IP Library › Granted Patent US 11,431,881
Granted Patent B2
US 11,431,881 · App. 17/367,275 · Granted Aug 30, 2022

Phased metalens for adjusting a focus of an image

Inventors: Ronald M. Taylor (Greentown, IN); James Nicholas Nickolaou (Clarkston, MI)
Assignee: Aptiv Technologies Limited
H04N5/22521H04N5/232122
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Quick Facts
Patent No.
US 11,431,881
App. No.
17/367,275
Granted
Aug 30, 2022
Kind
B2
Abstract

The techniques of this disclosure relate to a system for adjusting a focus of an image. A system includes a phased metalens configured to adjust a focus of an image detected by an imaging substrate of an image sensor to compensate for warpage of the imaging substrate. The phased metalens can achieve a near-diffraction-limited focusing over incoming light wavelengths using precisely defined nanoscale subwavelength resolution structures.

Claims (25)

1. A system, comprising:

a phased metalens configured to adjust a focus of an image detected by an imaging substrate of an image sensor,

the phased metalens configured to adjust the focus of the image by adapting a focus characteristic of the image sensor to compensate for warpage of the imaging substrate.

2. The system of claim 1 , wherein the warpage comprises a stress-induced warpage of the imaging substrate due to cooling of the image sensor from an initial curing process.

3. The system of claim 1 , wherein the warpage comprises a stress-induced warpage of the imaging substrate that changes based on an operating temperature of the system.

4. The system of claim 1 , wherein the warpage comprises a stress-induced warpage of the imaging substrate that increases as an operating temperature of the system decreases.

5. The system of claim 1 , wherein the warpage comprises a stress-induced warpage of the imaging substrate that decreases as an operating temperature of the system increases.

6. The system of claim 1 , wherein the phased metalens is configured to compensate for the warpage of the imaging substrate over a flatness range of 0 μm to about 7 μm.

7. The system of claim 1 , wherein the phased metalens is configured to be located proximate the image sensor and between the image sensor and a lens.

8. The system of claim 1 , wherein the phased metalens is configured to adjust a property of light that reaches the imaging substrate based on a change in a flatness of the imaging substrate caused by the warpage.

9. The system of claim 8 , wherein the property of the light that reaches the imaging substrate comprises a phase of all the light that reaches the imaging substrate at a same time.

10. The system of claim 8 , wherein the phased metalens is configured to adjust the property of the light based on an operating temperature of the image sensor.

11. The system of claim 8 , wherein the phased metalens is configured to adjust the property of the light based on a color of the light.

12. The system of claim 8 , wherein the property of the light that reaches the imaging substrate comprises a phase of all the light that reaches a same reference point on the imaging substrate at a same time.

13. The system of claim 12 , wherein the reference point comprises a point having a greatest distance from the phased metalens along a line normal to a plane defining an image focus field of the phased metalens.

14. A camera, comprising:

an objective lens;

an image sensor comprising an imaging substrate configured to detect an image; and

a phased metalens positioned between the objective lens and the image sensor, and configured to adjust a focus of the image detected by the imaging substrate by adapting a focus characteristic of the image sensor to compensate for warpage of the imaging substrate.

15. The camera of claim 14 , wherein the warpage comprises a stress-induced warpage of the imaging substrate due to cooling of the image sensor from an initial curing process.

16. The camera of claim 14 , wherein the warpage comprises a stress-induced warpage of the imaging substrate that changes based on an operating temperature of the camera.

17. The camera of claim 14 , wherein the warpage comprises a stress-induced warpage of the imaging substrate that increases as an operating temperature of the camera decreases.

18. The camera of claim 14 , wherein the warpage comprises a stress-induced warpage of the imaging substrate that decreases as an operating temperature of the camera increases.

19. The camera of claim 14 , wherein the phased metalens is configured to compensate for the warpage of the imaging substrate over a flatness range of 0 μm to about 7 μm.

20. The camera of claim 14 , wherein the camera is configured for use in a vehicle.

Assignments (4)
MERGER Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES (2) S.À R.L.
To: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
Reel/Frame 066566/0173 →
ENTITY CONVERSION Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES LIMITED
To: APTIV TECHNOLOGIES (2) S.À R.L.
Reel/Frame 066746/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2024
From: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
To: APTIV TECHNOLOGIES AG
Reel/Frame 066551/0219 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2021
From: TAYLOR, RONALD M.; NICKOLAOU, JAMES NICHOLAS
To: APTIV TECHNOLOGIES LIMITED
Reel/Frame 056748/0883 →
Continuity (2)
Continuation 17087526 · Nov 2, 2020
Related Publication 20220141365A1 · May 5, 2022
Cited By (5)
US 12,298,469 US 12,405,525 US 12,449,719 US 12,455,427 US 12,663,561