IP Library Granted Patent US 12,218,408
Granted Patent B2
US 12,218,408 · App. 17/231,051 · Granted Feb 4, 2025

Antenna boards and communication devices

Inventors: Trang Thai (Hillsboro, OR); Sidharth Dalmia (Portland, OR); Raanan Sover (Haifa, IL); Josef Hagn (Taufkirchena, DE); Omer Asaf (Oranit M, IL); Simon Svendsen (Aalborg, DK)
Assignee: Intel Corporation
H01Q1/243H01L23/645H01L23/66H01Q9/0407H01Q9/0414H01Q21/065
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Quick Facts
Patent No.
US 12,218,408
App. No.
17/231,051
Granted
Feb 4, 2025
Kind
B2
Abstract

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

Claims (71)

1. An antenna module, comprising:

an antenna board and a die coupled to the antenna board, wherein the antenna board includes:

a ground plane;

an antenna feed structure;

a stack of antenna patches parallel to the ground plane;

a conductive ring around a first antenna patch of the stack of antenna patches, wherein the first antenna patch is an antenna patch that is closer to the antenna feed structure than all other antenna patches of the stack of antenna patches; and

conductive posts around the antenna feed structure, wherein the conductive posts are in conductive contact with the ground plane and with the conductive ring,

wherein the first antenna patch is an only antenna patch surrounded by the conductive ring, and no portion of the antenna feed structure is in conductive contact with the first antenna patch.

2. The antenna module of claim 1 , wherein:

the stack of antenna patches further includes a second antenna patch spaced apart from the first antenna patch,

the first antenna patch is between the second antenna patch and the antenna feed structure,

the conductive ring is a first conductive ring, and

the antenna board further includes a second conductive ring around the second antenna patch.

3. The antenna module of claim 2 , wherein one or more of the first antenna patch and the second antenna patch has a rectangular footprint.

4. The antenna module of claim 2 , wherein the second conductive ring has a rectangular inner perimeter.

5. The antenna module of claim 2 , wherein the antenna board further includes a third conductive ring between the first conductive ring and the second conductive ring.

6. The antenna module of claim 5 , wherein the third conductive ring has a rectangular inner perimeter.

7. The antenna module of claim 5 , wherein the antenna board further includes further conductive posts in conductive contact with the first conductive ring, the second conductive ring, and the third conductive ring.

8. The antenna module of claim 2 , wherein the first antenna patch has a thickness between 5 microns and 30 microns.

9. The antenna module of claim 2 , wherein the second antenna patch has a thickness between 5 microns and 30 microns.

10. The antenna module of claim 2 , wherein the antenna board further includes further conductive posts in conductive contact with the first conductive ring and the second conductive ring.

11. The antenna module of claim 1 , wherein the antenna board has a thickness between 500 microns and 2 millimeters.

12. The antenna module of claim 1 , wherein the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and wherein the stack of antenna patches is separated from the second portion of the antenna feed structure in a direction perpendicular to the ground plane by a solid dielectric material having a thickness between 50 microns and 200 microns.

13. A handheld communication device, comprising:

an antenna module, including an antenna board and a die coupled to the antenna board; and

a circuit board electrically coupled to the antenna module,

wherein the antenna board includes:

a ground plane,

an antenna feed structure,

a stack of antenna patches parallel to the ground plane,

an antenna patch of the stack of antenna patches in a layer parallel to the ground plane, wherein the antenna patch is closer to the antenna feed structure than all other antenna patches of the stack of antenna patches,

a conductive ring around the antenna patch, and

conductive posts around the antenna feed structure,

wherein the conductive posts are in conductive contact with the ground plane and with the conductive ring, the antenna patch is an only antenna patch within a perimeter of the conductive ring, and the antenna feed structure is not coupled to the antenna patch by a conductive material pathway.

14. The handheld communication device of claim 13 , wherein:

the antenna patch is a first antenna patch,

the stack of antenna patches further includes: a second antenna patch spaced apart from the first antenna patch, and

the first antenna patch is between the second antenna patch and the antenna feed structure.

15. The handheld communication device of claim 14 , wherein at least one of the first antenna patch and the second antenna patch has a rectangular footprint.

16. The handheld communication device of claim 14 , wherein the conductive ring is a first conductive ring, and wherein the antenna board further includes a second conductive ring around the second antenna patch.

17. The handheld communication device of claim 16 , wherein the second conductive ring has a rectangular inner perimeter.

18. The handheld communication device of claim 14 , wherein the first antenna patch has a thickness between 5 microns and 30 microns.

19. The handheld communication device of claim 14 , wherein the second antenna patch has a thickness between 5 microns and 30 microns.

20. The handheld communication device of claim 13 , wherein the antenna board has a thickness between 500 microns and 2 millimeters.

21. The handheld communication device of claim 13 , further comprising:

a back, wherein the back includes plastic; and

an air gap between the antenna patch and the back.

22. The handheld communication device of claim 13 , further comprising:

a touchscreen display; and

a back,

wherein the antenna module is at least partially between the touchscreen display and the back.

23. The handheld communication device of claim 22 , wherein the antenna module is entirely between the touchscreen display and the back.

24. The handheld communication device of claim 13 , further comprising a speaker.

25. The handheld communication device of claim 13 , further comprising a back, wherein the back includes plastic.

26. The handheld communication device of claim 13 , wherein the handheld communication device is a smartphone.

27. The handheld communication device of claim 13 , wherein the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane.

28. The handheld communication device of claim 13 , wherein the antenna patch is separated from a portion of the antenna feed structure parallel to the ground plane in a direction perpendicular to the ground plane by a solid dielectric material having a thickness between 50 microns and 200 microns.

29. An antenna board, comprising:

an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane;

a stack of antenna patches parallel to the ground plane;

an antenna patch of the stack of antenna patches parallel to the ground plane, wherein the antenna patch is closer to the antenna feed structure than all other antenna patches of the stack of antenna patches, and wherein the antenna patch is spaced apart from the antenna feed structure and no portion of the antenna feed structure is in conductive contact with the antenna patch;

a ring comprising metal around the antenna patch, wherein no other antenna patches of the stack of antenna patches are surrounded by the ring; and

pillars comprising a conductive material around the antenna feed structure, wherein the pillars are connected to the ground plane and the ring.

30. The antenna board of claim 29 , further comprising a cavity.

31. The antenna board of claim 30 , wherein the cavity is between the antenna patch and the antenna feed substrate.

32. The antenna board of claim 30 , wherein the cavity is between the ground plane and a portion of the antenna feed structure parallel to the ground plane.

33. The antenna board of claim 30 , wherein the antenna patch is a first antenna patch, the cavity is a first cavity, and the antenna board further includes a second antenna patch and a second cavity between the first antenna patch and the second antenna patch.

34. The antenna board of claim 29 , wherein the antenna feed structure includes solder.

35. The antenna board of claim 29 , wherein the antenna board has a thickness between 500 microns and 2 millimeters.

36. The antenna board of claim 29 , wherein the antenna patch is a millimeter wave antenna patch.

37. The antenna board of claim 29 , wherein the antenna patch has a thickness between 5 microns and 30 microns.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 056337/0609 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2021
From: THAI, TRANG; DALMIA, SIDHARTH; SOVER, RAANAN; HAGN, JOSEF; ASAF, OMER; SVENDSEN, SIMON
To: INTEL CORPORATION
Reel/Frame 055925/0449 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2021
From: INTEL CORPORATION
To: INTEL IP CORPORATION
Reel/Frame 055925/0502 →
Continuity (2)
Continuation 15977612 · May 11, 2018
Related Publication 20210234260A1 · Jul 29, 2021
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