Systems and methods for detecting forcer misalignment in a wafer prober
A system is provided for detecting a forcer misalignment, e.g., due to forcer loss of registration (FLR), in a wafer prober used for electrical testing of a semiconductor wafer. The system includes an optical sensor system including a transmitter and receiver affixed to the forcer or to a reference structure (e.g., the prober platen), and a reflector affixed to the other one of the forcer or reference structure. The transmitter emits radiation toward the reflector, which reflects the radiation toward the receiver. The receiver detects the reflected radiation, and generates an output signal indicating the quantity of received radiation. Alignment monitoring circuitry is configured to identify a misalignment of the forcer relative to the reference structure (e.g., platen) based on the output signal generated by the receiver, and in response, output an alert signal, e.g., to suspend operations of the prober and/or display an error notification to an operator.
1. A system for monitoring a wafer prober used for electrical testing of a semiconductor wafer, the system comprising:
an optical sensor system to monitor an alignment of a forcer of the wafer prober, the forcer being moveably arranged on a platen for commanded linear translational movements of the forcer relative to the platen during a normal operation of the wafer prober; and
the optical sensor system comprising:
a transmitter and a receiver both positionally affixed to one of (a) the forcer or (b) the platen; and
a reflector positionally affixed to the other one of (a) the forcer or (b) the platen;
the transmitter to transmit radiation toward the reflector; and
the receiver to:
receive reflected radiation from the reflector, the reflected radiation comprising at least a portion of the radiation transmitted by the transmitter and reflected by the reflector; and
generate output signal signals indicating the reflected radiation received at the receiver;
alignment monitoring circuitry to:
compare the output signals to at least one threshold value to identify rotational misalignments of the forcer relative to the platen;
wherein a comparison of first output signals associated with the commanded linear translational movements of the forcer relative to the platen to the at least one threshold value do not cause an identification of a forcer misalignment condition; and
wherein a comparison of second output signals associated with a non-commanded rotational movement of the forcer relative to the platen to the at least one threshold value cause an identification of a forcer misalignment condition; and
output an alert signal in response to the identification of the forcer misalignment condition caused by the non-commanded rotational movement of the forcer.
2. The system of claim 1 , wherein the alignment monitoring circuitry to control a display device to display an alert notification in response to the alert signal output by the alignment monitoring circuitry.
3. The system of claim 1 , wherein the alignment monitoring circuitry to suspend an operation of the wafer prober in response to the alert signal output by the alignment monitoring circuitry.
4. The system of claim 1 , wherein:
the wafer prober comprises a chuck assembly to hold the semiconductor wafer; and
the alignment monitoring circuitry to suspend a vertical movement of a chuck operation of the wafer prober in response to the alert signal output by the alignment monitoring circuitry.
5. The system of claim 1 , wherein:
the reflector of the optical sensor system is positionally affixed to the forcer; and
the transmitter and receiver of the optical sensor system are positionally affixed to the platen.
6. The system of claim 1 , wherein:
the reflector of the optical sensor system is positionally affixed to the platen; and
the transmitter and receiver of the optical sensor system are positionally affixed to the forcer.
7. The system of claim 1 , wherein:
the forcer carries a chuck assembly that supports the semiconductor wafer; and
the alignment monitoring circuitry comprises a relay to generate the alert signal as a function of (a) the second output signals generated by the receiver of the optical sensor system and (b) control signals indicating a controlled movement of the forcer or chuck assembly.
8. The system of claim 1 , the transmitter of the optical sensor system to transmit an infrared beam.
9. The system of claim 1 , wherein the transmitter of the optical sensor system comprises a laser diode to emit laser radiation.
10. The system of claim 1 , wherein each of the transmitter and the receiver of the optical sensor system is provided at an end of a respective optical fiber.
11. The system of claim 1 , wherein the reflector comprises a planar mirror or other planar reflector.
12. A method for monitoring a wafer prober used for electrical testing of a semiconductor wafer, the method comprising:
operating the wafer prober for electrical testing of the semiconductor wafer, wherein operating the wafer prober includes performing commanded linear translational movements of a forcer, which supports the semiconductor wafer, relative to a platen to position the semiconductor wafer relative to a testing device for performing electrical tests on the semiconductor wafer;
wherein a transmitter and a receiver of an optical sensor system are positionally affixed to one of the forcer and the platen, and a reflector is positionally affixed to the other of one the forcer and the platen;
during operation of the wafer prober, emitting radiation from the transmitter toward the reflector;
receiving reflected radiation at the receiver, the reflected radiation comprising at least a portion of the radiation transmitted by the transmitter and reflected by the reflector;
generating output signal signals, by the receiver of the optical sensor system, indicating the reflected radiation received at the receiver;
monitoring an alignment of the forcer relative to the platen based on the output signal generated by the receiver of the optical sensor system;
identifying a misalignment of the forcer relative to the platen based on first output signals associated with a non-commanded rotational movement of the forcer relative to the platen, and not identifying a misalignment of the forcer relative to the platen based on second output signals associated with the commanded linear translational movements of the forcer relative to the platen; and
outputting an alert signal in response to identifying the misalignment of the forcer based on the first output signals associated with the non-commanded rotational movement of the forcer relative to the plate.
13. The method of claim 12 , further comprising controlling a display device to display an alert notification in response to the alert signal output by the alignment monitoring circuitry.
14. The method of claim 12 , further comprising automatically suspending an operation of the wafer prober in response to the alert signal output by the alignment monitoring circuitry.
15. The method of claim 12 , wherein the forcer carries a chuck assembly that supports the semiconductor wafer.
16. The method of claim 15 , wherein the method comprises automatically suspending a vertical movement of a chuck operation of the wafer prober in response to the alert signal output by the alignment monitoring circuitry.