IP Library Granted Patent US 12,538,083
Granted Patent B2
US 12,538,083 · App. 17/219,896 · Granted Jan 27, 2026

Systems and methods for suppressing sound leakage

Inventors: Lei Zhang (Shenzhen, CN); Junjiang Fu (Shenzhen, CN); Bingyan Yan (Shenzhen, CN); Fengyun Liao (Shenzhen, CN); Xin Qi (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R25/505G10K9/13G10K9/22G10K11/175G10K11/178G10K11/26H04R1/2811H04R9/066G10K2210/3216H04R1/2876H04R17/00H04R2460/13
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,538,083
App. No.
17/219,896
Granted
Jan 27, 2026
Kind
B2
Abstract

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

Claims (28)

1 . A bone conduction device comprising:

a housing;

a panel fitting human skin and passing vibrations to enable a user to hear sound;

a transducer residing inside the housing and configured to drive the panel to vibrate to generate the vibrations, the vibrations producing a first sound wave inside the housing, at least a portion of the housing vibrates along with the transducer to push air outside the housing to generate a second sound wave outside the housing;

at least one sound guiding hole located on the housing and configured to guide the first sound wave inside the housing through the at least one sound guiding hole to an outside of the housing, the first sound wave having a phase different from a phase of the second sound wave, the first sound wave interfering with the second sound wave in a target region, and the interference reducing a sound pressure level of the second sound wave in the target region; and

a noise reduction assembly configured to receive a target sound and reduce noise of the target sound.

2 . The bone conduction device of claim 1 , wherein the noise reduction assembly includes a microphone array configured to collect sound signals, and the collected sound signals include the target sound and the noise.

3 . The bone conduction device of claim 2 , wherein the microphone array includes at least one low-frequency microphone and at least one high-frequency microphone, the at least one low-frequency microphone being configured to collect low-frequency signals of the collected sound signals, and the at least one high-frequency microphone being configured to collect high-frequency signals of the collected sound signals.

4 . The bone conduction device of claim 3 , wherein the at least one low-frequency microphone includes a pair of low-frequency microphones, and the at least one high-frequency microphone includes a pair of high-frequency microphones.

5 . The bone conduction device of claim 2 , wherein each microphone of the microphone array processes one of the collected sound signals into at least two sub-band sound signals.

6 . The bone conduction device of claim 5 , wherein each microphone of the microphone array corresponds to a filter, via which the one of the collected sound signals is processed into the at least two sub-band sound signals.

7 . The bone conduction device of claim 5 , wherein the at least two sub-band sound signals have narrower frequency bands than the one of the collected sound signals corresponding to the at least two sub-band sound signals.

8 . The bone conduction device of claim 5 , wherein the noise reduction assembly includes a noise reduction component configured to perform noise reduction on sub-band sound signals corresponding to the collected sound signals.

9 . The bone conduction device of claim 8 , wherein to perform noise reduction on sub-band sound signals corresponding to the collected sound signals, the noise reduction component is further configured to:

for each of the sub-band sound signals,

generate a sub-band noise correction signal according to the sub-band sound signal; and

generate a target sub-band sound signal based on the sub-band sound signal and the sub-band noise correction signal.

10 . The bone conduction device of claim 9 , wherein the noise reduction assembly further includes a synthesis component configured to generate a target signal by combining target sub-band sound signals corresponding to the sub-band sound signals.

11 . The bone conduction device of claim 1 , wherein the at least one sound guiding hole includes two sound guiding holes located on the housing, and the two sound guiding holes are arranged to generate at least two sound waves having different phases to reduce the sound pressure level of the second sound wave.

12 . The bone conduction device of claim 1 , wherein a location of the at least one sound guiding hole is determined based on at least one of: a vibration frequency of the transducer, a shape of the at least one sound guiding hole, the target region, or a frequency range within which the sound pressure level of the second sound wave is to be reduced.

13 . The bone conduction device of claim 1 , wherein the at least one sound guiding hole includes two sound guiding holes located on the housing, and the two sound guiding holes are arranged to generate sound waves having a same phase, one of the two sound guide holes generates a third sound wave of a first phase, the first phase is used to interfere with the second sound wave to reduce the sound pressure level of the second sound wave, the other of the two sound guide holes generates a fourth sound wave of a second phase, which is also used to interfere with the second sound wave to reduce the sound pressure level of the second sound wave, and the second chase is equal to the first phase.

14 . The bone conduction device of claim 1 , wherein at least a portion of the second sound wave whose sound pressure level is reduced is within a range of 1500 Hz to 3000 Hz.

15 . The bone conduction device of claim 14 , wherein the sound pressure level of the at least a portion of the second sound wave is reduced by more than 10 dB on average.

16 . The bone conduction device of claim 1 , wherein at least a portion of the second sound wave whose sound pressure level is reduced is within a range of 2000 Hz to 2500 Hz, and the sound pressure level of the at least a portion of the second sound wave is reduced by more than 20 dB on average.

17 . The bone conduction device of claim 1 , wherein the at least one sound guiding hole includes one sound guiding hole, different portions of the sound guiding hole are configured to generate sound waves having a same phase, one of the different portions of the sound guiding hole generates a third sound wave of a first phase, the first phase is used to interfere with the second sound wave to reduce the sound pressure level of the second sound wave, the other of the different portions of the sound quidding hole generates a fourth sound wave of a second phase, which is also used to interfere with the second sound wave to reduce the sound pressure level of the second sound wave, and the second phase is equal to the first phase.

18 . The bone conduction device of claim 1 , wherein the at least one sound guiding hole includes one sound guiding hole, different portions of the sound guiding hole are configured to generate sound waves having different phases to reduce the sound pressure level of the second sound wave.

19 . The bone conduction device of claim 1 , wherein the sound guiding hole includes a damping layer, the damping layer is configured to adjust the phase of the guided sound wave in the target region.

20 . The bone conduction device of claim 1 , wherein the housing is cylindrical with a sidewall and a bottom, the at least one sound guiding hole includes a plurality of sound guiding holes that are arranged along a circumference of the bottom.

Assignments (2)
CHANGE OF NAME Recorded Jan 20, 2022
From: SHENZHEN VOXTECH CO., LTD.
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 058785/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2021
From: ZHANG, LEI; FU, JUNJIANG; YAN, BINGYAN; LIAO, FENGYUN; QI, XIN
To: SHENZHEN VOXTECH CO., LTD.
Reel/Frame 056295/0372 →
Priority Claims (4)
CN 201410005804.0 · Jan 6, 2014 · national
CN 201910364346.2 · Apr 30, 2019 · national
CN 201910888067.6 · Sep 19, 2019 · national
CN 201910888762.2 · Sep 19, 2019 · national
Continuity (9)
Continuation In Part 17074762 · Oct 20, 2020
Continuation In Part 16813915 · Mar 10, 2020
Continuation 16419049 · May 22, 2019
Continuation 16180020 · Nov 5, 2018
Continuation 15650909 · Jul 16, 2017
Continuation 15109831
Continuation In Part 17169468 · Feb 7, 2021
Continuation PCTCN2020087034 · Apr 26, 2020
Related Publication 20210219074A1 · Jul 15, 2021
References Cited (110)
US 2327320A · Shapiro · 1943 [cited by applicant]
US 4987597A · Haertl · 1991 [cited by applicant]
US 5430803A · Kimura et al. · 1995 [cited by applicant]
US 5692059A · Kruger · 1997 [cited by applicant]
US 5757935A · Kang et al. · 1998 [cited by applicant]
US 5790684A · Niino et al. · 1998 [cited by applicant]
US 6478108B1 · Linhard et al. · 2002 [cited by applicant]
US 6850138B1 · Sakai · 2005 [cited by applicant]
US 8141678B2 · Ikeyama et al. · 2012 [cited by applicant]
US 9226075B2 · Lee · 2015 [cited by applicant]
US 9729978B2 · Qi et al. · 2017 [cited by applicant]
US 9985596B1 · Litovsky et al. · 2018 [cited by applicant]
US 10149071B2 · Qi et al. · 2018 [cited by applicant]
US 10334372B2 · Qi et al. · 2019 [cited by applicant]
US 10506362B1 · Gomes · 2019 [cited by applicant]
US 10631075B1 · Patil et al. · 2020 [cited by applicant]
US 10897677B2 · Walraevens et al. · 2021 [cited by applicant]
US 11197106B2 · Qi et al. · 2021 [cited by applicant]
US 11582563B2 · Qi et al. · 2023 [cited by applicant]
US 20030048913A1 · Lee et al. · 2003 [cited by applicant]
US 20040131219A1 · Polk, Jr. · 2004 [cited by applicant]
US 20050251952A1 · Johnson · 2005 [cited by applicant]
US 20060094481A1 · Gullickson · 2006 [cited by applicant]
US 20060098829A1 · Kobayashi · 2006 [cited by applicant]
US 20070034493A1 · Kawasaki et al. · 2007 [cited by applicant]
US 20070041595A1 · Carazo et al. · 2007 [cited by applicant]
US 20070237341A1 · Laroche · 2007 [cited by examiner]
US 20070274556A1 · Matsumura et al. · 2007 [cited by applicant]
US 20080144874A1 · Wu et al. · 2008 [cited by applicant]
US 20080287063A1 · Kidron et al. · 2008 [cited by applicant]
US 20090095613A1 · Lin · 2009 [cited by applicant]
US 20090127020A1 · Connor · 2009 [cited by applicant]
US 20090141920A1 · Suyama · 2009 [cited by applicant]
US 20090147981A1 · Blanchard et al. · 2009 [cited by applicant]
US 20090190781A1 · Fukuda · 2009 [cited by applicant]
US 20090208031A1 · Abolfathi · 2009 [cited by applicant]
US 20090285417A1 · Shin et al. · 2009 [cited by applicant]
US 20090290730A1 · Fukuda et al. · 2009 [cited by applicant]
US 20090304209A1 · Nakatani · 2009 [cited by applicant]
US 20100054492A1 · Eaton et al. · 2010 [cited by applicant]
US 20100080400A1 · Sibbald et al. · 2010 [cited by applicant]
US 20100322454A1 · Ambrose et al. · 2010 [cited by applicant]
US 20110150262A1 · Nakama et al. · 2011 [cited by applicant]
US 20120020501A1 · Lee · 2012 [cited by applicant]
US 20120070022A1 · Saiki · 2012 [cited by applicant]
US 20120177206A1 · Yamagishi et al. · 2012 [cited by applicant]
US 20120201406A1 · Yamaguchi · 2012 [cited by applicant]
US 20130188803A1 · Shaanan et al. · 2013 [cited by applicant]
US 20130329919A1 · He · 2013 [cited by applicant]
US 20140009008A1 · Li et al. · 2014 [cited by applicant]
US 20140064533A1 · Kasic, II · 2014 [cited by applicant]
US 20140185822A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140185837A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140274229A1 · Fukuda · 2014 [cited by applicant]
US 20140294182A1 · Axelsson et al. · 2014 [cited by applicant]
US 20140315605A1 · Cho et al. · 2014 [cited by applicant]
US 20140355777A1 · Nabata et al. · 2014 [cited by applicant]
US 20150003623A1 · Rasmussen · 2015 [cited by applicant]
US 20150030189A1 · Nabata et al. · 2015 [cited by applicant]
US 20150256656A1 · Horii · 2015 [cited by applicant]
US 20150264473A1 · Fukuda · 2015 [cited by applicant]
US 20150268673A1 · Farzbod · 2015 [cited by examiner]
US 20150326967A1 · Otani · 2015 [cited by applicant]
US 20160037243A1 · Lippert et al. · 2016 [cited by applicant]
US 20160037256A1 · Katsuda et al. · 2016 [cited by applicant]
US 20160050474A1 · Rye et al. · 2016 [cited by applicant]
US 20160150337A1 · Nandy · 2016 [cited by applicant]
US 20160165357A1 · Morishita et al. · 2016 [cited by applicant]
US 20160295328A1 · Park · 2016 [cited by applicant]
US 20160329041A1 · Qi et al. · 2016 [cited by applicant]
US 20170201823A1 · Shetye et al. · 2017 [cited by applicant]
US 20170223445A1 · Bullen et al. · 2017 [cited by applicant]
US 20170347192A1 · Seo et al. · 2017 [cited by applicant]
US 20180167710A1 · Silver et al. · 2018 [cited by applicant]
US 20180182370A1 · Hyde et al. · 2018 [cited by applicant]
US 20190052954A1 · Rusconi Clerici Beltrami · 2019 [cited by examiner]
US 20190238971A1 · Wakeland et al. · 2019 [cited by applicant]
US 20190320258A1 · Ohura · 2019 [cited by examiner]
US 20200367008A1 · Walsh et al. · 2020 [cited by applicant]
US 20210099027A1 · Larsson et al. · 2021 [cited by applicant]
US 20210219059A1 · Qi et al. · 2021 [cited by applicant]
US 20240276155A1 · Li et al. · 2024 [cited by applicant]
CN 201616895U · 2010 [cited by applicant]
CN 201690580U · 2010 [cited by applicant]
CN 102014328A · 2011 [cited by applicant]
CN 102421043A · 2012 [cited by applicant]
CN 202435600U · 2012 [cited by applicant]
CN 103167390A · 2013 [cited by applicant]
CN 103347235A · 2013 [cited by applicant]
CN 204206450U · 2015 [cited by applicant]
CN 107105363A · 2017 [cited by applicant]
CN 109547888A · 2019 [cited by applicant]
CN 209330353U · 2019 [cited by applicant]
EP 2011367B1 · 2014 [cited by applicant]
JP 2006332715A · 2006 [cited by applicant]
JP 2007251358A · 2007 [cited by applicant]
KR 20050030183A · 2005 [cited by applicant]
KR 20090082999A · 2009 [cited by applicant]
WO 2004095878A2 · 2004 [cited by applicant]
WO 2005053351A1 · 2005 [cited by applicant]
WO 2021133679A1 · 2021 [cited by applicant]
Notice of Preliminary Rejection in Korean Application No. 10-2022-7010046 mailed on Jun. 20, 2022, 15 pages. [cited by applicant]
International Search Report in PCT/CN2014/094065 mailed on Mar. 17, 2015, 5 pages. [cited by applicant]
Written Opinion in PCT/CN2014/094065 mailed on Mar. 17, 2015, 10 pages. [cited by applicant]
First Office Action in Chinese Application No. 201410005804.0 mailed on Dec. 7, 2015, 9 pages. [cited by applicant]
Notice of Reasons for Refusal in Japanese Application No. 2016545828 mailed on Jun. 20, 2017, 10 pages. [cited by applicant]
The Extended European Search Report in European Application No. 14877111.6 mailed on Mar. 17, 2017, 6 pages. [cited by applicant]
First Examination Report in Indian Application No. 201617026062 mailed on Nov. 13, 2020, 6 pages. [cited by applicant]
International Search Report in PCT/CN2020/087034 mailed on Jul. 22, 2020, 4 pages. [cited by applicant]
Written Opinion in PCT/CN2020/087034 mailed on Jul. 22, 2020, 5 pages. [cited by applicant]