Printed circuit board and printed circuit board strip
A printed circuit board according to an embodiment comprises: a first insulation layer; a plurality of first cavities formed in the central region of the first insulation layer; a plurality of second cavities formed in the outer region of the first insulation layer, excluding the central region; real dies respectively disposed in the plurality of first cavities; dummy dies respectively disposed in the plurality of second cavities; a second insulation layer formed on the first insulation layer and filling the first cavities and the second cavities; and a third insulation layer disposed beneath the first insulation layer, wherein the real dies comprise substantial driving elements and the dummy dies do not comprise the driving elements.
1. A printed circuit board comprising:
a first insulating layer including a plurality of first cavities formed in a first region and a plurality of second cavities formed in a second region corresponding to an outer region of the first region;
a second insulating layer disposed on an upper surface of the first insulating layer;
a third insulating layer disposed under a lower surface of the first insulating layer,
a first via disposed to penetrate through the third insulating layer;
a first die disposed in each of the plurality of first cavities; and
a second die disposed in each of the plurality of second cavities,
wherein the first die includes;
a first body; and
a driving device disposed on one surface of the first body and including a terminal directly electrically connected to the first via, and
wherein the second die includes a second body and does not include a terminal and a driving device.
2. The printed circuit board of claim 1 , wherein an entire area of the plurality of second cavities is at least 30% of an entire area of the second region of the first insulating layer.
3. The printed circuit board of claim 1 , wherein the second body of the second die is formed of any one of a semiconductor material, a ceramic material, a metal material or an organic/inorganic composite material.
4. The printed circuit board of claim 1 , wherein a height of the second body of the second die is equal to that of the first body of the first die.
5. The printed circuit board of claim 1 , wherein a height of an upper surface of the second body of the second die is equal to that of the upper surface of the first insulating layer.
6. The printed circuit board of claim 1 ,
wherein an upper surface of the second body of the second die is directly in contact with a lower surface of the second insulating layer, and
wherein a lower surface of the second body of the second die is directly in contact with an upper surface of the third insulating layer.
7. The printed circuit board of claim 1 , comprising:
a first circuit pattern disposed on the second die;
a second circuit pattern disposed under the second die; and
a via formed to penetrate through the second die.
8. The printed circuit board of claim 1 ,
wherein the second cavities include:
(2-1)-th cavities disposed in a long-axis direction of the first insulating layer; and
(2-2)-th cavities disposed in a short-axis direction of the first insulating layer, and
wherein a gap between the (2-1)-th cavities is equal to a gap between the plurality of first cavities.
9. The printed circuit board of claim 8 , wherein the gap between the (2-1)-th cavities is less than a gap between the (2-2)-th cavities.
10. A printed circuit board strip comprising:
a frame region located in a first region corresponding to a central region of the printed circuit board strip and including disposed therein a plurality of printed circuit board units in which at least one first die is embedded; and
a dummy region located in a second region corresponding to an outer region of the printed circuit board strip and including a dummy region in which a plurality of second dies is embedded,
wherein the first die includes:
a first body; and
a driving device disposed on one surface of the first body and including a terminal directly electrically connected to the first via, and
wherein the second die includes a second body and does not include a terminal and a driving device.
11. The printed circuit board strip of claim 10 , wherein a plurality of cavities, into which the second die is inserted, is formed in the dummy region, and an entire area of the plurality of cavities occupies 30% or more of an entire area of the dummy region.
12. The printed circuit board strip of claim 10 , wherein the dummy region is a ground region.