Systems and methods for suppressing sound leakage
A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
1. A method, comprising:
providing a speaker including:
a housing;
a transducer residing inside the housing and configured to generate vibrations, the vibrations producing a sound wave inside the housing and causing a leaked sound wave spreading outside the housing;
at least one sound guiding hole located on the housing and configured to guide the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing, the guided sound wave having a phase different from a phase of the leaked sound wave, the guided sound wave interfering with the leaked sound wave in a target region, and the interference reducing a sound pressure level of the leaked sound wave in the target region; and
a headset bracket configured to provide a clamping force between the speaker and a user when the speaker is in contact with the user.
2. The method of claim 1 , wherein the clamping force is in a range of 0.1N-5N.
3. The method of claim 1 , wherein the speaker includes a contact surface configured to contact and transmit vibration to the user, the clamping force between the contact surface and the user being larger than a first threshold and smaller than a second threshold, transmission of a low frequency vibration between the contact surface and the user when the force is at the first threshold being better than transmission of the low frequency vibration between the contact surface and the user when the force is at the second threshold.
4. The method of claim 1 , wherein at least a portion of the headset bracket is made of a memory material.
5. The method of claim 4 , wherein the memory material is at a stress concentration location of the headset bracket.
6. The method of claim 4 , wherein a percentage of the memory material in the headset bracket is not less than 5%.
7. The method of claim 1 , wherein:
the housing includes a bottom or a sidewall; and
the at least one sound guiding hole is located on the bottom or the sidewall of the housing.
8. The method of claim 1 , wherein a location of the at least one sound guiding hole is determined based on at least one of: a vibration frequency of the transducer, a shape of the at least one sound guiding hole, the target region, or a frequency range within which the sound pressure level of the leaked sound wave is to be reduced.
9. The method of claim 1 , wherein the at least one sound guiding hole includes a damping layer, the damping layer being configured to adjust the phase of the guided sound wave in the target region.
10. The method of claim 1 , wherein the guided sound wave includes at least two sound waves having different phases.
11. The method of claim 10 , wherein the at least one sound guiding hole includes two sound guiding holes located on the housing.
12. The method of claim 11 , wherein the two sound guiding holes are arranged to generate the at least two sound waves having different phases to reduce the sound pressure level of the leaked sound wave having different wavelengths.
13. The method of claim 1 , wherein at least a portion of the leaked sound wave whose sound pressure level is reduced is within a range of 1500 Hz to 3000 Hz.
14. The method of claim 13 , wherein the sound pressure level of the at least a portion of the leaked sound wave is reduced by more than 10 dB on average.
15. The method of claim 1 , wherein at least a portion of the leaked sound wave whose sound pressure level is reduced is within a range of 2000 Hz to 2500 Hz.
16. The method of claim 15 , wherein the sound pressure level of the at least a portion of the leaked sound wave is reduced by more than 20 dB on average.
17. A speaker, comprising:
a housing;
a transducer residing inside the housing and configured to generate vibrations, the vibrations producing a sound wave inside the housing and causing a leaked sound wave spreading outside the housing;
at least one sound guiding hole located on the housing and configured to guide the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing, the guided sound wave having a phase different from a phase of the leaked sound wave, the guided sound wave interfering with the leaked sound wave in a target region, and the interference reducing a sound pressure level of the leaked sound wave in the target region; and
a headset bracket configured to provide a clamping force between the speaker and a user when the speaker is in contact with the user.
18. The speaker of claim 17 , wherein the clamping force is in a range of 0.1N-5N.
19. The speaker of claim 17 , wherein the speaker includes a contact surface configured to contact and transmit vibration to the user, the clamping force between the contact surface and the user being larger than a first threshold and smaller than a second threshold, transmission of a low frequency vibration between the contact surface and the user when the force is at the first threshold being better than transmission of the low frequency vibration between the contact surface and the user when the force is at the second threshold.
20. The speaker of claim 17 , wherein at least a portion of the headset bracket is made of a memory material.