IP Library Granted Patent US 11,782,199
Granted Patent B2
US 11,782,199 · App. 17/248,285 · Granted Oct 10, 2023

Metal-dielectric optical filter, sensor device, and fabrication method

Inventors: Georg J. Ockenfuss (Santa Rosa, CA); Tim Gustafson (Santa Rosa, CA); Jeffrey James Kuna (San Francisco, CA); Markus Bilger (Santa Rosa, CA); Richard A. Bradley, Jr. (Santa Rosa, CA)
Assignee: VIAVI Solutions Inc.
G02B5/285G02B1/10G02B5/281G02B5/283H01L27/14621H01L27/14685
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Quick Facts
Patent No.
US 11,782,199
App. No.
17/248,285
Granted
Oct 10, 2023
Kind
B2
Abstract

An optical filter, a sensor device including the optical filter, and a method of fabricating the optical filter are provided. The optical filter includes one or more dielectric layers and one or more metal layers stacked in alternation. The metal layers are intrinsically protected by the dielectric layers. In particular, the metal layers have tapered edges that are protectively covered by one or more of the dielectric layers.

Claims (34)

1. A method comprising:

applying a photoresist layer onto a substrate;

forming, in the photoresist layer surrounding a region of the substrate, an overhang by patterning the photoresist layer in a manner that uncovers the region; and

lifting the photoresist layer in a manner that provides a clean lift-off of the photoresist layer without breaking a coating that covers the overhang.

2. The method of claim 1 , wherein the photoresist layer comprises a bilayer structure.

3. The method of claim 1 , wherein the photoresist layer includes a top layer that is photosensitive.

4. The method of claim 1 , wherein the photoresist layer includes a top layer that is patternable by selective exposure to ultraviolet light.

5. The method of claim 1 , wherein the photoresist layer includes a bottom layer that is not photosensitive and acts as a release layer.

6. The method of claim 1 , wherein the region is a filter region.

7. The method of claim 1 , wherein forming the overhang comprises:

chemically modifying a top portion of the photoresist layer for the top portion to develop more slowly than a bottom portion of the photoresist layer.

8. The method of claim 1 , wherein the overhang is greater than 2 μm.

9. The method of claim 1 , wherein the coating is a multilayer stack coating.

10. The method of claim 1 , wherein a thickness of the coating is less than about 70% of a thickness of a bottom layer of the photoresist layer.

11. The method of claim 1 , wherein a thickness of a bottom layer of the photoresist layer is about 800 nm.

12. The method of claim 1 , wherein a thickness of the coating is about 500 nm.

13. The method of claim 1 , wherein sides of an optical filter under the overhang are sloped at an angle of about 10 degrees.

14. An optical filter comprising:

a photoresist layer,

the photoresist layer including a top layer and a bottom layer;

an overhang; and

a coating that covers the top layer and the overhang, a thickness of the coating being configured to ensure a clean lift-off the photoresist layer without breaking the coating.

15. The optical filter of claim 14 , wherein the top layer is photosensitive and is patternable by selective exposure to ultraviolet light.

16. The optical filter of claim 14 , wherein the bottom layer is not photosensitive and acts as a release layer.

17. The optical filter of claim 14 , wherein the thickness of the coating is less than about 70% of a thickness of the bottom layer.

18. An optical filter comprising:

a photoresist layer; and

an overhang that is greater than about 2 μm; and

a coating that covers the overhang,

a thickness of the coating being configured to ensure a clean lift-off the photoresist layer without breaking the coating.

19. The optical filter of claim 18 , wherein a side of the optical filter under the overhang is sloped at an angle of about ten degrees.

20. The optical filter of claim 18 ,

wherein the photoresist layer includes a release layer, wherein the thickness of the coating is about 500 nm, and

wherein the thickness of the coating is less than about 70% of a thickness of the release layer.

Assignments (5)
RELEASE OF SECURITY INTEREST AT REEL/FRAME 73189/0873 Recorded May 28, 2026
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
To: INERTIAL LABS, INC.; VIAVI SOLUTIONS INC.; VIAVI SOLUTIONS LICENSING LLC
Reel/Frame 075642/0381 →
SECURITY INTEREST Recorded Nov 14, 2025
From: VIAVI SOLUTIONS INC.; VIAVI SOLUTIONS LICENSING LLC; INERTIAL LABS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 073571/0137 →
SECURITY AGREEMENT Recorded Oct 21, 2025
From: INERTIAL LABS, INC.; VIAVI SOLUTIONS INC.; VIAVI SOLUTIONS LICENSING LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 073189/0873 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2021
From: OCKENFUSS, GEORG J.; GUSTAFSON, TIM; KUNA, JEFFREY JAMES; BILGER, MARKUS; BRADLEY, RICHARD A., JR.
To: JDS UNIPHASE CORPORATION
Reel/Frame 054948/0712 →
CHANGE OF NAME Recorded Jan 19, 2021
From: JDS UNIPHASE CORPORATION
To: VIAVI SOLUTIONS INC.
Reel/Frame 055021/0893 →
Continuity (4)
Continuation 16266913 · Feb 4, 2019
Continuation 14308343 · Jun 18, 2014
Continuation In Part 13720728 · Dec 19, 2012
Related Publication 20210141133A1 · May 13, 2021
Cited By (1)
US 12,366,692