IP Library Granted Patent US 11,778,748
Granted Patent B2
US 11,778,748 · App. 17/180,067 · Granted Oct 3, 2023

Connector for printed circuit board (PCB) memory drive

Inventors: Uthayarajan A/L Rasalingam (Nibong Tebal, MY); Go Beng Siong (Bayan Lepas, MY)
Assignee: Western Digital Technologies, Inc.
H05K1/189G11C5/00H05K1/00H05K1/14H05K1/181H05K2201/05H05K2201/10159
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Quick Facts
Patent No.
US 11,778,748
App. No.
17/180,067
Granted
Oct 3, 2023
Kind
B2
Abstract

A data storage device including a first printed circuit board (PCB) and a second PCB. The first PCB includes a controller, an interface configured to interface with a host device, and a first connector. The second PCB includes a non-volatile memory and a second connector. The second connector is configured to couple to the first connector to establish a communication connection between the controller and the non-volatile memory.

Claims (30)

1. A data storage device, comprising:

a first printed circuit board (PCB) including a controller, an interface configured to interface with a host device, and a first connector; and

a second PCB including a first non-volatile memory and a second connector removably coupled to the first connector to establish a communication connection between the controller and the first non-volatile memory;

wherein the second PCB is removable from the data storage device and replaceable by another PCB including a second non-volatile memory and another connector couplable to the first connector to establish a communication connection between the controller and the second non-volatile memory, the second non-volatile memory having a greater memory capacity than the first non-volatile memory; and

wherein the first and second connectors are ball grid array (BGA) connectors, and wherein the first BGA connector includes first pins connected to first solder balls by way of a first substrate.

2. The data storage device of claim 1 , wherein the first connector is positioned at a first end of the first PCB.

3. The data storage device of claim 1 , wherein the first connector is positioned approximately at a center of the first PCB.

4. The data storage device of claim 1 ,

wherein physical dimensions of the data storage device and configurations of the first connector and second connector conform to a standard form factor selected from the group consisting of a peripheral component interconnect (PCI) form factor, a PCI-extended (PCI-X) form factor, and a PCI Express (PCIe) form factor; and

wherein said another PCB is of a same physical size as or of a smaller physical size than the second PCB to fit in a physical space of the second PCB when said another connector is connected to the first connector.

5. The data storage device of claim 2 , wherein the first PCB or the second PCB include a guide stop.

6. A data storage system, comprising a data storage device that comprises:

a first printed circuit board (PCB) including a controller, an interface configured to interface with a host device, and a first connector; and

a second PCB including a first non-volatile memory and a second connector removably coupled to the first connector to establish a communication connection between the controller and the first non-volatile memory;

wherein the second PCB is removable from the data storage device and replaceable by another PCB including a second non-volatile memory and another connector couplable to the first connector to establish a communication connection between the controller and the second non-volatile memory, the second non-volatile memory having a greater memory capacity than the first non-volatile memory; and

wherein the first and second connectors are ball grid array (BGA) connectors, and wherein the first BGA connector includes first pins connected to first solder balls by way of a first substrate, and the second BGA connector includes through holes for the first pins to be connected to second solder balls by way of a second substrate.

7. The data storage device system of claim 6 , wherein the first connector is positioned at a first end of the first PCB.

8. The data storage device system of claim 6 , wherein the first connector is positioned approximately center on the first PCB.

9. The data storage system of claim 6 ,

wherein physical dimensions of the data storage device and configurations of the first connector and second connector conform to a standard form factor selected from the group consisting of a peripheral component interconnect (PCI) form factor, a PCI-extended (PCI-X) form factor, and a PCI Express (PCIe) form factor; and

wherein said another PCB is of a same physical size as or of a smaller physical size than the second PCB to fit in a physical space of the second PCB when said another connector is connected to the first connector.

10. The data storage device system of claim 7 , wherein the first PCB or the second PCB include a guide stop.

11. A method for expanding capacity of a data storage device, wherein the data storage device includes a first printed circuit board (PCB) including a controller, an interface configured to interface with a host device, and a first connector, and further includes a second PCB removable from the data storage device and including a first non-volatile memory and a second connector removably coupled to the first connector to establish a communication connection between the controller and the first non-volatile memory, the method comprising:

providing another PCB connectable to the first PCB, said another PCB including a second non-volatile memory and another connector couplable to the first connector to establish a communication connection between the controller and the second non-volatile memory, the second non-volatile memory having a larger memory capacity than the first non-volatile memory; and

wherein the second PCB is replaceable by said another PCB in the data storage device and wherein the first connector, the second connector, and said another connector are ball grid array (BGA) connectors, and wherein the first BGA connector includes first pins connected to first solder balls by way of a first substrate.

12. The method of claim 11 , wherein the first connector is positioned at a first end of the first PCB.

13. The method of claim 11 , wherein the first connector is positioned approximately at a center of the first printed circuit board.

14. The method of claim 11 ,

wherein physical dimensions of the data storage device and configurations of the first connector and second connector conform to a standard form factor selected from the group consisting of a peripheral component interconnect (PCI) form factor, a PCI-extended (PCI-X) form factor, and a PCI Express (PCIe) form factor; and

wherein said another PCB is of a same physical size as or of a smaller physical size than the second PCB to fit in a physical space of the second PCB when said another connector is connected to the first connector.

Assignments (10)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
RELEASE OF SECURITY INTEREST AT REEL 056285 FRAME 0292 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0001 →
SECURITY INTEREST Recorded May 19, 2021
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 056285/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2021
From: RASALINGAM, UTHAYARAJAN A/L; SIONG, GO BENG
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 055341/0407 →
Continuity (1)
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