Printed circuit board with stacked passive components
A substrate of an electronic device includes a first set of contact pads and a first set of contact pillars having a height greater than the first set of contact pads. Components are coupled to the first set of contact pads and the first set of contact pillars in traversing directions. The components coupled to the contact pillars are positioned above the components coupled to the first set of contact pads such that at least a first portion of a first side of the component coupled to the contact traces faces a first side of the components coupled to the contact pillars. Stacking passive components in this manner can allow for increased component density without increasing package size.
1. A printed circuit board comprising:
a substrate comprising a first set of contact pads and a first set of contact pillars integrally formed of the same material thereon on a second set of contact pads, wherein the first set of contact pillars have a height greater than the first set of contact pads and wherein a width of the first set of contact pillars is narrower than a width of the second set of contact pads such that the first set of contact pillars are positioned at a midpoint of the width of the second set of contact pads;
a first component coupled to the first set of contact pads along a first direction, the first component having a first side facing the first set of contact pads, and a second side opposite the first side; and
a second component coupled to the first set of contact pillars along a second direction, wherein the second direction traverses the first direction, the second component having a first side facing the first set of contact pads, and a second side opposite the first side;
wherein the second component is positioned above the first component such that at least a first portion of the second side of the first component faces the first side of the second component.
2. The printed circuit board of claim 1 , wherein the first component comprises one or more of a resistor, a capacitor, and an inductor, and the second component comprises one or more of a resistor, a capacitor, and an inductor.
3. The printed circuit board of claim 1 , wherein the height of the first set of contact pillars is at least five times greater than the height of the first set of contact pads.
4. The printed circuit board of claim 1 , wherein the height of the first set of contact pillars is 200 microns.
5. The printed circuit board of claim 1 , wherein the substrate, the first component, and the second component are encapsulated in a mold material.
6. The printed circuit board of claim 1 , wherein the first set of contact pillars are copper contact pillars.
7. The printed circuit board of claim 1 , further comprising:
a third set of contact pads and a second set of contact pillars, wherein the second set of contact pillars have a height greater than the third set of contact pads;
a third component coupled to the third set of contact pads along the first direction, wherein the third component has a first side facing the first set of contact pads, and a second side opposite the first side; and
a fourth component coupled to the second set of contact pillars along the second direction, the fourth component having a first side facing the first set of contact pads, and a second side opposite the first side;
wherein the fourth component is positioned above the first component and the third component such that at least a first portion of the second side of the first component and a first portion of the second side of the third component faces the first side of the fourth component.
8. The printed circuit board of claim 1 , wherein the first direction is at a ninety degree angle to the second direction.
9. A data storage device, comprising:
a substrate comprising a first set of contact pads and a first set of contact pillars integrally formed of the same material thereon on a second set of contact pads, wherein the first set of contact pillars have a height greater than the first set of contact pads and wherein a width of the first set of contact pillars is narrower than a width of the second set of contact pads such that the first set of contact pillars are positioned at a midpoint of the width of the second set of contact pads;
a memory controller coupled to the substrate;
one or more NAND die stacks coupled to the substrate and in electrical communication with the memory controller;
a first component coupled to the first set of contact pads along a first direction, the first component having a first side facing the first set of contact pads, and a second side opposite the first side; and
a second component coupled to the first set of contact pillars along a second direction, wherein the second direction traverses the first direction, the second component having a first side facing the first set of contact pads, and a second side opposite the first side;
wherein the second component is positioned above the first component such that at least a first portion of the second side of the first component faces the first side of the second component, and
wherein the substrate, the first component, and the second component are encapsulated in a mold material.
10. The data storage device of claim 9 , wherein the first component comprises one or more of a resistor, a capacitor, and an inductor, and the second component comprises one or more of a resistor, a capacitor, and an inductor.
11. The data storage device of claim 9 , wherein the height of the first set of contact pillars is at least ten times greater than the height of the first set of contact pads.
12. The data storage device of claim 9 , further comprising:
a third set of contact pads and a second set of contact pillars, wherein the second set of contact pillars have a height greater than the third set of contact pads;
a third component coupled to the third set of contact pads along the first direction, wherein the third component has a first side facing the second set of contact pads, and a second side opposite the first side; and
a fourth component coupled to the second set of contact pillars along the second direction, the fourth component having a first side facing the first set of contact pads, and a second side opposite the first side,
wherein the fourth component is positioned above the first component and the third component such that at least a first portion of the second side of the first component and a first portion of the second side of the third component faces the first side of the fourth component.
13. The data storage device of claim 9 , wherein the first direction is orthogonal to the second direction.
14. The data storage device of claim 9 , wherein the first set of pillar contacts are copper pillar contacts.
15. The printed circuit board of claim 1 , wherein the first set of contact pads and the first set of contact pillars are formed using a common process.
16. The printed circuit board of claim 15 , wherein the common process is a deposition process.