Capacitor pads and methods of manufacturing the same
Capacitor pads and methods of manufacturing the same are disclosed herein. An example apparatus disclosed herein includes a substrate to support a die, and a die-side capacitor pad on the substrate, the die-side capacitor pad including a plurality of distinct pad portions, the distinct pad portions spaced apart from one another.
1 . An apparatus comprising:
a substrate to support a die; and
a die-side capacitor pad on the substrate, the die-side capacitor pad including:
a plurality of distinct pad portions, the distinct pad portions spaced apart from one another; and
a frame around the plurality of the distinct pad portions, the frame to retain solder material associated with a die-side capacitor, the frame flush with at least one of the distinct pad portions.
2 . The apparatus of claim 1 , wherein different ones of the distinct pad portions have a same size and a same shape.
3 . The apparatus of claim 1 , wherein the distinct pad portions include a first pad portion, the first pad portion having a cylindrical shape.
4 . The apparatus of claim 1 , wherein the distinct pad portions include a first pad portion, the first pad portion having a rectangular prism shape.
5 . The apparatus of claim 1 , including a second pad on the substrate, the second pad to bond with a corresponding bump or pad on the die, the second pad having a first size associated with a first cross-sectional area, each of the distinct pad portions having a second size associated with a second cross-sectional area, the second cross-sectional area being less than or equal to the first cross-sectional area.
6 . The apparatus of claim 1 , wherein the frame includes a conductive material.
7 . An apparatus comprising:
a substrate to support a die;
a capacitor including a terminal;
an interconnect extending between the capacitor and the substrate, the interconnect including a first pad on a side of the substrate, the first pad electrically coupling the die to the terminal, the first pad including a plurality of distinct pad portions, each of the distinct pad portions bonded to the terminal of the capacitor; and
a second pad on the side of the substrate, the second pad to electrically couple the substrate to the die, a cross-sectional area of individual ones of the distinct pad portions being less than or equal to a cross-sectional area of the second pad.
8 . The apparatus of claim 7 , wherein the first pad includes a frame around the plurality of the distinct pad portions, the frame to retain solder material that provides the bond between the terminal and each of the distinct pad portions.
9 . The apparatus of claim 8 , wherein the frame is electrically coupled to at least one of the distinct pad portions.
10 . The apparatus of claim 8 , wherein the frame includes a conductive material.
11 . The apparatus of claim 8 , wherein the frame is electrically coupled to the terminal and the die.
12 . The apparatus of claim 7 , wherein different ones of the distinct pad portions have a same size and a same shape.
13 . The apparatus of claim 7 , wherein the distinct pad portions include a first pad portion, the first pad portion having a cylindrical shape.
14 . The apparatus of claim 7 , wherein the distinct pad portions include a first pad portion, the first pad portion having a triangular shape.
15 . The apparatus of claim 7 , wherein the first pad is a capacitor pad and the second pad is a bridge pad.
16 . The apparatus of claim 7 , including a first solder layer on the first pad and a second solder layer on the second pad.
17 . The apparatus of claim 16 , wherein the first solder layer and the second solder layer have a same thickness.