Impedance matching network
In one embodiment, an RF impedance matching network is disclosed. The matching network is coupled between an RF source having a variable frequency and a plasma chamber having a variable chamber impedance. The matching network includes a variable reactance element (VRE), and a control circuit coupled to the VRE and a sensor, the sensor configured to detect an RF parameter. To cause an impedance match between the RF source and the plasma chamber, the control circuit determines, based on the detected RF parameter and a VRE configuration, a new source frequency for the RF source. The impedance match then causes the variable frequency of the RF source to alter to the new source frequency.
1. A radio frequency (RF) impedance matching network comprising:
an RF input configured to operably couple to an RF source having a variable frequency;
an RF output configured to operably couple to a plasma chamber having a variable chamber impedance;
a variable reactance element (VRE) having a variable configuration for causing a variable reactance; and
a control circuit operably coupled to the VRE and a sensor, the sensor configured to detect an RF parameter;
wherein, to cause an impedance match between the RF source and the plasma chamber, the control circuit is configured to:
determine, based on the detected RF parameter and a current VRE configuration, a new source frequency for the RF source; and
cause the altering of the variable frequency of the RF source to the new source frequency.
2. The matching network of claim 1 wherein the new source frequency is determined using a lookup table.
3. The matching network of claim 1 wherein the variable reactance is a variable capacitance, and the VRE is an electronically variable capacitor (EVC) comprising discrete capacitors, and wherein each discrete capacitor may be switched in and out to vary the EVC configuration and the EVC capacitance.
4. The matching network of claim 3 wherein a new VRE configuration is determined together with the new source frequency for together causing the impedance match.
5. The matching network of claim 4 wherein the altering of the VRE and the variable frequency occur at the same time.
6. A semiconductor processing tool comprising:
a plasma chamber configured to deposit a material onto a substrate or etch a material from the substrate; and
an impedance matching network operably coupled to the plasma chamber, the matching network comprising:
an RF input configured to operably couple to an RF source having a variable frequency;
an RF output configured to operably couple to the plasma chamber, the plasma chamber having a variable chamber impedance;
a variable reactance element (VRE) having a variable configuration for causing a variable reactance; and
a control circuit operably coupled to the VRE and a sensor, the sensor configured to detect an RF parameter;
wherein, to cause an impedance match between the RF source and the plasma chamber, the control circuit is configured to:
determine, based on the detected RF parameter and a current VRE configuration, a new source frequency for the RF source; and
alter the variable frequency of the RF source to the new source frequency.
7. A method of impedance matching comprising:
operably coupling an RF input of an impedance matching network to an RF source having a variable frequency;
operably coupling an RF output of the impedance matching network to a plasma chamber having a variable chamber impedance, wherein the impedance matching network further comprises a variable reactance element (VRE) having a variable configuration for causing a variable reactance;
operably coupling a control circuit to the VRE and a sensor;
detecting, by the sensor, an RF parameter; and
causing, by the control circuit, an impedance match between the RF source and the plasma chamber by:
determining, based on the detected RF parameter and a current VRE configuration, a new source frequency for the RF source; and
altering the variable frequency of the RF source to the new source frequency.
8. The method of claim 7 wherein the new source frequency is determined using a lookup table.
9. The method of claim 7 wherein the sensor is a voltage and current sensor positioned at the RF input of the matching network.
10. The method of claim 7 wherein the sensor detects the RF parameter at the RF input or the RF output of the matching network.
11. The method of claim 7 wherein the RF sensor is a phase or magnitude detector operably coupled to the RF input of the matching network, and the detected RF parameter used for the determination of the new source frequency is a phase error or a magnitude error.
12. The method of claim 7 wherein the RF sensor is operably coupled to the RF input of the matching network, and the detected RF parameter is at least one of a voltage, a current, or a phase at the RF input.
13. The method of claim 7 wherein the control circuit determines the variable frequency of the RF source from a frequency signal from the RF source, or from a parameter detected at the RF input of the matching network.
14. The method of claim 7 wherein the variable reactance is a variable capacitance, and the VRE is an electronically variable capacitor (EVC) comprising discrete capacitors, and wherein each discrete capacitor may be switched in and out to vary the EVC configuration and the EVC capacitance.
15. The method of claim 14 wherein a new VRE configuration is determined together with the new source frequency for together causing the impedance match.
16. The method of claim 15 :
wherein the VRE comprises discrete capacitors, each discrete capacitor having a corresponding switch to activate or deactivate the discrete capacitor; and
wherein the VRE is altered to the new VRE configuration by activating or deactivating at least one of the discrete capacitors of the VRE.
17. A method of manufacturing a semiconductor comprising:
placing a substrate in a plasma chamber configured to deposit a material layer onto the substrate or etch a material layer from the substrate; and
energizing plasma within the plasma chamber by coupling RF power from an RF source into the plasma chamber to perform a deposition or etching, and while energizing the plasma:
operably coupling an RF input of an impedance matching network to the RF source, the RF source having a variable frequency;
operably coupling an RF output of the impedance matching network to the plasma chamber, the plasma chamber having a variable chamber impedance, wherein the impedance matching network further comprises a variable reactance element (VRE) having a variable configuration for causing a variable reactance;
operably coupling a control circuit to the VRE and a sensor;
detecting, by the sensor, an RF parameter; and
causing, by the control circuit, an impedance match between the RF source and the plasma chamber by:
determining, based on the detected RF parameter and a current VRE configuration, a new source frequency for the RF source; and
altering the variable frequency of the RF source to the new source frequency.