Field effect transistor with adjustable effective gate length
Disclosed is a structure including a field effect transistor (FET). The FET includes, on an insulator layer above a substrate, source/drain regions and a section of a semiconductor layer extending laterally between the source/drain regions. A primary gate structure is made of the insulator layer and a well region in the substrate opposite at least the section of the semiconductor layer extending laterally between the source/drain regions. One or two secondary gate structures are on the semiconductor layer between and near one or both of the source/drain regions, respectively. The FET can further include a patterned conformal dielectric layer, which is on the center of the semiconductor layer between the source/drain regions, and which extends onto the secondary gate structure(s). Also disclosed are methods of operating the structure by biasing the secondary gate structure(s) to adjust the effective gate length of the FET and methods of forming the structure.
1. A structure comprising:
an insulator layer on a semiconductor substrate;
above the insulator layer, source/drain regions and a section of a semiconductor layer extending laterally between the source/drain regions, wherein the section of the semiconductor layer has end portions adjacent to the source/drain regions and a center portion positioned laterally between the end portions;
a primary gate structure comprising: the insulator layer and a well region in the semiconductor substrate adjacent to the insulator layer opposite at least the section of the semiconductor layer extending laterally between the source/drain regions; and
at least one secondary gate structure on at least one of the end portions,
wherein the at least one secondary gate structure is offset from the center portion and from an adjacent source/drain region of the source/drain regions,
wherein the at least one secondary gate structure comprises two secondary gate structures on the end portions, respectively, adjacent to the source/drain regions, and
wherein the structure further comprises:
inner and outer gate sidewall spacers on the secondary gate structures;
a dielectric layer immediately adjacent to and covering the center portion and further extending partially over the secondary gate structures; and
interlayer dielectric material on the dielectric layer.
2. The structure of claim 1 , further comprising voltage sources connected to the secondary gate structures, wherein the voltage sources enable biasing of the secondary gate structures to establish an effective gate length equal to a length of the center portion between the end portions.
3. The structure of claim 1 , further comprising voltage sources connected to the secondary gate structures,
wherein the voltage sources enable independent biasing of the secondary gate structure to establish any of a first effective gate length, a second effective gate length that is less than the first effective gate length, and a third effective gate length that is less than the second effective gate length,
wherein the first effective gate length equal to a length of the section of the semiconductor layer extending laterally between the source/drain regions and wherein the structure has the first effective gate length when none of the secondary gate structures are biased,
wherein the second effective gate length equals a combined length of one end portion and the center portion and wherein the structure has the second effective gate length when one secondary gate structure is biased and one end portion is conductive, and
wherein the third effective gate length is equal to a length of the center portion and wherein the structure has the third effective gate length when the secondary gate structures are biased and the end portions are conductive.
4. The structure of claim 1 , further comprising contacts to the well region and the secondary gate structures.
5. The structure of claim 1 , further comprising silicide layers on the source/drain regions and partially covering top surfaces of the secondary gate structures.
6. The structure of claim 1 ,
wherein the section of the semiconductor layer extending laterally between the source/drain regions comprises an intrinsic portion, and
wherein the source/drain regions comprise doped portions of the semiconductor layer and doped epitaxial semiconductor layers on the doped portions of the semiconductor layer.
7. The structure of claim 1 , further comprising a well contact region on the well region, wherein the well contact region and the well region have a same type conductivity as the source/drain regions.
8. The structure of claim 1 , further comprising a well contact region on the well region, wherein the well contact region and the well region have a different type conductivity than the source/drain regions.
9. A structure comprising:
an insulator layer on a semiconductor substrate;
above the insulator layer, source/drain regions and a section of a semiconductor layer extending laterally between the source/drain regions, wherein the section of the semiconductor layer has end portions adjacent to the source/drain regions and a center portion positioned laterally between the end portions;
a primary gate structure comprising: the insulator layer and a well region in the semiconductor substrate adjacent to the insulator layer opposite at least the section of the semiconductor layer extending laterally between the source/drain regions;
secondary gate structures on the end portions, respectively, wherein each secondary gate structure of the secondary gate structures is offset from and between the center portion and an adjacent source/drain region of the source/drain regions;
inner and outer gate sidewall spacers on the secondary gate structures;
a dielectric layer immediately adjacent to and covering the center portion and further extending partially over the secondary gate structures; and
interlayer dielectric material on the dielectric layer.
10. The structure of claim 9 , further comprising voltage sources connected to the secondary gate structures, wherein the voltage sources enable biasing of the secondary gate structures to establish an effective gate length equal to a length of the center portion between the end portions.
11. The structure of claim 9 , further comprising voltage sources connected to the secondary gate structures,
wherein the voltage sources enable independent biasing of the secondary gate structure to establish any of a first effective gate length, a second effective gate length that is less than the first effective gate length, and a third effective gate length that is less than the second effective gate length,
wherein the first effective gate length equal to a length of the section of the semiconductor layer extending laterally between the source/drain regions and wherein the structure has the first effective gate length when none of the secondary gate structures are biased,
wherein the second effective gate length equals a combined length of one end portion and the center portion and wherein the structure has the second effective gate length when one secondary gate structure is biased and one end portion is conductive, and
wherein the third effective gate length is equal to a length of the center portion and wherein the structure has the third effective gate length when the secondary gate structures are biased and the end portions are conductive.
12. The structure of claim 9 ,
wherein the section of the semiconductor layer extending laterally between the source/drain regions comprises an intrinsic portion, and
wherein the source/drain regions comprise doped portions of the semiconductor layer and doped epitaxial semiconductor layers on the doped portions of the semiconductor layer.
13. The structure of claim 9 , further comprising a well contact region on the well region, wherein the well contact region and the well region have a same type conductivity as the source/drain regions.
14. The structure of claim 9 , further comprising a well contact region on the well region, wherein the well contact region and the well region have a different type conductivity than the source/drain regions.