Three-dimensional memory device with doped semiconductor bridge structures and methods for forming the same
A vertically alternating sequence of continuous insulating layers and continuous sacrificial material layers is formed over a substrate, and memory opening fill structures including vertical stacks of memory elements are formed through the vertically alternating sequence. Backside trenches are formed to divide the vertically alternating sequence into a plurality of alternating stacks of insulating layers and sacrificial material layers. A set of one or more bridge structures including a doped semiconductor material is formed within each of the backside trenches. The sacrificial material layers are replaced with electrically conductive layers while the sets of at least one bridge structure are present within the backside trenches.
1. A three-dimensional memory device, comprising:
a pair of alternating stacks of insulating layers and electrically conductive layers laterally spaced apart from each other by a backside trench, wherein each of the pair of alternating stacks and the backside trench laterally extend along a first horizontal direction;
arrays of memory openings vertically extending through a respective alternating stack among the pair of alternating stacks;
arrays of memory openings fill structures located in the arrays of memory openings, wherein each of the memory opening fill structures comprises a respective vertical stack of memory elements; and
a backside trench fill structure located within the backside trench and comprising at least one bridge structure including a doped semiconductor material;
wherein the at least one bridge structure consists essentially of boron-doped silicon.
2. The three-dimensional memory device of claim 1 , further comprising a pair of contact-level dielectric material portions overlying a respective one of the pair of alternating stacks and laterally spaced apart by the backside trench, wherein the at least one bridge structure contacts respective sidewall segments of the pair of contact-level dielectric material portions.
3. The three-dimensional memory device of claim 2 , wherein the at least one bridge structure comprises a respective top surface located within a horizontal plane including top surfaces of the pair of contact-level dielectric material portions.
4. A three-dimensional memory device, comprising:
a pair of alternating stacks of insulating layers and electrically conductive layers laterally spaced apart from each other by a backside trench, wherein each of the pair of alternating stacks and the backside trench laterally extend along a first horizontal direction;
arrays of memory openings vertically extending through a respective alternating stack among the pair of alternating stacks;
arrays of memory openings fill structures located in the arrays of memory openings, wherein each of the memory opening fill structures comprises a respective vertical stack of memory elements;
a backside trench fill structure located within the backside trench and comprising at least one bridge structure including a doped semiconductor material; and
a pair of contact-level dielectric material portions overlying a respective one of the pair of alternating stacks and laterally spaced apart by the backside trench, wherein the at least one bridge structure contacts respective sidewall segments of the pair of contact-level dielectric material portions;
wherein:
each of the memory opening fill structures further comprises a respective vertical semiconductor channel and a respective drain region contacting an upper end portion of the vertical semiconductor channel; and
top surfaces of the drain regions are located at or underneath a horizontal plane including bottom surfaces of the pair of contact-level dielectric material portions.
5. A three-dimensional memory device, comprising:
a pair of alternating stacks of insulating layers and electrically conductive layers laterally spaced apart from each other by a backside trench, wherein each of the pair of alternating stacks and the backside trench laterally extend along a first horizontal direction;
arrays of memory openings vertically extending through a respective alternating stack among the pair of alternating stacks;
arrays of memory openings fill structures located in the arrays of memory openings, wherein each of the memory opening fill structures comprises a respective vertical stack of memory elements; and
a backside trench fill structure located within the backside trench and comprising at least one bridge structure including a doped semiconductor material
wherein:
the doped semiconductor material comprises a boron doped semiconductor material; and
the backside trench fill structure comprises an insulating backside trench fill material portion contacting sidewalls and a bottom surface of the at least one bridge structure.
6. The three-dimensional memory device of claim 5 , wherein the backside trench fill structure contacts a respective sidewall of each layer within the pair of alternating stacks.
7. The three-dimensional memory device of claim 5 , wherein the bottom surface of the at least one bridge structure is located within a horizontal plane located above a horizontal plane including top surfaces of topmost electrically conductive layers within the pair of alternating stacks.
8. The three-dimensional memory device of claim 5 , wherein sidewalls of the insulating backside trench fill material portion contacts a pair of lengthwise sidewalls of the backside trench that laterally extends along the first horizontal direction.
9. The three-dimensional memory device of claim 5 , wherein:
the sidewalls of the at least one bridge structure that contact the insulating backside trench fill material portion are parallel to a second horizontal direction that is perpendicular to the first horizontal direction; and
the at least one bridge structure comprises additional sidewalls that are parallel to the first horizontal direction and adjoined to a respective pair of sidewalls that are parallel to the second horizontal direction.
10. The three-dimensional memory device of claim 9 , further comprising a pair of contact-level dielectric material portions overlying a respective one of the pair of alternating stacks and laterally spaced apart by the backside trench, wherein the additional sidewalls of the at least one bridge structure contacts respective sidewall segments of the pair of contact-level dielectric material portions.
11. The three-dimensional memory device of claim 1 , wherein the at least one bridge structure comprises a plurality of bridge structures that are laterally spaced apart along the first horizontal direction.
12. The three-dimensional memory device of claim 11 , wherein the plurality of bridge structures comprise a periodic one-dimensional array of bridge structures having a periodicity along the first horizontal direction.
13. The three-dimensional memory device of claim 1 , wherein:
each of the memory opening fill structures comprises a respective vertical semiconductor channel; and
a source semiconductor layer is located in contact with a sidewall of a bottom end of each of the vertical semiconductor channels.