Monolithic surface mount passive component
A data storage device includes a substrate including a number of contact pads and a number of passive component packages coupled to the contact pads. The data storage device further includes a memory controller coupled to the substrate, and one or more NAND die stacks coupled to the substrate and in electrical communication with the memory controller. One or more of the passive component packages include a first passive component, a second passive component electrically connected to the first passive component, and a first terminal coupled to the first passive component. The passive component packages further include a second terminal coupled to the second passive component, and a third terminal coupled to a common node of the first passive component and the second passive component.
1. A method for manufacturing a multiple passive component package, the method comprising:
performing a first printing process to print at least a portion of a first passive component and a second passive component on a first layer;
performing a second printing process to print at least a portion of a common signal terminal between the first passive component and the second passive component on the first layer,
wherein the common signal terminal provides a common connection point between the first passive component and the second passive component;
repeating the first printing process and the second printing process for a plurality of layers, wherein each of the plurality of layers is an individual ceramic sheet;
performing a stacking operation to stack the plurality of layers;
performing a pressing operation to combine the plurality of layers; and
separating one or more of the combined plurality of layers,
wherein each of the first printing process and the second printing process is a plasma assisted chemical vapor deposition process.
2. The method of claim 1 , wherein the multiple passive component package includes at least two passive components.
3. The method of claim 2 , wherein the first passive component and the second passive component are resistors.
4. The method of claim 2 , further comprising performing a drilling process on at least a portion of the first layer, wherein the drilling process drills one or more holes in the first layer corresponding to a location of a common terminal point.
5. The method of claim 4 , wherein the common terminal point is positioned equidistant between a first connection terminal of the first passive component and a second connection terminal of the second passive component.