Side contact pads for high-speed memory card
A memory card includes a memory card body dimensioned to house at least one integrated circuit die package. The memory card body, in certain embodiments, includes a first surface spaced apart from a second surface and a plurality of side surfaces connecting the first surface to the second surface. The memory card also includes a contact pad disposed on at least one side surface of the plurality of side surfaces. The contact pad includes a first conductive layer, a second conductive layer, and an insulating layer disposed between the first conductive layer and the second conductive layer.
1. An apparatus, comprising:
a memory card body dimensioned to house at least one integrated circuit die package, the memory card body comprising a first surface spaced apart from a second surface and a plurality of side surfaces connecting the first surface to the second surface; and
a contact pad disposed on at least one side surface of the plurality of side surfaces, the contact pad comprising:
a first conductive layer, wherein the first conductive layer is disposed on an external surface of the at least one side surface of the memory card body and configured to electrically couple to a memory card reader;
a second conductive layer that is disposed within the memory card body and is electrically coupled to a ground, and wherein the second conductive layer is not electrically coupled with the first conductive layer; and
an insulating layer disposed between the first conductive layer and the second conductive layer.
2. The apparatus of claim 1 , wherein the contact pad comprises a first contact pad and the at least one side surface of the plurality of side surfaces comprises a first side surface, the apparatus further comprising a second contact pad disposed on the first side surface.
3. The apparatus of claim 2 , further comprising:
a third contact pad disposed on a second side surface that is positioned opposite the first side surface; and
a fourth contact pad disposed on the second side surface.
4. The apparatus of claim 3 , wherein the third contact pad is configured to transmit data to a memory card reader.
5. The apparatus of claim 3 , wherein the fourth contact pad is configured to receive data from a memory card reader.
6. The apparatus of claim 3 , further comprising a fifth contact pad disposed on a third side surface.
7. The apparatus of claim 6 , further comprising a sixth contact pad disposed on a fourth side surface that is positioned opposite the third side surface.
8. A system, comprising:
a memory card body comprising a first surface spaced apart from a second surface and a plurality of side surfaces connecting the first surface to the second surface; and
an integrated circuit die package disposed within the memory card body, the integrated circuit die package comprising:
a plurality of contact pads disposed on at least one side surface of the plurality of side surfaces, the contact pad comprising alternating layers of a conductive material and an insulating material, wherein at a first layer of the alternating layers is not electrically coupled to a second conductive layer of the alternating layers, and wherein the second conductive layer is electrically coupled to a ground;
a memory stack comprising a plurality of integrated circuit dies; and
a controller configured to transmit data to and receive data from the plurality of integrated circuit dies.
9. The system of claim 8 , wherein the first layer of the alternating layers is disposed on an external surface of the at least one side surface of the memory card body and configured to electrically couple to a memory card reader.
10. The system of claim 9 , further comprising a third layer of the alternating layers, wherein the third layer is disposed within the memory card body and is configured to insulate the first layer from the second layer of the alternating layers.
11. The system of claim 10 , wherein the second layer is disposed within the memory card body.
12. The system of claim 8 , further comprising a first contact pad and a second contact pad of the plurality of contact pads disposed on a first side surface of the plurality of side surfaces.
13. The system of claim 12 , further comprising a third contact pad and a fourth contact pad of the plurality of contact pads disposed on a second side surface of the plurality of side surfaces.
14. The system of claim 13 , wherein the third contact pad is configured to transmit data to a memory card reader.
15. The system of claim 13 , wherein the fourth contact pad is configured to receive data from a memory card reader.
16. The system of claim 13 , further comprising a fifth contact pad of the plurality of contact pads disposed on a third side surface of the plurality of side surfaces.
17. The system of claim 16 , further comprising a sixth contact pad of the plurality of contact pads disposed on a fourth side surface of the plurality of side surfaces, the fourth side surface positioned opposite the third side surface.
18. An apparatus comprising:
means for housing at least one integrated circuit die package, wherein the means for housing includes a first surface spaced apart from a second surface and a plurality of side surfaces connecting the first surface to the second surface; and
means for electrical communication with a computing device, wherein the means for electrical communication is disposed on at least one side surface of the plurality of side surfaces, the means for electrical communication comprising:
a first conductive layer, wherein the first conductive layer is disposed on an external surface of one of the plurality of side surfaces and is configured to electrically couple to a memory card reader;
a second conductive layer that is disposed within the means for housing and is electrically coupled to a ground, and wherein the second conductive layer is not electrically coupled with the first conductive layer; and
an insulating layer disposed between the first conductive layer and the second conductive layer.