Housings for electronic devices and memory devices
Embodiments of the present disclosure generally relate to housings for, e.g., memory devices and electronic devices, and to processes for forming such housings. In an embodiment, an article for housing at least a portion of an electronic device is provided. The article includes a first component comprising a thermoplastic and a biodegradable filler or polymer, and a second component disposed on at least a portion of the first component, the second component comprising a plurality of layers. The article has a scratch visibility load of about 200 gms or more, an electrostatic discharge static voltage of about 100 V or less, a thermal conductivity of about 0.28 W/mK or more, or combinations thereof.
1. An article for housing at least a portion of an electronic device, the article comprising:
a first component comprising a thermoplastic and a biodegradable filler or polymer, wherein the thermoplastic is present in an amount of 55 wt % to about 65 wt %, wherein the biodegradable filler or polymer is present in an amount of 35 wt % to about 45 wt %, and wherein the first component has:
a density from about 1.05 g/cm 3 to about 1.25 g/cm 3 ;
a heat deflection temperature (HDT) from about 140° C. to about 180° C.;
a tensile strength of about 110 MPa to about 200 MPa;
a flexural strength of about 150 MPa to about 200 MPa; and
a notched impact strength of about 40 kJ/m 2 to about 70 kJ/m 2 ; and
a second component disposed on at least a portion of the first component, the second component comprising a plurality of layers, wherein the plurality of layers comprises at least three layers, wherein each layer of the plurality of layers has a different composition,
the article having:
a scratch visibility load (ISO 4586-2) of about 200 gms or more;
an electrostatic discharge (ESD) static voltage (ANSI/ESD S20.20) of about 100 V or less;
a thermal conductivity (ISO 22007-2) of about 0.28 W/mK or more; or
combinations thereof.
2. The article of claim 1 , wherein an amount of biodegradable polymer in the first component is about 30 wt % or more based on a total weight of the first component.
3. The article of claim 1 , wherein:
the thermoplastic comprises polypropylene, polyethylene, polyethylene terephthalate, polyamide, polyvinylchloride, polyvinyl fluoride, polyoxymethylene, poly (methyl methacrylate), polysulfone derivatives, or combinations thereof;
the biodegradable filler or polymer comprises long cellulose fiber, short fiber, starch, cellulose acetate, or combinations thereof.
4. The article of claim 1 , wherein:
the thermoplastic comprises polypropylene; and
the biodegradable filler or polymer comprises long cellulose fiber.
5. The article of claim 1 , wherein the electronic device comprises a hard disk drive, a solid state drive, a universal serial bus (USB) flash drive, a laptop housing, a keyboard, a mouse, USB packaging, SSD packaging, HDD packaging, a sensor cover, a camera cover, a wi-fi router, or an automotive music system.
6. The article of claim 1 , wherein the plurality of layers comprises:
a first layer disposed on at least a portion of the first component;
a second layer disposed on at least a portion of the first layer; and
a third layer disposed on at least a portion of the second layer, the first layer comprising a primer for enhancing adhesion between the first component and the second layer.
7. The article of claim 6 , wherein the second layer comprises reaction product of paint, thinner, and hardener.
8. The article of claim 7 , wherein a ratio of the paint, the thinner, and the hardener used to form the reaction product is from about 3.5:3.8:0.5 to about 4.5:3.8:1.5.
9. The article of claim 6 , wherein the third layer comprises a reaction product of paint, thinner, and hardener.
10. The article of claim 9 , wherein a ratio of the paint, the thinner, and the hardener used to form the reaction product is from about 9.5:9.8:0.5 to about 10.5:9.8:1.5.
11. The article of claim 1 , wherein the article has:
an average surface roughness (ISO 4287:1997) of about 0.5 μm to about 2 μm;
a scratch hardness (ISO 4586-2) of about 0.4 GPa to about 0.8 GPa;
a thermal conductivity (ISO 22007-2) of about 0.28 W/mK to about 0.5 W/mK;
a Shore D hardness (ISO 868) of about 78 to about 88; or
combinations thereof.