Control system for adaptive control of a thermal processing system

1. A thermal processing system comprising:

a processing chamber;

a workpiece support operable to support a workpiece during thermal processing in the processing chamber;

one or more heat sources operable to heat the workpiece in the processing chamber during thermal processing of the workpiece;

one or more sensors configured to obtain data associated with a workpiece temperature; and

a control system configured to perform operations, the operations comprising:

determining an actual workpiece temperature estimate based at least in part on the data associated with a workpiece temperature of a first workpiece during thermal processing of the workpiece;

obtaining a simulated temperature estimate for the first workpiece using a system model, the system model providing the simulated temperature estimate based on one or more model parameters and one or more controller outputs;

adjusting one or more controller parameters of a system controller based at least in part on a difference between the simulated temperature estimate obtained using the system model and a temperature setpoint; and

controlling, by the system controller, one or more operating parameters of the thermal processing system based at least in part on the controller parameters to regulate a workpiece temperature of a second workpiece during thermal processing.

2. The thermal processing system of claim 1 , wherein the controller outputs are clone system controller outputs provided by a clone system controller, the clone system controller mirroring the system controller.

3. The thermal processing system of claim 2 , wherein adjusting one or more controller parameters of a system controller based at least in part on a difference between the simulated temperature estimate obtained using the system model and a temperature setpoint comprises:

receiving a temperature setpoint, wherein the temperature setpoint is a temperature value associated with a temperature setpoint profile;

determining an error value based at least in part on a temperature difference between the temperature setpoint and the simulated temperature estimate;

determining one or more clone controller parameter adjustments for the clone system controller, the one or more clone controller parameter adjustments configured to reduce the error value; and

applying the one or more clone controller parameter adjustments to the clone system controller.

4. The thermal processing system of claim 3 , wherein adjusting one or more controller parameters of a system controller based at least in part on a difference between the simulated temperature estimate obtained using the system model and a temperature setpoint further comprises:

adjusting the one or more controller parameters of the system controller based at least in part on the clone controller parameter adjustments.

5. The thermal processing system of claim 4 , wherein adjusting the one or more controller parameters of the system controller based on the clone controller parameter adjustments occurs when a trigger condition is satisfied.

6. The thermal processing system of claim 5 , wherein the trigger condition comprises reducing an error value between the simulated temperature estimate and the temperature setpoint.

7. The thermal processing system of claim 3 , wherein applying the one or more controller parameter adjustments further comprises:

receiving an adjustment error associated with the one or more controller parameter adjustments;

determining that the adjustment error is based at least in part on the system model;

applying a system model modification to the system model, the system model modification operable to correct the adjustment error.

8. The thermal processing system of claim 1 , comprising storing one or more controller parameter adjustments in a database, the one or more controller parameter adjustments linked in the database to a process recipe or a workpiece type.

9. The thermal processing system of claim 1 , wherein the system model is trained using a learning routine.

10. The thermal processing system claim 9 , wherein the learning routine comprises:

obtaining an actual temperature output from one or more thermal sensors attached to a test workpiece;

obtaining a simulated temperature estimate for the test workpiece using the system model;

modifying one or more model parameters of the system model based on a difference between the actual temperature output and the simulated temperature estimate.

11. The thermal processing system of claim 9 , wherein the learning routine comprises:

obtaining actual workpiece properties of a test workpiece;

obtaining simulated workpiece properties for the test workpiece using the system model;

modifying one or more parameters of the system model based on a difference between the actual workpiece properties and the simulated workpiece properties.

12. The thermal processing system of claim 1 , wherein the system model comprises one or more submodels, the one or more submodels associated with one or more components of the thermal processing system.

13. The thermal processing system of claim 12 , wherein the one or more submodels comprises a workpiece/chamber optical submodel operable to emulate thermal processing system optical outputs.

14. The thermal processing system of claim 12 , wherein the one or more submodels comprises a workpiece/chamber thermal submodel operable to emulate thermal processing system thermal outputs.

15. The thermal processing system of claim 12 , wherein the one or more submodels comprises a workpiece deformation submodel operable to emulate thermal processing system radiometric outputs.

16. A method for controlling a thermal processing system, the method comprising:

obtaining, by a control system of a thermal processing system, data associated with a workpiece temperature;

determining, by the control system, an actual workpiece temperature estimate based at least in part on the data associated with a workpiece temperature of a first workpiece during thermal processing;

obtaining, by the control system, a simulated temperature estimate for the first workpiece using a system model, the system model providing the simulated temperature estimate based on one or more model parameters and one or more controller outputs;

adjusting, by the control system, one or more controller parameters of a system controller based at least in part on a difference between the simulated temperature estimate obtained using the system model and a temperature setpoint; and

controlling, by the control system, one or more operating parameters of the thermal processing system based at least in part on the controller parameters of the system controller to regulate a workpiece temperature of a second workpiece during thermal processing.

17. The method of claim 16 , wherein the controller outputs are clone system controller outputs provided by a clone system controller, the clone system controller mirroring the system controller.

18. The method of claim 17 , wherein adjusting one or more controller parameters of a system controller based at least in part on a difference between the simulated temperature estimate obtained using the system model and a temperature setpoint comprises:

receiving, by the control system, a temperature setpoint, wherein the temperature setpoint is a temperature value associated with a temperature setpoint profile;

determining, by the control system, an error value based at least in part on a temperature difference between the temperature setpoint and the simulated temperature estimate;

determining, by the control system, one or more clone controller parameter adjustments for the clone system controller, the one or more clone controller parameter adjustments configured to reduce the error value; and

applying, by the control system, the one or more clone controller parameter adjustments to the clone system controller.