3D memory semiconductor devices and structures
A 3D memory device, the device including: a plurality of memory cells, where each memory cell of the plurality of memory cells includes at least one memory transistor, where each of the at least one memory transistor includes a source, a drain, and a channel; a plurality of bit-line pillars, where each bit-line pillar of the plurality of bit-line pillars is directly connected to a plurality of the source or the drain, where the bit-line pillars are vertically oriented, where the channel is horizontally oriented; and a level of memory control circuits, where the memory control circuits is disposed either above or below the plurality of memory cells.
1. A 3D memory device, the device comprising:
a plurality of memory cells,
wherein each memory cell of said plurality of memory cells comprises at least one memory transistor,
wherein each of said at least one memory transistor comprises a source, a drain, and a channel;
a plurality of bit-line pillars,
wherein each bit-line pillar of said plurality of bit-line pillars is directly connected to a plurality of said source or said drain,
wherein said bit-line pillars are vertically oriented,
wherein said channel is horizontally oriented; and
a level of memory control circuits,
wherein said memory control circuits is disposed either above or below said plurality of memory cells.
2. The device according to claim 1 ,
wherein each memory cell of said plurality of memory cells comprises a charge trap memory,
wherein said channel comprises polysilicon,
wherein said source and/or said drain comprises metal atoms, and
wherein said metal atoms enable hot electron programming of said charge trap memory.
3. The device according to claim 1 ,
wherein said channel comprises a circular shape or an ellipsoidal shape.
4. The device according to claim 1 ,
wherein said plurality of memory cells comprise a partially or fully metalized source, and/or a partially or fully metalized drain.
5. The device according to claim 1 ,
wherein said plurality of memory cells comprise a tunneling oxide thinner than 1 nm.
6. The device according to claim 1 ,
wherein said channel is isolated from another channel disposed directly above said channel.
7. The device according to claim 1 ,
wherein said at least one memory transistor is self-aligned to an overlaying another said at least one memory transistor, both being processed following the same lithography step.
8. A 3D memory device, the device comprising:
a plurality of memory cells,
wherein each memory cell of said plurality of memory cells comprises at least one memory transistor,
wherein each of said at least one memory transistor comprises a source, a drain, and a channel; and
a plurality of bit-line pillars,
wherein each bit-line pillar of said plurality of bit-line pillars is directly connected to a plurality of said source or said drain,
wherein said bit-line pillars are vertically oriented,
wherein said channel is horizontally oriented, and
wherein said plurality of memory cells are organized as at least four independently controlled memory arrays.
9. The device according to claim 8 ,
wherein each memory cell of said plurality of memory cells comprises a charge trap memory,
wherein said channel comprises polysilicon,
wherein said source and/or said drain comprises metal atoms, and
wherein said metal atoms enable hot electron programming of said charge trap memory.
10. The device according to claim 8 ,
wherein each of said memory transistors is directly connected to at least one of said plurality of bit-line pillars.
11. The device according to claim 8 ,
wherein said channel comprises a channel width greater than 5 nm and less than 25 nm.
12. The device according to claim 8 ,
wherein said plurality of memory cells comprise a tunneling oxide thinner than 1 nm.
13. The device according to claim 8 ,
wherein said channel comprises a circular shape or an ellipsoidal shape.
14. The device according to claim 8 ,
wherein said at least one memory transistor is self-aligned to an overlaying another said at least one memory transistor, both being processed following a same lithography step.
15. A 3D memory device, the device comprising:
a plurality of memory cells,
wherein each memory cell of said plurality of memory cells comprises at least one memory transistor,
wherein each of said at least one memory transistor comprises a source, a drain, and a channel; and
a plurality of bit-line pillars,
wherein each bit-line pillar of said plurality of bit-line pillars is directly connected to a plurality of said source or said drain,
wherein said bit-line pillars are vertically oriented,
wherein said channel is horizontally oriented, and
wherein at least one of said plurality of said memory cells comprise a tunneling oxide thinner than 1 nm.
16. The device according to claim 15 ,
wherein each memory cell of said plurality of memory cells comprises a charge trap memory,
wherein said channel comprises polysilicon,
wherein said source and/or said drain comprises metal atoms, and
wherein said metal atoms enable hot electron programming of said charge trap memory.
17. The device according to claim 15 ,
wherein each of said memory transistors is directly connected to at least one of said bit-line pillars.
18. The device according to claim 15 ,
wherein said plurality of memory cells comprise a partially or fully metalized source, and/or a partially or fully metalized drain.
19. The device according to claim 15 ,
wherein said channel comprises crystallized polysilicon.
20. The device according to claim 15 ,
wherein said at least one memory transistor is self-aligned to an overlaying another said at least one memory transistor, both being processed following a same lithography step.