IP Library Granted Patent US 12,280,449
Granted Patent B2
US 12,280,449 · App. 17/424,520 · Granted Apr 22, 2025

Method and apparatus for cutting and ablating a workpiece with a complex fluid-jet-guided laser beam

Inventors: Florent Bruckert (Sciez-sur-Léman, FR); Gilles Soulier (Romont, CH); Grégoire Laporte (Prilly, CH); Bernold Richerzhagen (Saint-Sulpice, CH)
Assignee: SYNOVA S.A.
B23K26/38B23K26/0622B23K26/146B23K26/3576B23K2103/04
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Quick Facts
Patent No.
US 12,280,449
App. No.
17/424,520
Granted
Apr 22, 2025
Kind
B2
Abstract

The invention relates to a method 100 and an apparatus 300 for cutting or ablating a particular material of the workpiece with a pulsed laser beam coupled into a fluid jet. The method comprises producing the pulsed laser beam with at least one laser source, providing the pressurized fluid jet onto the workpiece, and coupling the pulsed laser beam into the fluid jet towards the workpiece. The pulsed laser beam comprises at least two superimposed pulsations selected based on the particular material of the workpiece. A first pulsation has a different power and frequency than a second pulsation.

Claims (52)

1. A method ( 100 ) for cutting or ablating a particular material of a workpiece ( 310 ) with a pulsed laser beam ( 200 ), the method ( 100 ) comprising:

producing ( 101 ) the pulsed laser beam ( 200 ) with at least one laser source ( 301 , 301 a ),

providing ( 102 ) a pressurized fluid jet ( 303 ) onto the workpiece ( 310 ), and

coupling ( 103 ) the pulsed laser beam ( 200 ) into the fluid jet ( 303 ) towards the workpiece ( 310 ),

wherein the pulsed laser beam ( 200 ) comprises at least two superimposed pulsations ( 201 , 202 ) selected based on the particular material of the workpiece ( 310 ),

wherein a first pulsation ( 201 ) of the at least two superimposed pulsations ( 201 , 202 ) has a different power and frequency than a second pulsation ( 202 ) of the at least two superimposed pulsations ( 201 , 202 ),

wherein the first pulsation ( 201 ) is suitable to cut or ablate the particular material of the workpiece ( 310 ), and

the second pulsation ( 202 ) is suitable to smooth a surface ( 610 ) created by cutting or ablating the particular material with the first pulsation ( 201 ).

2. The method ( 100 ) according to claim 1 , wherein:

the second pulsation ( 202 ) is not suitable to cut or ablate the particular material of the workpiece ( 310 ).

3. The method ( 100 ) according to claim 1 , wherein:

the second pulsation ( 202 ) is suitable to smooth the surface of a homogenous metallic or ceramic material as the particular material of the workpiece ( 310 ) to an arithmetic average of the roughness profile equal to or below 0.3 μm.

4. The method ( 100 ) according to claim 1 , wherein:

a thickness of the particular material of the workpiece ( 310 ) is 1 mm or more.

5. The method ( 100 ) according to claim 1 , for cutting or ablating more than one material of the workpiece ( 310 ), wherein:

the workpiece ( 310 ) comprises multiple different material layers, and

the pulsed laser beam ( 200 ) comprises at least two superimposed pulsations ( 201 , 202 ) selected per material layer of the workpiece ( 310 ).

6. A method ( 100 ) for cutting or ablating a particular material of a workpiece ( 310 ) with a pulsed laser beam ( 200 ), the method ( 100 ) comprising:

producing ( 101 ) the pulsed laser beam ( 200 ) with at least one laser source ( 301 , 301 a ),

providing ( 102 ) a pressurized fluid jet ( 303 ) onto the workpiece ( 310 ), and

coupling ( 103 ) the pulsed laser beam ( 200 ) into the fluid jet ( 303 ) towards the workpiece ( 310 ),

wherein the pulsed laser beam ( 200 ) comprises at least two superimposed pulsations ( 201 , 202 ) selected based on the particular material of the workpiece ( 310 ),

wherein a first pulsation ( 201 ) of the at least two superimposed pulsations ( 201 , 202 ) has a different power and frequency than a second pulsation ( 202 ) of the at least two superimposed pulsations ( 201 , 202 ),

wherein the at least two superimposed pulsations ( 201 , 202 ) are selected based further on at least one parameter of the fluid jet ( 303 ).

7. The method ( 100 ) according to claim 1 , wherein:

a frequency of the first pulsation ( 201 ) is of a different technical regime than a frequency of the second pulsation ( 202 ).

8. The method ( 100 ) according to claim 1 , wherein:

the first pulsation ( 201 ) and the second pulsation ( 202 ) are synchronous.

9. The method ( 100 ) according to claim 1 , wherein:

the first pulsation ( 201 ) and the second pulsation ( 202 ) are asynchronous.

10. The method ( 100 ) according to claim 1 , wherein:

at least one of the first pulsation ( 201 ) and the second pulsation ( 202 ) comprises a burst of a plurality of individual sub-pulses.

11. The method ( 100 ) according to claim 1 , wherein:

the particular material of the workpiece ( 310 ) is a cobalt-chromium-nickel alloy, or is a copper-zinc-nickel alloy, or a copper-based alloy, amorphous steel,

the first pulsation ( 201 ) has a frequency of 4-8 kHz and a full width at half maximum, FWHM, pulse width of 90-160 ns, and

the second pulsation ( 202 ) has a frequency of 80-120 kHz and a FWHM pulse width of 5-20 ns.

12. The method ( 100 ) according to claim 1 , wherein:

the particular material of the workpiece ( 310 ) is a semiconductor,

the first pulsation ( 201 ) has a frequency of 18-40 kHz and a FWHM pulse width of 200-500 ns, and

the second pulsation ( 202 ) has a frequency of 100-300 kHz and a FWHM pulse width of 15-30 ns.

13. The method ( 100 ) according to claim 1 , wherein:

the particular material of the workpiece ( 310 ) is a hard material,

the first pulsation ( 201 ) has a frequency of 1-13 kHz and a FWHM pulse width of 100-190 ns, and

the second pulsation ( 202 ) has a frequency of 50-150 kHz and a FWHM pulse width of 6-20 ns.

14. An apparatus ( 300 ) to carry out the method ( 100 ) of claim 1 for cutting or ablating a particular material of the workpiece ( 310 ) with the pulsed laser beam, the apparatus ( 300 ) comprising:

the at least one laser source ( 301 , 301 a ) configured to produce the pulsed laser beam ( 200 ), and

a machining unit ( 302 ) configured to provide the pressurized fluid jet ( 303 ) onto the workpiece ( 310 ) and to couple the pulsed laser beam ( 200 ) into the fluid jet ( 303 ) towards the workpiece ( 310 ).

15. The apparatus ( 300 ) according to claim 14 , further comprising:

an optical arrangement ( 400 ) configured to combine laser light emitted by each of the plurality of laser sources ( 301 , 301 a ), in order to produce the pulsed laser beam ( 200 ), and

an optical coupling element ( 402 ) configured to guide the pulsed laser beam ( 200 ) to the machining unit ( 302 ).

16. The apparatus ( 300 ) according to claim 14 , wherein:

the laser light emitted by the plurality of laser sources ( 301 , 301 a ) comprises at least two different pulsation frequencies and/or two different colors.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2021
From: BRUCKERT, FLORENT; SOULIER, GILLES; LAPORTE, GRÉGOIRE; RICHERZHAGEN, BERNOLD
To: SYNOVA S.A.
Reel/Frame 057353/0334 →
Priority Claims (1)
EP 19152959 · Jan 22, 2019 · regional
Continuity (1)
Related Publication 20220134481A1 · May 5, 2022
References Cited (76)
US 4827099A · Krebs · 1989 [cited by examiner]
US 4873413A · Uesugi · 1989 [cited by examiner]
US 4925523A · Braren · 1990 [cited by examiner]
US 5272309A · Goruganthu · 1993 [cited by examiner]
US 5302547A · Wojnarowski · 1994 [cited by examiner]
US 5554335A · Fields · 1996 [cited by examiner]
US 5562840A · Swain · 1996 [cited by examiner]
US 5902499A · Richerzhagen · 1999 [cited by examiner]
US 6311099B1 · Jasper · 2001 [cited by examiner]
US 6507003B2 · Amako · 2003 [cited by examiner]
US 6580055B2 · Iso · 2003 [cited by examiner]
US 6809291B1 · Neil · 2004 [cited by examiner]
US 6861614B1 · Tanabe · 2005 [cited by examiner]
US 8269137B2 · Ehrmann · 2012 [cited by examiner]
US 8330070B2 · Sano · 2012 [cited by examiner]
US 9346130B2 · Lei · 2016 [cited by examiner]
US 9676058B2 · Hu · 2017 [cited by examiner]
US 11224939B2 · Schnick · 2022 [cited by examiner]
US 11292081B2 · Hu · 2022 [cited by examiner]
US 20020000426A1 · Mead · 2002 [cited by examiner]
US 20030155336A1 · Kreuter · 2003 [cited by examiner]
US 20030183603A1 · Forsman · 2003 [cited by examiner]
US 20040011772A1 · Okumura · 2004 [cited by examiner]
US 20040134894A1 · Gu · 2004 [cited by examiner]
US 20040134896A1 · Gu · 2004 [cited by examiner]
US 20040182838A1 · Das · 2004 [cited by examiner]
US 20050098548A1 · Kobayashi · 2005 [cited by examiner]
US 20050218122A1 · Yamamoto · 2005 [cited by examiner]
US 20050247683A1 · Agarwal · 2005 [cited by examiner]
US 20060081573A1 · Wissenbach · 2006 [cited by examiner]
US 20060189034A1 · Tanabe · 2006 [cited by examiner]
US 20060261051A1 · Unrath · 2006 [cited by examiner]
US 20070193990A1 · Richerzhagen · 2007 [cited by examiner]
US 20070199927A1 · Gu · 2007 [cited by examiner]
US 20070278195A1 · Richerzhagen · 2007 [cited by examiner]
US 20080121627A1 · Bruland · 2008 [cited by examiner]
US 20080191390A1 · Fukushima · 2008 [cited by examiner]
US 20090250605A1 · Scigocki · 2009 [cited by examiner]
US 20100147812A1 · Beck · 2010 [cited by examiner]
US 20110210105A1 · Romashko · 2011 [cited by examiner]
US 20110284510A1 · Reeves-Hall · 2011 [cited by examiner]
US 20120061356A1 · Fukumitsu · 2012 [cited by examiner]
US 20120160815A1 · Hayashimoto · 2012 [cited by examiner]
US 20120298638A1 · Beck · 2012 [cited by examiner]
US 20120325784A1 · Moffatt · 2012 [cited by examiner]
US 20130174301A1 · Robinson · 2013 [cited by examiner]
US 20130183833A1 · Duan · 2013 [cited by examiner]
US 20140144893A1 · Yang · 2014 [cited by examiner]
US 20140256161A1 · Li · 2014 [cited by examiner]
US 20140308803A1 · Chung · 2014 [cited by examiner]
US 20150014889A1 · Goya · 2015 [cited by examiner]
US 20150165548A1 · Marjanovic · 2015 [cited by examiner]
US 20150230341A1 · Milne · 2015 [cited by examiner]
US 20150246412A1 · Mendes · 2015 [cited by examiner]
US 20150273624A1 · Yoshida · 2015 [cited by examiner]
US 20150336208A1 · Sokol · 2015 [cited by examiner]
US 20160067819A1 · Kuki · 2016 [cited by examiner]
US 20160083815A1 · Glaser · 2016 [cited by examiner]
US 20160250714A1 · Zhang · 2016 [cited by examiner]
US 20160368090A1 · Gaebelein · 2016 [cited by examiner]
US 20170028510A1 · Shin · 2017 [cited by examiner]
CN 102896430A · 2013 [cited by applicant]
EP 2208568A1 · 2010 [cited by applicant]
JP 2018170474A · 2018 [cited by applicant]
JP 7194588B2 · 2022 [cited by examiner]
WO 2006118454A1 · 2006 [cited by applicant]
International Search Report and Written Opinion issued in connection with the corresponding International Application No. PCT/EP2020/051361 on Apr. 15, 2020. [cited by applicant]
Korean Office Action and its English translation issued in connection with the corresponding Korean Patent Application No. 10-2021-7022995 on Feb. 13, 2024. [cited by applicant]
Extended European Search Report issued in connection with the corresponding European Patent Application No. 19 152 959.3 on Sep. 30, 2019. [cited by applicant]
Japanese Office Action issued in connection with the corresponding Japanese Patent Application No. 2021-541693 on Oct. 20, 2023 and its English translation. [cited by applicant]
Machine translation of JP 2018170474 A to Mitsuboshi Diamond Ind Co Ltd. [cited by applicant]
Machine translation of CN 102896430 A to Xiao et al. [cited by applicant]
First Office Action issued in connection with the corresponding Chinese Patent Application No. 202080010511.5 on Dec. 27, 2022. [cited by applicant]
Translation of First Office Action issued in connection with the corresponding Chinese Patent Application No. 202080010511.5 on Dec. 27, 2022. [cited by applicant]
Second Office Action issued in connection the corresponding Chinese Patent Application No. 202080010511.5 on Aug. 11, 2023. [cited by applicant]
Translation of Second Office Action issued in connection the corresponding Chinese Patent Application No. 202080010511.5 on Aug. 11, 2023. [cited by applicant]