Thin-film resistor (TFR) with improved contacts
A thin film resistor (TFR) module is formed in an integrated circuit device. The TFR module includes a TFR element connected between first and second vertically-extending TFR side contacts. The TFR element includes a base portion extending laterally between the TFR side contacts, and first and second TFR element end flanges projecting vertically from opposing ends of the base portion. The first TFR element end flange is formed on a sidewall of the first TFR side contact, and the second TFR element end flange is formed on a sidewall of the second TFR side contact. A first TFR head contacts the first TFR side contact and a top of the first TFR element end flange, and a second TFR head contacts the second TFR side contact and a top of the second TFR element end flange, thus defining two parallel conductive paths between the TFR element and each TFR head.
1. A method of forming a thin film resistor (TFR) module in an integrated circuit (IC) structure, the method comprising:
forming first and second vertically-extending TFR side contacts spaced apart from each other in a dielectric region;
after forming the first and second vertically-extending TFR side contacts, forming a TFR element between the first and second vertically-extending TFR side contacts, including:
etching a TFR opening in the dielectric region between the first and second vertically-extending TFR side contacts, wherein a pair of opposing sides of the TFR opening are defined by opposing exposed sidewall surfaces of the first and second vertically-extending TFR side contacts, and wherein a length of the TFR opening is defined by a lateral distance between the opposing exposed sidewall surfaces of the first and second vertically-extending TFR side contacts;
depositing a TFR film directly over the dielectric region and extending into the TFR opening; and
removing upper portions of the TFR film to expose respective top surfaces of the first and second vertically-extending TFR side contacts;
the TFR element including:
a laterally-extending TFR element base extending from a first end proximate the first vertically-extending TFR side contact to a second end proximate the second vertically-extending TFR side contact;
a first TFR element end flange projecting vertically from the first end of the TFR element base, the first TFR element end flange extending parallel to, and in contact with, the sidewall surface of the first vertically-extending TFR side contact, wherein a top surface of the first TFR element end flange is flush with the top surface of the first vertically-extending TFR side contact; and
a second TFR element end flange projecting vertically from the second end of the TFR element base, the second TFR element end flange extending parallel to, and in contact with the sidewall surface of the second vertically-extending TFR side contact, wherein a top surface of the second TFR element end flange is flush with the top surface of the second vertically-extending TFR side contact; and
forming a first TFR head in contact with both the top surface of the first vertically extending TFR side contact and the top surface of the first TFR element end flange, and a second TFR head in contact with both the top surface of the second vertically-extending TFR side contact and the top surface of the second TFR element end flange.
2. The method of claim 1 , wherein the TFR element comprises SiCr, SiCCr, NiCr, or TaN.
3. The method of claim 1 , wherein:
the first TFR head is formed such that a bottom surface of the first TFR head is in contact with both the top surface of the first vertically-extending TFR side contact and the top surface of the first TFR element end flange; and
the second TFR head is formed such that a bottom surface of the second TFR head is in contact with both the top surface of the second vertically-extending TFR side contact and the top surface of the second TFR element end flange.
4. The method of claim 1 , wherein:
the first TFR head is formed such that a bottom surface of the first TFR head is in contact with both (a) the first vertically-extending TFR side contact and (b) the first TFR element end flange; and
the second TFR head is formed such that a bottom surface of the second TFR head is in contact with both (a) the second vertically-extending TFR side contact and (b) the vertically-extending second TFR element end flange.
5. The method of claim 1 , wherein forming the TFR element further comprises:
forming TFR element side flanges projecting vertically from the TFR element base and extending between the first and second TFR element end flanges; and
removing at least a partial height of the TFR element side flanges.
6. The method of claim 5 , further comprising performing a metal etch to both (a) define the first and second TFR heads and (b) remove the at least partial height of the TFR element side flanges.
7. The method of claim 1 , wherein forming the first and second vertically-extending TFR side contacts comprises:
forming first and second elongated via openings; and
filling the first and second elongated via openings with metal.
8. The method of claim 1 , wherein the deposited TFR film includes:
(a) a first TFR film portion covering a top surface of the dielectric region and extending between the first and second vertically-extending TFR side contacts, the first TFR film portion defining the laterally-extending TFR element base;
(b) a second TFR film portion covering the exposed sidewall surface of the first vertically-extending TFR side contact, the second TFR film portion defining the first TFR element end flange; and
(c) a third TFR film portion covering the exposed sidewall surface of the second vertically-extending TFR side contact, the third TFR film portion defining the second TFR element end flange.
9. A method of forming an integrated circuit (IC) device including a thin film resistor (TFR) module and an interconnect structure, the method comprising:
concurrently forming (a) a via and (b) first and second vertically-extending TFR side contacts in a dielectric region;
after forming the via and the first and second vertically-extending TFR side contacts, forming a TFR element between the first and second vertically-extending TFR side contacts, including:
etching a TFR opening in the dielectric region between the first and second vertically-extending TFR side contacts, wherein a pair of opposing sides of the TFR opening are defined by opposing exposed sidewall surfaces of the first and second vertically-extending TFR side contacts, wherein a length of the TFR opening is defined by a lateral distance between the opposing exposed sidewall surfaces of the first and second vertically-extending TFR side contacts;
depositing a TFR film directly over the dielectric region and extending into the TFR opening; and
removing upper portions of the TFR film to expose the respective top surfaces of the first and second vertically-extending TFR side contacts;
the TFR element including:
a laterally-extending TFR element base extending from a first end proximate the first vertically-extending TFR side contact to a second end proximate the second vertically-extending TFR side contact;
a first TFR element end flange projecting vertically from the first end of the TFR element base, the first TFR element end flange extending parallel to, and in contact with, the exposed sidewall surface of the first vertically-extending TFR side contact; and
a second TFR element end flange projecting vertically from the second end of the TFR element base, the second TFR element end flange extending parallel to, and in contact with, the exposed sidewall surface of the second vertically-extending TFR side contact; and
concurrently forming (a) a metal line in contact with the via, (b) a first TFR head having a bottom surface in contact with both the first vertically-extending TFR side contact and the first TFR element end flange, and (c) a second TFR head having a bottom surface in contact with both the second vertically-extending TFR side contact and the second TFR element end flange.
10. The method of claim 9 , wherein each of the first and second vertically-extending TFR side contacts comprises an elongated metal via.
11. The method of claim 9 , wherein each of the first and second vertically-extending TFR side contacts has a TFR side contact width in a first lateral direction equal to a width of the via, and a TFR side contact length in a second lateral direction, the TFR side contact length at least twice as large as the TFR side contact width.
12. The method of claim 9 , wherein forming the TFR element further comprises:
forming TFR element side flanges projecting vertically from the TFR element base and extending between the first and second TFR element end flanges; and
removing at least a partial height of the TFR element side flanges.
13. The method of claim 12 , comprising performing a metal etch to (a) form the metal line in contact with the via, (b) form the first and second TFR heads and (c) remove the at least partial height of the TFR element side flanges.