Tool auto-teach method and apparatus
A substrate transport apparatus auto-teach system for auto-teaching a substrate station location, the system including a frame, a substrate transport connected to the frame, the substrate transport having an end effector configured to support a substrate, and a controller configured to move the substrate transport so that the substrate transport biases the substrate supported on the end effector against a substrate station feature causing a change in eccentricity between the substrate and the end effector, determine the change in eccentricity, and determine the substrate station location based on at least the change in eccentricity between the substrate and the end effector.
1. A process tool comprising:
a frame forming an enclosure arranged to hold a controlled environment therein and having a substrate station located therein and an enclosure feature included in the controlled environment with a predetermined relationship to a substrate station location;
a substrate transport connected to the frame and having an end effector configured to support a substrate; and
a controller communicably connected to the substrate transport and configured to:
move the substrate transport so as to bias the substrate on the end effector on the enclosure feature, and
confirm an eccentricity of the substrate, relative to a coordinate system of the substrate transport, so that a change in eccentricity resolves to an eccentricity determinative of the substrate station location.
2. The process tool of claim 1 , wherein substrate station location is a Z location of the substrate station.
3. The process tool of claim 1 , further comprising a substrate locating unit connected to the frame and including an automatic wafer center (AWC) unit connected to the frame.
4. The process tool of claim 1 , wherein the enclosure feature is located inside a process module having a vacuum pressure environment therein.
5. The process tool of claim 4 , wherein the vacuum pressure environment is a high vacuum.
6. The process tool of claim 4 , wherein the substrate transport biases the substrate supported on the end effector against the enclosure feature in the vacuum pressure environment.
7. The process tool of claim 1 , wherein the enclosure feature is located within a process module that is in a state of process security for processing substrates.
8. The process tool of claim 1 , wherein the controller includes embedded pick/place commands to move the substrate transport and bias the substrate.
9. The process tool of claim 1 , wherein the controller includes embedded substrate locating commands to determine the eccentricity.
10. The process tool of claim 1 , wherein the substrate is a representative teaching or dummy wafer.
11. A method comprising:
providing a frame forming an enclosure arranged to hold a controlled environment therein and having a substrate station located therein and an enclosure feature included in the controlled environment with a predetermined relationship to a substrate station location;
providing a substrate transport connected to the frame and having an end effector configured to support a substrate;
providing a substrate transport apparatus auto-teach system for auto-teaching a substrate station location;
moving, with a controller, the substrate transport so as to bias the substrate on the end effector on the enclosure feature to confirm an eccentricity of the substrate, relative to a coordinate system of the substrate transport, so that a change in eccentricity resolves to an eccentricity determinative of the substrate station location.
12. The process tool of claim 11 , wherein the enclosure feature is located inside a process module having a vacuum pressure environment therein.
13. The process tool of claim 12 , wherein the substrate transport biases the substrate supported on the end effector against the enclosure feature in the vacuum pressure environment.
14. A method comprising:
providing a substrate transport apparatus having an end effector configured to support a substrate;
providing a frame forming an enclosure arranged to hold a controlled environment therein and having at least a first enclosure feature having included in the controlled environment with a predetermined relationship to a substrate station location; and
automatically teaching the substrate station location by determining the substrate holding location with at least one embedded pick/place command from embedded pick/place commands in a controller,
wherein the commanded transport of the substrate transport apparatus, from the at least one embedded pick/place command, effects movement of the end effector so that the substrate supported on the end effector interacts with the at least first enclosure feature causing an eccentricity between the substrate and the end effector through contact with the at least first enclosure feature, wherein a change in eccentricity resolves to an eccentricity determinative of a location of the substrate holding location.
15. The method of claim 14 , wherein the at least first enclosure feature is located inside a process module having a vacuum pressure environment therein.
16. The method of claim 15 , wherein the vacuum pressure environment is a high vacuum.
17. The method of claim 15 , wherein the substrate transport interacts with the substrate supported on the end effector against the at least first enclosure feature in the vacuum pressure environment.
18. The method of claim 14 , further comprising moving the substrate transport and tapping the substrate against the at least first enclosure feature with the embedded pick/place commands.
19. The method of claim 14 , further comprising determining the eccentricity with embedded substrate locating commands of the controller.
20. The method of claim 14 , further comprising providing the frame with a second enclosure feature having a predetermined relationship to the substrate station location.