Burn-in board including strip socket with integrated heating for high volume burn-in of semiconductor devices
A burn-in board for burn-in testing of semiconductor devices includes a strip socket mounted to a PCB. The strip socket includes a socket base configured to receive a device strip including an array of semiconductor devices, and a socket lid including at least one heating block. The socket lid is movable moved between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the socket lid including the heating block(s) is closed down on the mounted device strip. The strip socket includes conductive contacts configured to contact individual semiconductor devices on the device strip to allow selective monitoring of individual semiconductor devices during a burn-in test process. The burn-in board may also include heating control circuitry to control the heating block(s) during the burn-in test process.
1. A burn-in board for burn-in testing of devices, the device comprising:
a printed circuit board (PCB);
a strip socket mounted to the PCB, the strip socket including:
a socket base configured to receive a device strip including an array of devices mounted on a device strip substrate;
a socket lid;
at least one heating block associated with the socket lid;
wherein the socket lid is movable between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the mounted device strip is arranged between the socket lid and socket base; and
an array of conductive contacts, each configured to contact a respective device in the array of devices,
heating control circuitry configured to control the at least one heating block to provide heat to the device strip; and
burn-in test circuitry connected to the conductive contacts for communicating input test signals to individual devices of the array of devices on the device strip and output test signals from the individual devices.
2. The burn-in board of claim 1 , wherein the at least one heating block is integrated in, or mounted to, the socket lid.
3. The burn-in board of claim 1 , wherein:
the socket base includes a contactor plate configured to support the device strip, the contactor plate including an array of device contact holes; and
in the closed position of the socket lid, the conductive contacts project through the array of device contact holes in the contactor plate and into contact with individual devices on the device strip.
4. The burn-in board of claim 1 , wherein:
the device strip includes multiple device panels, each device panel including multiple devices;
the strip socket includes multiple sections, each corresponding with a respective device panel on the device strip; and
the at least one heating block comprises multiple heating blocks, each arranged for heating a respective device panel on the device strip.
5. The burn-in board of claim 4 , wherein the multiple heating blocks are independently controllable to provide independent temperature control of each of the multiple device panels on the device strip.
6. The burn-in board of claim 1 , further comprising:
a multiplexer connected to a plurality of conductive contacts in the array of conductive contacts, the plurality of conductive contacts configured to contact a corresponding plurality of devices in the array of devices;
a multiplexer control circuitry configured to control the multiplexer to selectively receive signals from each device in the plurality of devices via a respective conductive contact of the plurality of conductive contacts.
7. The burn-in board of claim 1 , comprising a multiplexer system including:
a performance signal multiplexer connected to a first subset of conductive contacts in the array of conductive contacts;
a power signal multiplexer connected to a second subset of conductive contacts in the array of conductive contacts; and
multi-signal-type multiplexer control circuitry configured to control the performance signal multiplexer and the power signal multiplexer to selectively monitor device performance signals and power signals from individual devices in the array of devices.
8. A strip socket for burn-in testing of an array of devices provided on a device strip, wherein the strip socket comprises:
a socket base configured to receive the device strip including the array of devices, the socket base including a contactor plate configured to support the device strip, the contactor plate including an array of contact holes;
an array of conductive contacts;
a socket lid;
at least one heating block associated with the socket lid;
wherein the socket lid is movable between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the mounted device strip is arranged between the socket lid and socket base; and
wherein in the closed position of the socket lid, respective conductive contacts in the array of conductive contacts project through respective contact holes in the array of contact holes in the contactor plate to come into contact with respective devices in the array of devices on the device strip.
9. The burn-in board of claim 8 , wherein the at least one heating block is integrated in, or mounted to, the socket lid.
10. The burn-in board of claim 8 , wherein in the closed position of the socket lid, the mounted device strip is physically compressed between the socket lid and the socket base to bring the conductive contacts into contact with respective devices in the array of devices on the device strip.
11. The burn-in board of claim 8 , wherein:
the device strip includes multiple device panels, each including multiple devices;
the strip socket includes multiple sections, each corresponding with a respective device panel on the device strip; and
the at least one heating block comprises multiple heating blocks, each arranged for heating a respective device panel on the device strip.
12. The burn-in board of claim 11 , wherein the multiple heating blocks are independently controllable to provide independent temperature control of each of the multiple device panels on the device strip.
13. A system for burn-in testing of devices
a burn-in test machine; and
a burn-in board comprising:
a printed circuit board (PCB);
a strip socket mounted to the PCB, the strip socket including:
a socket base configured to receive a device strip including an array of devices mounted on a device strip substrate;
a socket lid;
at least one heating block associated with the socket lid;
wherein the socket lid is movable between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the mounted device strip is arranged between the socket lid and socket base;
an array of conductive contacts, each configured to contact a respective device in the array of devices; and
a connection interface connected to the array of conductive contacts;
heating control circuitry configured to control the at least one heating block to provide heat to the device strip; and
wherein the burn-in test machine is configured to:
supply input test signals to individual devices on the device strip via the connection interface and the conductive contacts of the strip socket; and
receive output test signals from the individual devices via the conductive contacts and connection interface of the strip socket.
14. The system of claim 13 , wherein the burn-in test machine comprises a test bench.
15. The system of claim 13 , wherein the burn-in test machine comprises a burn-in oven machine.
16. The system of claim 13 , wherein the at least one heating block is integrated in, or mounted to, the socket lid.
17. The system of claim 13 , wherein in the closed position of the socket lid, the mounted device strip is physically compressed between the socket lid and the socket base to bring the conductive contacts into contact with the individual devices on the device strip.
18. The system of claim 13 , wherein:
the device strip includes multiple device panels, each including multiple devices;
the strip socket includes multiple sections, each corresponding with a respective device panel on the device strip; and
the at least one heating block comprises multiple heating blocks, each arranged for heating a respective device panel on the device strip;
wherein the multiple heating blocks are independently controllable to provide independent temperature control of each of the multiple device panels on the device strip.
19. The system of claim 13 , wherein the burn-in test electronics include:
electrical fault detection circuitry configured to detect an electrical fault associated with each individual device; and
device performance monitoring circuitry configured to measure an operational performance of each individual device.
20. A strip socket for burn-in testing of an array of devices provided on a device strip including multiple device panels, wherein respective device panels include respective devices in the array of devices, wherein the strip socket comprises:
a socket base configured to receive the device strip including the array of devices;
a socket lid;
multiple heating blocks associated with the socket lid, wherein respective ones of the multiple heating blocks are arranged for heating respective ones of the multiple device panels on the device strip;
wherein the socket lid is movable between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the mounted device strip is arranged between the socket lid and socket base; and
an array of conductive contacts arranged to contact respective devices in the array of devices.
21. The burn-in board of claim 20 , wherein the multiple heating blocks are independently controllable to provide independent temperature control of the respective device panels of the multiple device panels.