
an organic resin layer over a first support having flexibility;
a transistor over the organic resin layer;
a planarization layer over the transistor and the organic resin layer;
an organic electroluminescence element, electrically connected to the transistor, over the planarization layer; and
a second support having flexibility over the organic electroluminescence element and the planarization layer,
wherein the first driving circuit and the second driving circuit are provided over the organic resin layer,
wherein the first driving circuit is provided in a periphery of the pixel portion,
wherein the pixel portion is provided between the second driving circuit and the first driving circuit,
wherein the organic resin layer has a portion overlapping a third support having flexibility in a region where the organic resin layer extends beyond one end portion of the first support,
wherein the terminal electrode is provided over the organic resin layer and has a region overlapping the third support with the organic resin layer provided therebetween,
wherein the flexible printed circuit is electrically connected to the terminal electrode and has a region overlapping the third support with the organic resin layer provided therebetween, and
wherein the third support comprises a region overlapping with the first support.
6. The electronic device according to claim 5 ,
wherein a thickness from the first support to a top surface of the planarization layer is 0.8 times or more and 1.2 times or less as large as a thickness from the second support to the top surface.
7. The electronic device according to claim 5 , wherein the flexible printed circuit does not comprise a region which is sandwiched between the first support and the second support.
8. The electronic device according to claim 5 ,
wherein a neutral plane is positioned in the planarization layer, in the transistor, in the organic electroluminescence element, or near both the transistor and the organic electroluminescence element.
9. An electronic device comprising:
a display portion incorporated in a housing,
wherein the display portion comprises:
a light-emitting device,
wherein the light-emitting device comprises:
a pixel portion;
a first driving circuit and a second driving circuit electrically connected to the pixel portion; and
a flexible printed circuit,
wherein the pixel portion comprises:
an organic resin layer over a first support having flexibility;
a transistor over the organic resin layer;
a planarization layer over the transistor and the organic resin layer;
an organic electroluminescence element, electrically connected to the transistor, over the planarization layer; and
a second support having flexibility over the organic electroluminescence element and the planarization layer,
wherein the first driving circuit and the second driving circuit are provided over the organic resin layer,
wherein the first driving circuit is provided in a periphery of the pixel portion,
wherein the pixel portion is provided between the second driving circuit and the first driving circuit,
wherein the organic resin layer has a portion overlapping a third support having flexibility in a region where the organic resin layer extends beyond one end portion of the first support,
wherein the flexible printed circuit has a region overlapping the third support with the organic resin layer provided therebetween, and
wherein the third support comprises a region overlapping with the first support.
10. The electronic device according to claim 9 ,
wherein a thickness from the first support to a top surface of the planarization layer is 0.8 times or more and 1.2 times or less as large as a thickness from the second support to the top surface.
11. The electronic device according to claim 9 , wherein the flexible printed circuit does not comprise a region which is sandwiched between the first support and the second support.
12. The electronic device according to claim 9 ,
wherein a neutral plane is positioned in the planarization layer, in the transistor, in the organic electroluminescence element, or near both the transistor and the organic electroluminescence element.