Boiling enhancement structures for immersion cooled electronic systems
An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.
1. A system comprising:
a packaged semiconductor device;
an integrated heat spreader, thermally coupled to the packaged semiconductor device;
a first boiling enhancement layer located on a first side of the integrated heat spreader; and
a second boiling enhancement layer located on a second side of the integrated heat spreader, the second side opposite the first side, each of the first boiling enhancement layer and the second boiling enhancement layer having a non-planar surface.
2. The system of claim 1 , wherein the first boiling enhancement layer includes wire meshes that are coupled to the first side of the integrated heat spreader.
3. The system of claim 2 , wherein a metal foil is located between the wire meshes and the first side of the integrated heat spreader.
4. The system of claim 1 , wherein the integrated heat spreader is in an immersion cooling system and a thermal resistivity between the integrated heat spreader and a saturation temperature of a liquid of the immersion cooling system is no greater than 0.042 C°/W.
5. The system of claim 1 , wherein the non-planar surface of the first boiling enhancement structure comprises layer includes at least one of a roughened surface or a patterned surface.
6. The system of claim 1 , further including an adhesive layer between the first boiling enhancement layer and the integrated heat spreader.
7. The system of claim 1 , wherein a package of the packaged semiconductor device has openings to permit liquid coolant inside the package.
8. An apparatus, comprising:
a loading layer to mount a packaged semiconductor chip to a circuit board; and
a boiling enhancement layer coupled to exist on an integrated heat spreader of the packaged semiconductor chip, the boiling enhancement layer having a non-planar surface, the loading layer including a frame having at least one opening to provide direct contact between a liquid of a liquid bath and the boiling enhancement layer when the packaged semiconductor chip is in the liquid bath.
9. The apparatus of claim 8 , wherein at least one bar is located within the at least one opening.
10. The apparatus of claim 8 , wherein the loading layer is to contact a peripheral region of the integrated heat spreader or another region of the integrated heat spreader.
11. The apparatus of claim 10 , wherein the loading layer is to contact the peripheral region of the integrated heat spreader and the boiling enhancement layer is within the peripheral region.
12. The apparatus of claim 9 , wherein the boiling enhancement layer includes wire meshes stacked on the integrated heat spreader.
13. The apparatus of claim 12 , wherein a metal foil is located to reside between the wire meshes and the integrated heat spreader.
14. The apparatus of claim 8 , wherein the boiling enhancement layer includes a roughened surface or a patterned surface.
15. The apparatus of claim 8 , wherein when the packaged semiconductor chip is in the liquid bath, a thermal resistivity between the integrated heat spreader and a saturation temperature of the liquid is no greater than 0.042 C°/W.
16. The apparatus of claim 8 , wherein at least one post extends from beneath a bar that is located in the at least one opening, wherein, the post is to apply force to the integrated heat spreader to apply some loading force of the loading layer to a region of the integrated heat spreader within the at least one opening.
17. The apparatus of claim 16 , wherein a hole exists in the boiling enhancement layer through which the post extends through.
18. A system, comprising:
a liquid bath;
an electronic circuit board to be immersed in the liquid bath;
a packaged semiconductor device, the packaged semiconductor device including an integrated heat spreader;
a boiling enhancement layer coupled to the integrated heat spreader, the boiling enhancement layer having a non-planar surface; and
a loading layer that secures the packaged semiconductor device to the electronic circuit board, the loading layer having at least one opening to provide direct contact between the liquid bath and the boiling enhancement layer when the electronic circuit board including the packaged semiconductor device is immersed in the liquid bath.
19. The system of claim 18 , wherein the loading layer contacts a peripheral region of the integrated heat spreader or another region of the integrated heat spreader.
20. The system of claim 19 , wherein the boiling enhancement layer includes wire meshes stacked on the integrated heat spreader.
21. The system of claim 20 , wherein a metal foil resides is located between the wire meshes and the integrated heat spreader.
22. The system of claim 18 , wherein the boiling enhancement layer includes a roughened surface or a patterned surface.
23. The system of claim 18 , wherein when the packaged semiconductor device is in the liquid bath, a thermal resistivity between the integrated heat spreader and a saturation temperature of the liquid of the liquid bath is no greater than 0.042 C°/W.
24. An apparatus, comprising:
an integrated heat spreader including a patterned surface, the integrated heat spreader thermally coupled to a semiconductor chip; and
a loading layer to mount the semiconductor chip to a circuit board, the loading layer including a frame having at least one opening to provide direct contact between a liquid of a liquid bath and the patterned surface of the integrated heat spreader when the semiconductor chip is immersed in the liquid bath.