IP Library Granted Patent US 12,018,107
Granted Patent B2
US 12,018,107 · App. 17/515,253 · Granted Jun 25, 2024

Polymer material, composition, and method of manufacturing semiconductor device

Inventors: Koji Asakawa (Kawasaki Kanagawa, JP); Norikatsu Sasao (Kawasaki Kanagawa, JP); Shinobu Sugimura (Yokohama Kanagawa, JP)
Assignee: Kioxia Corporation
C08F220/14C08L33/10G03F7/038G03F7/039H01L21/0273H01L21/31116H01L21/31144C08L2203/20G03F7/162G03F7/168G03F7/2006H10B41/27H10B43/27
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Quick Facts
Patent No.
US 12,018,107
App. No.
17/515,253
Granted
Jun 25, 2024
Kind
B2
Abstract

According to one embodiment, a polymer material is disclosed. The polymer material contains a polymer. The polymer contains a first monomer unit having a lone pair and an aromatic ring at a side chain, and a second monomer unit including a crosslinking group at a terminal of the side chain, with its molar ratio of 0.5 mol % to 10 mol % to all monomer units in the polymer. The polymer material can be used for manufacturing a composite film as a mask pattern for processing a target film on a substrate. The composite film can be formed by a process including, forming an organic film on the target film with the polymer material, patterning the organic film, and forming the composite film by impregnating a metal compound into the patterned organic film.

Claims (25)

1. A method of manufacturing a semiconductor device, comprising:

forming an organic film on a target film on a semiconductor substrate with a polymer material;

patterning the organic film;

forming a mask pattern composed of a composite film by impregnating a metal compound into the patterned organic film; and

processing the target film by using the mask pattern, wherein

the polymer material contains a polymer containing a first monomer unit having a lone pair and an aromatic ring at a side chain, and

the metal compound is impregnated into the patterned organic film with 10 atom % or more as a metal amount.

2. The method according to claim 1 , wherein

a main component monomer of the polymer is a (meth)acrylate, and

a component monomer of the first monomer unit is an aromatic compound derivative of a (meth)acrylic acid.

3. The method according to claim 1 , wherein

the first monomer unit has two or more lone pair at a side chain.

4. The method according to claim 1 , wherein

the polymer contains a second monomer unit including a crosslinking group at a terminal of the side chain, with its molar ratio of 0.5 mol % to 10 mol % to all monomer units in the polymer.

5. The method according to claim 4 , wherein

the crosslinking group includes a glycidyl group.

6. The method according to claim 5 , wherein

the polymer contains a third monomer unit including a group formable a carboxyl group due to heating or light irradiation at the terminal of the side chain.

7. The method according to claim 4 , wherein

a molar ratio of the first monomer unit to all monomer units in the polymer is 30 mol % to 99.5 mol %.

8. The method according to claim 6 , wherein

a molar ratio of the third monomer unit to all monomer units in the polymer is 0.2 mol % to 50 mol %, and

a molar ratio of the first monomer unit to all monomer units in the polymer is 49.5 mol % to 99.3 mol %.

9. The method according to claim 1 , wherein

the first monomer unit has the lone pair contained in a ester bond (—COO—), a cyano group (—C≡N), a pyridine skeleton, and an amino group (—NH 2 ).

Assignments (1)
CHANGE OF NAME Recorded Feb 2, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058950/0398 →
Priority Claims (1)
JP 2019-044104 · Mar 11, 2019 · national
Continuity (2)
Division 16562786 · Sep 6, 2019
Related Publication 20220049036A1 · Feb 17, 2022