IP Library Granted Patent US 11,546,533
Granted Patent B2
US 11,546,533 · App. 17/337,827 · Granted Jan 3, 2023

Solid state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus

Inventor: Ryoji Suzuki (Kanagawa, JP)
Assignee: SONY GROUP CORPORATION
H04N5/359H01L27/1463H01L27/1464H01L27/14621H01L27/14625H01L27/14627H04N9/045
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Quick Facts
Patent No.
US 11,546,533
App. No.
17/337,827
Granted
Jan 3, 2023
Kind
B2
Abstract

The present technique aims to provide a solid-state imaging device that reduces shading and color mixing between pixels. The present invention also provides a method of manufacturing the solid-state imaging device. The present technique further relates to a solid-state imaging device that enables provision of an electronic apparatus that uses the solid-state imaging device, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes a substrate, pixels each including a photoelectric conversion unit formed in the substrate, and a color filter layer formed on the light incidence surface side of the substrate. The solid-state imaging device also includes a device isolating portion that is formed to divide the color filter layer and the substrate for the respective pixels, and has a lower refractive index than the refractive indexes of the color filter layer and the substrate.

Claims (37)

1. An imaging device comprising:

a semiconductor substrate;

a first photoelectric conversion region disposed in the semiconductor substrate;

a second photoelectric conversion region adjacent to the first photoelectric conversion region and disposed in the semiconductor substrate;

a first color filter disposed over the first photoelectric conversion region;

a second color filter disposed over the second photoelectric conversion region; and

an insulating film disposed between the first and second photoelectric conversion regions and between the first and second color filters.

2. The imaging device of claim 1 , wherein the insulating film comprises a first film and a second film.

3. The imaging device of claim 2 , wherein the second film is on sidewalls of the first film.

4. The imaging device of claim 3 , wherein the first film has a lower refractive index that the second film.

5. The imaging device of claim 4 , wherein the first film has a lower refractive index than the semiconductor substrate and the first and second color filters.

6. The imaging device of claim 3 , wherein the second film has a lower refractive index than the first and second color filters.

7. The imaging device of claim 2 , wherein the first film contacts the first and second color filters.

8. The imaging device of claim 3 , further comprising:

a metal film, wherein the first film is on sidewalls of the metal film.

9. The imaging device of claim 8 , further comprising:

a light absorbing material on the metal film and between the first and second color filters.

10. The imaging device of claim 9 , wherein the first and second color filters contact the light absorbing material.

11. The imaging device of claim 8 , wherein the metal film comprises Al or W.

12. An imaging device comprising:

a semiconductor substrate;

a first photoelectric conversion region disposed in the semiconductor substrate;

a second photoelectric conversion region adjacent to the first photoelectric conversion region and disposed in the semiconductor substrate;

a first color filter disposed over the first photoelectric conversion region;

a second color filter disposed over the second photoelectric conversion region; and

a metal film disposed between the first and second photoelectric conversion regions and between the first and second color filters.

13. The imaging device of claim 12 , further comprising:

a first film on sidewalls of the metal film.

14. The imaging device of claim 13 , further comprising:

a second film on sidewalls of the first film.

15. The imaging device of claim 14 , wherein the first film has a lower refractive index that the second film.

16. The imaging device of claim 15 , wherein the first film has a lower refractive index than the semiconductor substrate and the first and second color filters.

17. The imaging device of claim 14 , wherein the second film has a lower refractive index than the first and second color filters.

18. The imaging device of claim 12 , further comprising:

a light absorbing material on the metal film and between the first and second color filters.

19. The imaging device of claim 18 , wherein the first and second color filters contact the light absorbing material.

20. The imaging device of claim 12 , wherein the metal film comprises Al or W.

Assignments (2)
CHANGE OF NAME Recorded Oct 1, 2021
From: SONY CORPORATION
To: SONY GROUP CORPORATION
Reel/Frame 057684/0441 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2021
From: SUZUKI, RYOJI
To: SONY CORPORATION
Reel/Frame 057615/0625 →
Priority Claims (1)
JP JP2012-168365 · Jul 30, 2012 · national
Continuity (7)
Continuation 16864811 · May 1, 2020
Continuation 16415501 · May 17, 2019
Continuation 16218402 · Dec 12, 2018
Continuation 15720134 · Sep 29, 2017
Continuation 15261450 · Sep 9, 2016
Continuation 14417027
Related Publication 20210368114A1 · Nov 25, 2021