Well tap for an integrated circuit product and methods of forming such a well tap
An illustrative device disclosed herein includes a doped well region and a conductive well tap conductively coupled to the doped well region, the conductive well tap including first and second opposing sidewall surfaces. In this example the device also includes a first sidewall spacer that has a first vertical height positioned around the conductive well tap and a second sidewall spacer positioned adjacent the first sidewall spacer along the first and second opposing sidewall surfaces of the conductive well tap, wherein the second sidewall spacer has a second vertical height that is less than the first vertical height.
1. A device, comprising:
a doped well region;
a well tap that is coupled to the doped well region, the well tap comprising first and second opposing sidewall surfaces;
a first sidewall spacer positioned around the well tap, the first sidewall spacer having a first vertical height; and
a second sidewall spacer positioned adjacent the first sidewall spacer along the first and second opposing sidewall surfaces of the well tap, the second sidewall spacer having a second vertical height that is less than the first vertical height.
2. The device of claim 1 , wherein the second sidewall spacer does not surround the well tap.
3. The device of claim 1 , wherein the first sidewall spacer is positioned on and in physical contact with the well tap and the second sidewall spacer is positioned on and in physical contact with the first sidewall spacer.
4. The device of claim 1 , wherein the well tap comprises at least one material that has a third vertical height and wherein the first vertical height of the first sidewall spacer is substantially equal to the third vertical height.
5. The device of claim 1 , further comprising a semiconductor-on-insulator (SOI) substrate, the SOI substrate comprising a base semiconductor layer, a buried insulation layer positioned on the base semiconductor layer, and an active semiconductor layer positioned on the buried insulation layer, wherein the doped well region is at least partially positioned in the base semiconductor layer, and wherein the well tap extends through the buried insulation layer and into the base semiconductor layer.
6. The device of claim 1 , further comprising:
a transistor, the transistor comprising a gate structure, a source region, and a drain region;
a gate contact structure that is coupled to the gate structure; and
a source/drain contact structure that is coupled to one of the source region and the drain region, wherein the well tap, the gate contact structure, and the source/drain contact structure all comprise a same materials of construction.
7. The device of claim 1 , further comprising a gate structure, the gate structure comprising opposing lateral sidewalls, wherein the second sidewall spacer is positioned adjacent the opposing lateral sidewalls of the gate structure.
8. The device of claim 1 , further comprising:
a first gate structure, the first gate structure comprising a first end surface; and
a second gate structure, the second gate structure comprising a second end surface, wherein the well tap is positioned between the first end surface and the second end surface.
9. The device of claim 8 , wherein the first gate structure comprises a first pair of opposing lateral sidewalls, wherein the second gate structure comprises a second pair of opposing lateral sidewalls, and wherein the second sidewall spacer is positioned adjacent the first pair of opposing lateral sidewalls of the first gate structure and adjacent the second pair of opposing lateral sidewalls of the second gate structure.
10. The device of claim 1 , further comprising:
an active region; and
a transistor on the active region, the transistor comprising a gate structure, a source region, and a drain region, the transistor having a gate width that extends in a gate width direction, and the active region having a first dimension in the gate width direction, wherein the well tap has a second dimension in the gate width direction that is no larger than the first dimension.
11. The device of claim 1 , further comprising:
a diode well formed between the well tap and the doped well region, the diode well being of opposite type from that of the doped well region.
12. The device of claim 1 , further comprising:
an active region;
an isolation structure positioned around the active region;
a doped well region positioned in a semiconductor material below the active region wherein the well tap comprises a first portion that contacts the doped well region and a second portion that is positioned above the isolation structure.
13. The device of claim 12 , wherein the well tap comprises a third portion that is positioned above the isolation structure, wherein, when viewed from above, the first portion of the well tap is positioned between the second and third portions of the well tap.